Search results

Considering the popularity and addictive attributes of microblogging, the purpose of this paper is to explore the key drivers of the microblogging addiction tendency, and to investigate the causal relationship between microblogging usage and addiction tendency through the lens of the uses and gratifications (U&G) theory.

By extending the U&G theory to accommodate the negative consequences of gratification, a research model that explains the relationships among microblogging use, gratification and addiction tendency was developed and empirically examined based on the data collected from 520 microblogging users in China.

The results showed that different types of microblogging use lead to different categories of gratification to different extents, while different categories of gratification play different roles in determining the level of addiction tendency. Specifically, the effect of content gratification on addiction is marginal, while social gratification has significant effects on all dimensions of addiction tendency.

The present study has both theoretical and practical implications. From a theoretical perspective, unlike many previous studies applied the U&G theory to explore the positive outcomes of media uses, this paper extends the U&G by including addiction tendency as a negative psychological outcome of U&G., resulting a research framework (use-gratification-addiction framework). Meanwhile, this paper contributes to the extending literature by examining the constructs of U&G at a granular level and investigated the causal relationship between “uses” and “gratifications.”

The purpose of this paper is to investigate the effects of minor addition of the rare earth (RE) element cerium, Ce, on the microstructures and creep properties of Sn-Ag-Cu solder alloys.

The pure Sn, Sn-Cu alloy, Sn-Ag alloy and Cu-Ce alloy were used as raw materials. Sn-Ag-Cu alloys with different contents of RE Ce were chosen to compare with Sn-Ag-Cu. The raw materials of Sn, Sn-Cu alloy, Sn-Ag alloy, Cu-Ce alloy were melted in a ceramic crucible, and were melted at 550°C ± 1°C for 40 minutes. To homogenize the solder alloy, mechanical stirring was performed every ten minutes using a glass rod. During the melting, KC1 + LiCI (1.3:1), were used over the surface of liquid solder to prevent oxidation. The melted solder was chill cast into a rod.

It is found that the microstructure exhibits smaller grains and the Ag₃Sn/Cu₆Sn₅ intermetallic compound (IMC) phases are modified in matrix with the addition of Ce. In particular, the addition of 0.03 wt.% Ce to the Sn-Ag-Cu solder can refine the microstructures and decrease the thickness of the IMC layers of Sn-Ag-Cu solder alloys. Meanwhile, thermodynamic analysis showed that these phenomena could be attributed to the reduction of the driving force for Cu-Sn IMC formation due to the addition of Ce. Results calculated using the thermodynamic method are close to the above experimental data. Thus, the optimum content of Ce in Sn-Ag-Cu solder alloys should be about 0.030 percent. Additionally, the effect of Ce on the creep rupture life of Sn-Ag-Cu soldered joints was studied. It was found that the creep rupture life may be increased up to 7.5 times more than that of the original Sn-Ag-Cu alloy, when Ce accounts for 0.030 percent.

This paper usefully investigates the effects of the RE cerium (Ce), on the microstructures and creep properties of Sn-Ag-Cu solder alloys, optimizing the quantity of Ce in the Sn-Ag-Cu solder alloy through a thermodynamic method and by creep-rupture life testing.

In order to accurately forecast nonlinear and complex characteristics of solar power generation in China, a novel discrete grey model with time-delayed power term (abbreviated as TDDGM(1,1,tα) is proposed in this paper.

Firstly, the time response function is deduced by using mathematical induction, which overcomes the defects of the traditional grey model. Then, the genetic algorithm is employed to determine the optimal nonlinear parameter to improve the flexibility and adaptability of the model. Finally, two real cases of installed solar capacity forecasting are given to verify the proposed model, showing its remarkable superiority over seven existing grey models.

Given the reliability and superiority of the model, the model TDDGM(1,1,tα) is applied to forecast the development trend of China's solar power generation in the coming years. The results show that the proposed model has higher prediction accuracy than the comparison models.

This paper provides a scientific and efficient method for forecasting solar power generation in China with nonlinear and complex characteristics. The forecast results can provide data support for government departments to formulate solar industry development policies.

The main contribution of this paper is to propose a novel discrete grey model with time-delayed power term, which can handle nonlinear and complex time series more effectively. In addition, the genetic algorithm is employed to search for optimal parameters, which improves the prediction accuracy of the model.

