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This study aims to examine the relationships among open innovation, organizational ambidexterity and firm performance. One important aspect of open innovation is that it enables a firm to develop its organizational ambidexterity capability and become more efficient in using this capability to improve its performance.

The authors introduce a moderated mediation theoretical framework to reveal the bridging role of organizational ambidexterity in the effect of open innovation on firm performance. The theoretical model is empirically validated using survey data from 215 high-tech firms.

The authors find that open innovation plays a moderating role in the relationship between organizational ambidexterity and firm performance. Furthermore, organizational ambidexterity plays a significant mediating role in the relationship between open innovation and firm performance, and open innovation has a nonlinear, inverse U-shaped moderation effect on the relationship between organizational ambidexterity and firm performance.

This is one of the first studies to undertake a moderated mediation analysis by highlighting the mediating role of organizational ambidexterity and the moderating role of open innovation in influencing firm performance. The authors make a theoretical contribution to the field of open innovation and organizational behavior, and the authors provide concrete and feasible decision-making suggestions to decision makers adopting open innovation.

The empirical results can help high-tech firm managers ascertain the organizational ambidexterity practices that can be employed and determine the level of open innovation to enhance firm performance.

This research provides new insights into whether and how firms can grasp the benefits of organizational ambidexterity to undertake open innovation activities. The findings not only contribute to advancing the mediating effect of organizational ambidexterity but also verify the inverse U-shaped moderation of open innovation in the relationship between organizational ambidexterity and firm performance.

With continuous concerning on the toxic of element Pb, Pb-free solder was gradually used to replace traditional Sn-Pb solder. However, during the transition period from Sn-Pb to Pb-free solder, mixing of Sn-Pb and Pb-free is inevitable occurred in certain products, and in China where Sn-Pb solder was still used extensively in certain areas especially. Correspondingly, understanding reliability of Sn-Pb solder joints was very important, and further studies were needed.

Thermal shock test between −55°C and 125 °C was conducted on Sn-37Pb solder bumps in the BGA package to investigate the microstructure evolution and the growth mechanism of interfacial intermetallic compound (IMC) layer. The effects of thermal shock on the mechanical property and fracture behavior of Sn-37Pb solder bumps were discussed.

Pb-rich phase was coarsened and voids were increased at first; Pb-rich phase was refined and voids were decreased secondly with the increase of thermal shock cycles; the shear strength of solder bumps was slightly decreased after thermal shock, but was back up to 73.67MPa at 2,000 cycles; interfacial IMCs of solder bumps was from typical scallop-type into smooth, the composition of IMCs was from Cu₆Sn₅ into Cu₆Sn₅ and Cu₃S_n after thermal shock with 1,500 and 2,000 cycles; 20.0 per cent of solder bumps at 1,500 cycles and 9.5 per cent of solder bumps at 2,000 cycles were failure respectively.

Compared with the board level test method, the impact shear test for the single solder bump is more convenient and economical and is actively pursued by the industries. The shear strength of solder bumps was slightly decreased after thermal shock, but was back up to 73.67 MPa at 2,000 cycles; 20.0 per cent of solder bumps at 1,500 cycles and 9.5 per cent of solder bumps at 2,000 cycles were failure.

The impact strength of solder joint under high strain rate was evaluated by board level test method. However, the impact shear test of single solder bump was more convenient and economical than the board level test method. With the miniaturization of solder joints, solder joints were more prone to failure under thermal shock and more attention has been paid to the impact reliability of solder joint. But Pb-free solder joints may be paid too much attention and Sn-Pb solder joints may be ignored.

In this study, thermal shock test between −55°C and 125°C was conducted on Sn-37Pb solder bumps in the BGA package to investigate microstructural evolution and growth mechanism of interfacial intermetallic compounds (IMCs) layer. The effects of thermal shock and ball diameter on the mechanical property and fracture behavior of Sn-37Pb solder bumps were discussed.

With the increase of ball size, the same change tendency of shear strength with thermal shock cycles. The shear strength of the solder bumps was the highest after reflow; with the increase of the number of thermal shocks, the shear strength of the solder bumps was decreased. But at the time of 2,000 cycles, the shear strength was increased to the initial strength. Minimum shear strength almost took place at 1,500 cycles in all solder bumps. The differences between maximum shear strength and minimum shear strength were 9.11 MPa and 16.83 MPa, 17.07 MPa and 15.59 MPa in φ0.3 mm and φ0.4 mm, φ0.5 mm and φ0.6 mm, respectively, differences were increased with increasing of ball size. With similar reflow profile, the thickness of IMC decreased as the diameter of the ball increased. The thickness of IMC was 2.42 µm and 2.17 µm, 1.63 µm and 1.77 µm with increasing of the ball size, respectively.

Pb-free solder was gradually used to replace traditional Sn-Pb solder and has been widely used in industry. Nevertheless, some products inevitably used a mixture of Sn-Pb and Pb-free solder to make the transition from Sn-Pb to Pb-free solder. Therefore, it was very important to understand the reliability of Sn-Pb solder joint and more further research works were also needed.

The purpose of this paper is to accomplish the low cost mass‐production of flexible radio frequency identification (RFID) tag inlays.

An anisotropic conductive paste (ACP) is prepared by mixing uniform micro‐sized spherical conductive particles, latent curing agent and other additives into a thermoset epoxy resin. RFID tag inlays are assembled with the paste through flip‐chip technology. The microstructural analysis of bonded joints, bond strength testing, and high‐temperature and humidity aging testing are employed to evaluate the performance of the inlays.

It was found that the chips are hard assembled on the antennae by the ACP. Flexible RFID tag inlays assembled using the presented method have good reliability when working under high frequency (13.56 MHz) conditions.

The method presented is a promising new way for packaging flexible RFID tag inlays with ACP. Through the use of flip‐chip technology, large‐scale production is possible with low manufacturing costs.

The paper details a simple way to prepare an anisotropic conductive paste and to assemble flexible RFID tag inlays. The technique uses flip‐chip technology with the paste as the electrical and mechanical interconnection material. It presents a simple and fast method of assembly for flexible RFID tag inlays on a large‐scale with low cost.

The purpose of this paper is to compare the sensing characteristics of uniform fiber Bragg grating (FBG) and tilted fiber Bragg grating (TFBG) by presenting a detailed research review. Temperature, axial strain, bending, vibration and refractive index measurands of FBG and TFBG sensor are presented and some significant differences are found.

Theoretical analysis and practical application in engineering are investigated and compared from other authors' research papers and self analysis. Spectra behavior of both FBG and TFBG are discussed.

There are found to be significant differences in temperature, axial strain, bending, vibration and refractive index sensing characteristics of FBG and TFBG.

The paper's analysis is comprehensive and clear and provides readers with the sensing characteristics of FBG and TFBG in detail.