Thermal resistance studies of surface modified heat sink for 3W LED using transient curve

Abstract

Purpose

Surface configuration at the interface between two materials makes a huge difference on thermal resistance. Thermal transient analysis is a powerful tool for thermal characterization of complex structures like LEDs. The purpose of this paper is to report the influence of surface finish on thermal resistance.

Design/methodology/approach

Surface of heat sink was modified into two categories: machined as channel like structure; and polished using mechanical polisher and tested with 3W green LED for thermal resistance analysis.

Findings

The observed surface roughness of rough and polished surface was 44 nm and 4 nm, respectively. Structure function analysis was used to determine the thermal resistance between heat sink and MCPCB board. The observed thermal resistance from junction to ambient (R_thJA) value measured with thermal paste at 700 mA was lower (34.85 K/W) for channel like surface than rough surface (36.5 K/W). The calculated junction temperature (T_J) for channel like surface and polished surface was 81.29°C and 85.24°C, respectively.

Research limitations/implications

Channelled surface aids in increasing bond line thickness. Surface polishing helps to reduce the air gaps between MCPCB and heat sink and also to increase the surface contact conductance.

Practical implications

The proposed method of surface modification can be easily done at laboratory level with locally available techniques.

Originality/value

Much of the available literature is only concentrating on the design modification and heat transfer from fins to ambient. There was little research on modification of top surface of the heat sink and the proposed concept would give good results and also it will make the material cost reduction as well as material too.

Citation

Subramani, S., Nadarajah, T. and Devarajan, M. (2013), "Thermal resistance studies of surface modified heat sink for 3W LED using transient curve", Microelectronics International, Vol. 30 No. 2, pp. 77-84. https://doi.org/10.1108/13565361311314467