The averaged Navier‐Stokes and the k‐e turbulence model equations are used to simulate turbulent flows in some internal flow cases. The discrete equations are solved by different variations of Multigrid methods. These include both steady state as well as time dependent solvers. Locally refined grids can be added dynamically in all cases. The Multigrid schemes result in fast convergence rates, whereas local grid refinements allow improved accuracy with rational increase in problem size. The applications of the solver to a 3‐D (cold) furnace model and to the simulation of the flow in a wind tunnel past an object prove the efficiency of the Multigrid scheme with local grid refinement.

The purpose of this paper is to derive the relationship between color schemes and emotion to serve for designers and consumers.

The three attributes of hue, brightness and saturation of the selected sample color are analyzed, and the Semantic Differential (SD) method is used for the emotional evaluation of color schemes, and data obtained from the emotional evaluation of color schemes is analyzed by using Excel software for mean statistics and SPSS software for factor analysis and cluster analysis.

From the results of the factor analysis, three main factors that affect the feeling of the color scheme can be extracted: “personality”, “gender” and “fashion”. Color emotions can be achieved by changing the level of color saturation and brightness, the cold and warmth of the hue and the way of color combination.

Since it takes a long time to fill out the questionnaire, the number of valid questionnaires collected is a little less and the research data is limited. In addition, some problems are not taken into account such as geography and so on, so the results of the statistical analysis are not very precise and further research is needed.

It can provide information of emotional color schemes for designers and consumers, and based on the SD method, an emotional color matching questionnaire is designed and statistical analysis is conducted to establish the relationship between emotion and color schemes.

Based on the fashion color sample and color harmony theory, the color matching rules and color matching schemes are designed independently.

The purpose of this paper is to investigate the laser soldering of fine pitch quad flat package (QFP) devices using lead‐free solders and solder joint reliability during thermal cycling.

QFP devices were selected as the test vehicles and were soldered with four alloy types, Sn37Pb, Sn3.5Ag, Sn3.8Ag0.7Cu and Sn3.8Ag0.7Cu0.03Ce. The experimental samples were QFP‐256 devices with lead‐free solder paste on the printed circuit boards. The packages were dried for 24 h at 125°C prior to reflow soldering. Soldering experiments on the QFP devices were carried out with an infrared (IR) reflow soldering oven and a diode laser (DL) soldering system. Reflow soldering was performed at peak temperatures of 210°C (SnPb), 240°C (SnAgCu and SnAgCuCe) and 250°C (SnAg), as determined on the boards. Pull testing was adopted to evaluate the tensile strength of the four solders using an STR–1000 micro‐joint strength tester.

The tensile force of the QFP micro‐joints increased as laser intensity increased when it was less than an “optimal” value. The maximum tensile force of the QFP micro‐joints was gained when the laser intensity had increased to 2,165, 2,127, 2,165 and 2,064 W/cm², depending on the alloy used. The thermal fatigue performance of three lead‐free solder joints, SnAgCuCe, SnAgCu and SnAg, was determined to be superior to that of the eutectic SnPb alloy. After soldering without thermal cycling tests, the fracture morphology of soldered joints exhibited characteristic toughness fracture with both of the soldering methods. After 700 thermal cycles, the fracture mechanism was also toughness fracture, nevertheless, the dimples became large. The fracture morphology of the soldered joints subjected to 1,500 thermal cycles indicated brittle intergranular fracture on the fracture surface and no intense plastic deformation appeared before fracture with IR soldering. For DL soldering, the pull fracture model of the SnAgCuCe was completely ductile in the soldered joint with 1,500 thermal cycles.

The paper usefully investigates the influence of laser intensity on the tensile strength of different soldered joints and the solder joint reliability during thermal cycling.

The purpose of this paper is to investigate the influence of praseodymium (Pr) additions (0, 0.05 and 0.5 wt%) on the mechanical properties and microstructure of SnAgCu solder joint during aging process. Moreover, the authors aim to indicate that the decreased soldification undercooling of Sn3.8Ag0.7Cu solder can suppress the formation of Ag3Sn plate to some extent.

