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The purpose of this paper is to use a stochastic dominance test to examine the relative performance of value vs growth stocks based on multiple value-growth proxies in the Taiwan stock market.

This work examines whether the return distribution of a value portfolio stochastically dominates that of a growth portfolio using a test proposed by Linton et al. (2005).

By applying stochastic dominance analysis on the full-sample period, the sub-sample period and the state of the world’s economic conditions, the authors find that the earnings-to-price or dividend-to-price ratio is better than the book-to-market ratio as a value-growth proxy in Taiwan. There are robust results even after adjusting for data frequency, a sampling method and sample excluding financial services.

This study makes the first attempt to examine value vs growth strategies based on multiple value-growth proxies in the emerging market of Taiwan by administering the stochastic dominance test.

Non‐homogeneous Poisson process (NHPP) models, as the stochastic models frequently employed in reliability engineering, have been successfully used in the reliability study of software systems. The software reliability based on NHPP models was proposed by Goel and Okumoto. In general, the software reliability will increase along with the correction of the software errors. This idea gives rise to a hypothesis: extending the time on the software reliability test could result in obtaining a higher reliability. Nevertheless, the scheme was found to be discrepant for some NHPP models, which are utilized in the analysis. As this often occurs in practice, the reliability outcome could differ from its appropriate estimation when the test procedures are intentionally terminated prior to the end of the required testing time span. An “above average software reliability” is proposed in this paper to accomplish the inconsistency. Under the investigation of “average software reliability”, a higher software reliability can be achieved as long as the testing time increases. Also, in this paper, an optimal software release policy is proposed to explore the issue of compromising the expenses on software development and software reliability improvement.

This chapter aims to delineate the indigenous pattern of parental involvement in Taiwan by investigating the effects of specific practices in schools and in the family, such as school selection, school involvement, preparing a study place at home, and providing nutritious food.

We use two waves of data from the Taiwan Youth Project (2000, 2003) to examine how parental involvement varies between dual- and single-earner families, and we further demonstrate how sons and daughters have different access in terms of recognizing their parents’ effort, and how children’s subjective appraisals promote their academic performance with respect to test scores.

We find that dual-earner families have higher incomes, higher educational levels, and have fewer children than single-earner ones. Our multivariate analyses show that parental involvement does increase youngsters’ Basic Competence Test (BCT) score. However, we are unable to find any direct or indirect effects from parental employment status on BCT scores. Further analysis indicates that the relationship between parental school involvement and BCT score is only significant among dual-earner families, but not for the single-earner ones. In addition, our multiple group analysis reveals that sons’ BCT scores are affected more by parents’ school involvement, whereas daughters’ are affected more by special home provision. Our findings from adolescents’ subjective responses imply that sons may be more responsive to a non-familial context in contrast with daughters, who react more positively to familial provision.

By using ethnographic data and family interviews from eight families in Taipei, Taiwan, this paper aims to delineate how multigenerational families implement parents’ child-rearing values, and how these strategies vary by social class. The primary focus is the child’s mother and her relationship with other family members. I ask the following question: How does a mother in a three-generation family implement her ideal parenting values for her child while being encumbered by the constraints of her parents-in-law? Additionally, how does this intergenerational dynamic vary with family socioeconomic status? To conceptualize this process in such a complex context, I argue that we must understand parenting behaviors as acts of “doing family” and “intensive mothering.”

From 2008 to 2009, I conducted a pilot survey in two public elementary schools to recruit the parents of sixth-grade students. All eight cases of multigenerational families in this paper were selected randomly after being clustered by the parent’s highest education level and family income levels. This paper utilized the mothers’ interviews as the major source to analyze, while the interviews of other family members served as supplementary data.

Two cases, Mrs Lee and Mrs Su’s stories, were selected here to illustrate two distinctive approaches toward childrearing in multi-generational families. Results indicate that white-collar mothers in Taiwan hold the value of concerted cultivation and usually picture the concept of intensive mothering as their ideal image of parenthood. Yet, such an ideal and more westernized child-rearing philosophy often leads to tensions at home, particularly between the mother and the mother-in-law. Meanwhile, blue-collar mothers tend to collaborate with grandparents in sharing childcare responsibilities, and oftentimes experience friction over child discipline in terms of doing homework and material consumption.

