Hybrid materials based on functionalised epoxy resin networks

Abstract

Purpose

The purpose of this paper is to describe how sol‐gel synthesised silica particles are used to modify the characteristics (especially the thermal and mechanical properties) of either an epoxy resin (ER) or a −COOH‐functionalised ER (FER) substrate. In the systems studied here, spherical silica particles are embedded in ER or FER thermosetting polymeric substrates for producing translucent solid materials. There arise covalent unions between the SiO₂ silanol surface groups of the particles and the functionalised FER ends, thus rendering SiO₂‐FER core‐shell compounds.

Design/methodology/approach

The characterisation results confirm the affinity existing between ER and SiO₂ particles as well as the existence of chemical bonds at the interface between the silica and FER phases.

Findings

An efficient and durable application against corrosion of metallic materials has been developed through the preparation and application of thin surface films made of finely disseminated SiO₂ colloidal particles, which are trapped inside either FER or unfunctionalised ER epoxy resin polymer networks. The results of this test indicate that the anticorrosive performances of FER, SiO₂‐ER and SiO₂‐FER coating films are higher than that related to the ER coating alone.

Practical implications

These silica/ER hybrid materials can be employed as anticorrosive coatings of metallic substrates in commercial appliances, industrial devices and protection of artistic works, such as metal sculptures.

Originality/value

Preparation of organic‐inorganic hybrid materials of enhanced thermal and mechanical properties against corrosion. Functionalisation of an ER polymer network resulted in the improvement of the anticorrosive properties of the sole ER of departure while showing very good corrosion endurance.

Citation

Hernández‐Padrón, G., Garcia‐Garduño, M. and Rojas‐González, F. (2010), "Hybrid materials based on functionalised epoxy resin networks", Pigment & Resin Technology, Vol. 39 No. 4, pp. 195-202. https://doi.org/10.1108/03699421011055491