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Drawing on social cognitive theory, this study aims to examine the relationship between supervisor developmental feedback and employee innovative behavior, incorporating with the mediating role of psychological safety and the moderating role of face orientation.

A survey was conducted in 15 manufacturing companies in China. The participants comprised 302 employees. Hierarchical regression analysis was used to test the hypotheses. The mediating effects and the moderated mediating effects are further examined with bias-corrected bootstrapping method.

Supervisor developmental feedback has a positive effect on employee innovative behavior through psychological safety, and this mediating effect is weakened by protective face orientation (fear of losing face), while the moderating effect of acquisitive face orientation (desire to gain face) is not significant.

Organizations should create a development-oriented and safe innovation atmosphere for employees. In addition, leaders should adopt differentiated feedback and communication methods according to subordinates' face orientation.

The study has demonstrated the positive effect of supervisor developmental feedback on employee innovative behavior, which is different from previous studies on performance feedback and leadership types. Meanwhile, this study has also explored the mediating effect of psychological safety and the moderating effect of face orientation, which provides more insights on the mechanism and boundary conditions of the effect of supervisor developmental feedback.

The purpose of this paper is to examine the relationship between inclusive leadership and employee work engagement by identifying person-job fit as a mediator, and employee felt responsibility as a moderator.

Employing a two-wave survey from 261 employees across various industries in China, the study tests hypotheses using hierarchical regression analysis with the PROCESS procedure developed by Hayes.

The results show that inclusive leadership is positively related to employee work engagement through person-job fit. The results further demonstrate that employees’ felt responsibility moderates the positive direct relationship between inclusive leadership and person-job fit as well as the indirect relationship between inclusive leadership and work engagement via person-job fit.

Although two-wave data were used to test the model, issues of common method bias cannot be excluded because the data were collected from a single source (the employee).

Organizations should promote and develop inclusive leaders in the workplace to enhance employee work engagement, and pay attention to employees' felt responsibility for their work to ensure effectiveness of inclusive leadership.

Integrating social information processing theory and person-environment fit theory, this study enriches the theoretical foundation of inclusive leadership scholarship. This study deepens the understanding of the mechanism underlying the link between inclusive leadership and work engagement, as well as an important boundary condition of this relationship, by examining the mediating role of person-job fit and the moderating role of felt responsibility.

Surface mount technology (SMT) is widely used and plays an important role in electronic equipment. The purpose of this paper is to reveal the effects of interface cracks on the fatigue life of SMT solder joint under service load and to provide some valuable reference information for improving service reliability of SMT packages.

A 3D geometric model of SMT package is established. The mechanical properties of SMT solder joint under thermal cycling load and random vibration load were solved by 3D finite element analysis. The fatigue life of SMT solder joint under different loads can be calculated by using the modified Coffin–Manson model and high-cycle fatigue model.

The results revealed that cracks at different locations and propagation directions have different effect on the fatigue life of the SMT solder joint. From the location of the cracks, Crack 1 has the most significant impact on the thermal fatigue life of the solder joint. Under the same thermal cycling conditions, its life has decreased by 46.98%, followed by Crack 2, Crack 4 and Crack 3. On the other hand, under the same random vibration load, Crack 4 has the most significant impact on the solder joint fatigue life, reducing its life by 81.39%, followed by Crack 1, Crack 3 and Crack 2. From the crack propagation direction, with the increase of crack depth, the thermal fatigue life of the SMT solder joint decreases sharply at first and then continues to decline almost linearly. The random vibration fatigue life of the solder joint decreases continuously with the increase of crack depth. From the crack depth of 0.01 mm to 0.05 mm, the random vibration fatigue life decreases by 86.75%. When the crack width increases, the thermal and random vibration fatigue life of the solder joint decreases almost linearly.

This paper investigates the effects of interface cracks on the fatigue life and provides useful information on the reliability of SMT packages.