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The purpose of this study is to investigate the dynamics of capillary underfill flow (CUF) in flip-chip packaging, particularly in a multi-chip configuration. The study aims to understand how various parameters, such as chip-to-chip spacing (S12), chip thickness (tc) and others, affect the underfill flow process. By using computational fluid dynamics (CFD) simulations and experimental studies, the goal is to provide insights into understanding the dynamics of CUF in heterogeneous electronic packaging.

The paper introduces a CFD analysis and experimental study on CUF in a multi-chip configuration, aiming to understand underfill flow dynamics. A 3D geometry models of multi-chip arrangement are created using computer-aided design (CAD) software. After that, the CAD models are meshed and simulated in Ansys Fluent using incompressible and non-Newtonian fluid properties. The study maintains S12 of 2.86 and tc of 22.29 between experimental and simulation data for results validation. Next, a various of S12 values (1.14, 2.86, 5.71, 8.57, 14.29 and 20) which focus on tc of 22.29 have been investigated. Further studies have been conduct using S12 of 5.71 and tc of 8.00, 14.29 and 22.29.

Results show a strong correlation between simulation and experiment which validate the correctness and robustness of simulation. Further parameter’s studies using simulation for various of S12 indicated that higher S12 values lead to faster flow. This effect is due to large underfill weight from reservoir able to flow into S12 region which contributed to higher mass momentum movement. Furthermore, the effect of various of tc shows that the thicker the chip the faster the underfill to flow in S12 region.

The intentional exclusion of solder bump pattern arrangements from the experiment and simulation may limit the study's ability to fully understand the impact of solder bump patterns on underfill flow. Therefore, more parameters can be investigated such as solder bump pattern, underfill weight and dispense pattern in the future using CFD.

The manuscript provides a comprehensive examination of the contributions of CFD to the advancement of knowledge regarding CUF phenomena in heterogeneous electronic packaging assemblies. Moreover, it delineates the utilization of CFD methodologies to assess the influence of chip-to-chip spacing (S12) and the thickness of the chip (tc) on the underfill flow characteristics.

This paper fulfills an identified need of computational fluid dynamics method to study capillary underfill flow dynamics in heterogenous electronic packaging.

This paper aims to report a stretchable piezoresistive strain sensor array that can detect various static and dynamic stimuli, including bending, normal force, shear stress and certain range of temperature variation, through sandwiching an array of conductive blocks, made of multiwalled carbon nanotubes (MWCNTs) and polydimethylsiloxane (PDMS) composite. The strain sensor array induces localized resistance changes at different external mechanical forces, which can be potentially implemented as electronic skin.

The working principle is the piezoresistivity of the strain sensor array is based on the tunnelling resistance connection between the fillers and reformation of the percolating path when the PDMS and MWCNT composite deforms. When an external compression stimulus is exerted, the MWCNT inter-filler distance at the conductive block array reduces, resulting in the reduction of the resistance. The resistance between the conductive blocks in the array, on the other hand, increases when the strain sensor is exposed to an external stretching force. The methodology was as follows: Numerical simulation has been performed to study the pressure distribution across the sensor. This method applies two thin layers of conductive elastomer composite across a 2 × 3 conductive block array, where the former is to detect the stretchable force, whereas the latter is to detect the compression force. The fabrication of the strain sensor consists of two main stages: fabricating the conducting block array (detect compression force) and depositing two thin conductive layers (detect stretchable force).

Characterizations have been performed at the sensor pressure response: static and dynamic configuration, strain sensing and temperature sensing. Both pressure and strain sensing are studied in terms of the temporal response. The temporal response shows rapid resistance changes and returns to its original value after the external load is removed. The electrical conductivity of the prototype correlates to the temperature by showing negative temperature coefficient material behaviour with the sensitivity of −0.105 MΩ/°C.

The conductive sensor array can potentially be implemented as electronic skin due to its reaction with mechanical stimuli: compression and stretchable pressure force, strain sensing and temperature sensing.

This prototype enables various static and dynamic stimulus detections, including bending, normal force, shear stress and certain range of temperature variation, through sandwiching an array of conductive blocks, made of MWCNT and PDMS composite. Conventional design might need to integrate different microfeatures to perform the similar task, especially for dynamic force sensing.

Field-effect transistor (FET) has excellent electronic properties and inherent signal amplification, and with the development of nanomaterials technology, FET biosensors with nanomaterials as channels play an important role in the field of heavy metal ion detection. This paper aims to review the research progress of silicon nanowire, graphene and carbon nanotube field-effect tube biosensors for heavy metal ion detection, so as to provide technical support and practical experience for the application and promotion of FET.

The article introduces the structure and principle of three kinds of FET with three kinds of nanomaterials, namely, silicon nanowires, graphene and carbon nanotubes, as the channels, and lists examples of the detection of common heavy metal ions by the three kinds of FET sensors in recent years. The article focuses on the advantages and disadvantages of the three sensors, puts forward measures to improve the performance of the FET and looks forward to its future development direction.

Compared with conventional instrumental analytical methods, FETs prepared using nanomaterials as channels have the advantages of fast response speed, high sensitivity and good selectivity, among which the diversified processing methods of graphene, the multi-heavy metal ions detection of silicon nanowires and the very low detection limit and wider detection range of carbon nanotubes have made them one of the most promising detection tools in the field of heavy metal ions detection. Of course, through in-depth analysis, this type of sensor has certain limitations, such as high cost and strict process requirements, which are yet to be solved.

This paper elaborates on the detection principle and classification of field-effect tube, investigates and researches the application status of three kinds of FET biosensors in the detection of common heavy metal ions. By comparing the advantages and disadvantages of each of the three sensors in practical applications, the paper focuses on the feasibility of improvement measures, looks forward to the development trend in the field of heavy metal detection and ultimately promotes the application of field-effect tube development technology to continue to progress, so that its performance continues to improve and the application field is constantly expanding.