Via this analysis of three-generation families in Taiwan, we are able to witness the struggle of contemporary motherhood in East Asia. This paper foregrounds the negotiations that these mothers undertake in defining ideal parenting and the ideal family. On the one hand, these mothers must encounter the new parenting culture, given that the cultural ideal of concerted cultivation has become a popular ideology. On the other hand, by playing the role of daughter-in-law, they must negotiate within the conventional, patriarchal family norms.

The impact strength of solder joint under high strain rate was evaluated by board level test method. However, the impact shear test of single solder bump was more convenient and economical than the board level test method. With the miniaturization of solder joints, solder joints were more prone to failure under thermal shock and more attention has been paid to the impact reliability of solder joint. But Pb-free solder joints may be paid too much attention and Sn-Pb solder joints may be ignored.

In this study, thermal shock test between −55°C and 125°C was conducted on Sn-37Pb solder bumps in the BGA package to investigate microstructural evolution and growth mechanism of interfacial intermetallic compounds (IMCs) layer. The effects of thermal shock and ball diameter on the mechanical property and fracture behavior of Sn-37Pb solder bumps were discussed.

With the increase of ball size, the same change tendency of shear strength with thermal shock cycles. The shear strength of the solder bumps was the highest after reflow; with the increase of the number of thermal shocks, the shear strength of the solder bumps was decreased. But at the time of 2,000 cycles, the shear strength was increased to the initial strength. Minimum shear strength almost took place at 1,500 cycles in all solder bumps. The differences between maximum shear strength and minimum shear strength were 9.11 MPa and 16.83 MPa, 17.07 MPa and 15.59 MPa in φ0.3 mm and φ0.4 mm, φ0.5 mm and φ0.6 mm, respectively, differences were increased with increasing of ball size. With similar reflow profile, the thickness of IMC decreased as the diameter of the ball increased. The thickness of IMC was 2.42 µm and 2.17 µm, 1.63 µm and 1.77 µm with increasing of the ball size, respectively.

Pb-free solder was gradually used to replace traditional Sn-Pb solder and has been widely used in industry. Nevertheless, some products inevitably used a mixture of Sn-Pb and Pb-free solder to make the transition from Sn-Pb to Pb-free solder. Therefore, it was very important to understand the reliability of Sn-Pb solder joint and more further research works were also needed.

With continuous concerning on the toxic of element Pb, Pb-free solder was gradually used to replace traditional Sn-Pb solder. However, during the transition period from Sn-Pb to Pb-free solder, mixing of Sn-Pb and Pb-free is inevitable occurred in certain products, and in China where Sn-Pb solder was still used extensively in certain areas especially. Correspondingly, understanding reliability of Sn-Pb solder joints was very important, and further studies were needed.

Thermal shock test between −55°C and 125 °C was conducted on Sn-37Pb solder bumps in the BGA package to investigate the microstructure evolution and the growth mechanism of interfacial intermetallic compound (IMC) layer. The effects of thermal shock on the mechanical property and fracture behavior of Sn-37Pb solder bumps were discussed.

Pb-rich phase was coarsened and voids were increased at first; Pb-rich phase was refined and voids were decreased secondly with the increase of thermal shock cycles; the shear strength of solder bumps was slightly decreased after thermal shock, but was back up to 73.67MPa at 2,000 cycles; interfacial IMCs of solder bumps was from typical scallop-type into smooth, the composition of IMCs was from Cu₆Sn₅ into Cu₆Sn₅ and Cu₃S_n after thermal shock with 1,500 and 2,000 cycles; 20.0 per cent of solder bumps at 1,500 cycles and 9.5 per cent of solder bumps at 2,000 cycles were failure respectively.

Compared with the board level test method, the impact shear test for the single solder bump is more convenient and economical and is actively pursued by the industries. The shear strength of solder bumps was slightly decreased after thermal shock, but was back up to 73.67 MPa at 2,000 cycles; 20.0 per cent of solder bumps at 1,500 cycles and 9.5 per cent of solder bumps at 2,000 cycles were failure.

This study aims to examine the relationships among open innovation, organizational ambidexterity and firm performance. One important aspect of open innovation is that it enables a firm to develop its organizational ambidexterity capability and become more efficient in using this capability to improve its performance.

The authors introduce a moderated mediation theoretical framework to reveal the bridging role of organizational ambidexterity in the effect of open innovation on firm performance. The theoretical model is empirically validated using survey data from 215 high-tech firms.