The shear strength evolution of SAC, SAC‐0.05Pr and SAC‐0.5Pr solder joint were studied under 150°C aging process with STR‐1000. The effect of Pr additions on the solidification behavior of SnAgCu solder was also studied by differential scanning calorimetry. To study the microstructure evolution, the cross‐sections of all specimens were observed by means of scanning electron microscope (SEM) and energy dispersive spectroscopy (EDS). Meanwhile, the etchant, consisting of 20%HNO3+distilled water was used for deep etching to reveal the interfacial morphology.

The shear force reduction rate of SAC solder joint during aging was restrained by 0.05%Pr addition but promoted with 0.5% Pr addition. The growth of IMC layer of SnAgCu joint in the aging process was suppressed significantly by different amounts of Pr additions. However, the beneficial effect of Pr addition due to the suppression of IMC layer growth was weakened by the micro‐cracks formed in PrSn3 compounds in SnAgCu‐0.5Pr joint. Pr additions (0.05, 0.5 wt%) decrease the solidification undercooling of SnAgCu solder, which will suppress the formation of Ag3Sn plate to some extent.

Further studies are necessary for confirmation of the practical application, especially of the manufacturing technology of solder paste containing Pr.

The appropriate amount of Pr in Sn3.8Ag0.7Cu solder is about 0.05 wt%. It is found that SAC‐0.05Pr solder has an improvement in solder joint reliability in long aging processes. The results suggested the novel solder alloys can meet the requirements of high reliability application.

The paper demonstrates that: Pr additions promote the solidification of SAC solder; shear force reduction rate of SAC solder joint was reduced by 0.05%Pr addition; the IMC layer growth rate of SnAgCu solder joint was suppressed by Pr additions; and micro‐cracks were found in PrSn3 phases after aging.

The purpose of this paper is to explore the formation and growth mechanism of bulk Cu₆Sn₅ intermetallic compounds, selecting Sn‐Ag‐Cu‐Ce solders as specimens.

In order to further enhance the properties of SnAgCu solder, trace amount of rare earth Ce was selected as alloying addition into the alloy; in previous investigations, the enhancements include better wettability, physical properties, creep strength and tensile strength. In this paper, the microstructure of Sn‐Ag‐Cu‐Ce soldered joints and its interfacial intermetallic compounds were investigated. Moreover, different morphologies of Cu₆Sn₅ IMCs were enumerated and described, and Ostwald ripening theory was employed to interpret the formation mechanism of bulk Cu₆Sn₅ IMCs.

In addition, based on finite element simulation, it is found that the von Mises stress concentrate around the bulk Cu₆Sn₅ IMCs inside the Sn‐Ag‐Cu‐Ce soldered joints after three thermal cycling loading (−55‐125°C). From the stress distribution, the failure site was predicted to fracture near the bulk Cu₆Sn₅ IMCs interface. This coincides with the experimental findings significantly.

The results presented in this paper may provide a theory guide for developing novel lead‐free solders as well as reliability investigation of lead‐free soldered joints.

The purpose of this paper is to analyze the reason for Chinese local officials' enthusiasm towards cultivating newly listed firms within their jurisdictions.

With new initial public offering (IPO) firms on the Chinese A‐share market over 1999‐2003 as samples, and using excessive employment as a measure of the carrying level of firms for political objectives of local governments, this study systematically investigates the change in policy burden for Chines firms before and after going public, the influence factors and their economic consequences.

The authors show that compared with before going public, the excessive employment of firms substantially increased upon going public, among which firms, state‐owned enterprises with better performances and private enterprises with closer links with government are heavier burdened with excessive employment. Furthermore, it was found that the increase in excessive employment upon going public can substantially aggravate the underperformance of IPO firms.

The findings in this study indicate that the new IPO firms do help local officials better realize their political objectives, and the local governments do actively use their rights of control or influence in pursuing their political appeals, and the political appeals of local officials brought loss of real economic efficiency to newly increased IPO firms.

This paper shows that the prime mover of Chinese local government in promoting securitization of local assets is effectively preserved by partial privatization, which is designed with the original intention of preserving governmental control over the economy.

The paper explains the Chinese local governments' enthusiasm for building capital provinces for reasons other than economic growth, i.e. political objectives; the paper provides evidence of how the political appeals of officials influence the capital market from the circumstance of government official selecting system, and builds a possible bridge in the relationship between government interventions and underperformance of the Chinese partially‐privatized firms.