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Article
Publication date: 7 December 2021

Le Tao, Yun Su and Xiuqi Fang

The intended nationally determined contributions (INDCs) is a major outcome of the Paris Agreement on international cooperation to reduce emissions, and is likely to be the future…

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Abstract

Purpose

The intended nationally determined contributions (INDCs) is a major outcome of the Paris Agreement on international cooperation to reduce emissions, and is likely to be the future scenario for carbon emissions. This paper aims to obtain the fine spatial pattern of carbon emissions in 2030, identify hot spots and analyze changes of carbon emissions with a spatial grid method.

Design/methodology/approach

Based on the integrated quantified INDCs of each economy in 2030, the authors predict the population density pattern in 2030 by using the statistics of current population density, natural growth rates and differences in population growth resulting from urbanization within countries. Then the authors regard population density as a comprehensive socioeconomic indicator for the top-bottom allocation of the INDC data to a 0.1° × 0.1° grid. Then, the grid spatial pattern of carbon emissions in 2030 is compared with that in 2016.

Findings

Under the unconditional and conditional scenarios, the global carbon emission grid values in 2030 will be within [0, 59,200.911] ktCO2 and [0, 51,800.942] ktCO2, respectively; eastern China, northern India, Western Europe and North America will continue to be the major emitters; grid carbon emissions will increase in most parts of the world compared to 2016, especially in densely populated areas.

Originality/value

While many studies have explored the overall global carbon emissions or warming under the INDC scenario, attention to spatial details is also required to help us make better emissions attributions and policy decisions from the perspective of the grid unit rather than the administrative unit.

Details

International Journal of Climate Change Strategies and Management, vol. 14 no. 1
Type: Research Article
ISSN: 1756-8692

Keywords

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Article
Publication date: 23 August 2021

Xiuqi Wang, Fenglian Sun, Bangyao Han, Yilun Cao, Jinyang Du, Long Shao and Guohuai Liu

The purpose of this paper is to investigate the wetting behaviors of Sn-5Sb-CuNiAg solders on copper substrates in different soldering processes and the effects of alloying…

176

Abstract

Purpose

The purpose of this paper is to investigate the wetting behaviors of Sn-5Sb-CuNiAg solders on copper substrates in different soldering processes and the effects of alloying elements on the wettability.

Design/methodology/approach

Sn-5Sb-CuNiAg solder balls (750 µm in diameter) were spread and wetted on 40 × 40 × 1 mm copper plates, in different fluxes, soldering temperatures and time. The contact angles were obtained by a home-made measuring instrument. The samples were polished and deep etched before analyzed by scanning electron microscopy. Energy dispersive X-ray spectroscopy was used to identify the composition of the joints.

Findings

The effects of different soldering processes and alloying elements on the wetting behaviors of Sn-5Sb-CuNiAg solders on copper substrates were calculated and expounded. The rosin-based flux could effectively remove oxidation layers and improve the wettability of Sn-5Sb-CuNiAg solders. Then with the increase of soldering temperature and time, the contact angles decreased gradually. The soldering processes suited for Sn-5Sb-CuNiAg solders were RMA218, 280°C and 30 s. Considered the effects of alloying elements, the wettability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag was relatively favorable on copper substrates. Besides, Ni could accumulate at the solder/Cu interface and form a jagged (Cu,Ni)6Sn5 IMC.

Originality/value

This work was carried out with our handmade experiment equipment and the production of the quinary lead-free solder alloy used in wetting tests belongs to us. The investigated Sn-5Sb-CuNiAg alloys exhibited higher melting point and preferable wettability, that was one of the candidates for high-temperature lead-free solders to replace high-Pb solders, and applied extremely to high temperature and frequency working environments of the third-generation semiconductors components, with a greater potential research and development value.

Details

Soldering & Surface Mount Technology, vol. 34 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

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