The authors find that open innovation plays a moderating role in the relationship between organizational ambidexterity and firm performance. Furthermore, organizational ambidexterity plays a significant mediating role in the relationship between open innovation and firm performance, and open innovation has a nonlinear, inverse U-shaped moderation effect on the relationship between organizational ambidexterity and firm performance.

This is one of the first studies to undertake a moderated mediation analysis by highlighting the mediating role of organizational ambidexterity and the moderating role of open innovation in influencing firm performance. The authors make a theoretical contribution to the field of open innovation and organizational behavior, and the authors provide concrete and feasible decision-making suggestions to decision makers adopting open innovation.

The empirical results can help high-tech firm managers ascertain the organizational ambidexterity practices that can be employed and determine the level of open innovation to enhance firm performance.

This research provides new insights into whether and how firms can grasp the benefits of organizational ambidexterity to undertake open innovation activities. The findings not only contribute to advancing the mediating effect of organizational ambidexterity but also verify the inverse U-shaped moderation of open innovation in the relationship between organizational ambidexterity and firm performance.

This study aims to empirically investigate whether the adoption of fair‐value‐accounting decreases the relevance of banks' capital adequacy ratios (CARs) in explaining insolvency risks. Additionally, how the disclosure quality affects the superiority of fair‐value‐based CARs over cost‐based CARs is also explored.

Using data from Taiwan banks from 2004 to 2010, the following tests are conducted. First, the insolvency risk is regressed on the reported CAR, along with the related interaction with the adoption of TFAS No. 34 to test the weakened relevance of CARs during the post‐TFAS No. 34 periods. Second, the relative relevance of fair‐value‐based CARs and cost‐based CARs is assessed using Vuong's Z‐statistic. Lastly, observations are partitioned into two groups – banks of higher and lower disclosure quality – to investigate whether fair‐value‐based CARs is superior (inferior) to cost‐based CARs for banks with higher (lower) disclosure quality.

First, adopting TFAS No. 34 reduces the relevance of CARs in explaining banks' insolvency risks. Second, fair‐value‐based CARs are superior to cost‐based ones in relation to insolvency risks only for banks of higher disclosure quality.

This study is the first to fill the empirical gap by demonstrating that the ability of CARs to explain the insolvency risk is adversely influenced by the adoption of fair value accounting. In particular, the results shed some light on the move toward fair‐value accounting, and may be interpreted that adopting fair‐value reporting is not flawless, drawing attention to the potential information loss in abandoning historical‐cost‐based regimes. Moreover, because the application of fair‐value accounting in the Taiwan banking industry is fairly similar to that of international or US GAAP, these results also yield insights into other standard‐setters.

An increasing number of users join and become immersed in WeChat official accounts, but many users quit using these services as well. Nevertheless, most of the previous studies mainly focussed on the usage behavior. The purpose of this paper is to fill the gap by examining factors affecting users’ unfollow intentions for WeChat subscriptions in a Chinese context.

Structural equation modeling is used in our study. A field survey with 260 WeChat users is conducted to test the research model and hypotheses.

The results show the following interesting key findings: first, the effect of actual cost on users’ unfollow intentions is larger than the effect of opportunity cost; second, users’ unfollow intentions will decrease with the increase of users’ perceptions of information usefulness; third, the results of the control variables showed that only landing frequency has a negative effect on users’ unfollow intentions; and fourth, users’ demographic differences are also examined in regard to how they may affect users’ unfollow intentions.

First, this paper studies factors influencing users’ unfollow intentions for WeChat subscriptions from a social exchange theory perspective; the authors considered both extraneous factors and users’ internal perception factors potentially affecting users’ unfollow intentions, which has rarely been researched. Furthermore, the authors examined significant differences among users’ demographic characteristics in affecting users’ unfollow intentions. The results of the study provide a more comprehensive understanding of the influencing factors of users’ unfollow intentions.

The purpose of this paper is to compare the sensing characteristics of uniform fiber Bragg grating (FBG) and tilted fiber Bragg grating (TFBG) by presenting a detailed research review. Temperature, axial strain, bending, vibration and refractive index measurands of FBG and TFBG sensor are presented and some significant differences are found.

Theoretical analysis and practical application in engineering are investigated and compared from other authors' research papers and self analysis. Spectra behavior of both FBG and TFBG are discussed.

There are found to be significant differences in temperature, axial strain, bending, vibration and refractive index sensing characteristics of FBG and TFBG.

The paper's analysis is comprehensive and clear and provides readers with the sensing characteristics of FBG and TFBG in detail.