Considering the equivalent circuit in Fig 1 (see November issue) it should be noted that the magnitude of Co and Ro is hardly affected by the sealing process, the progressive…
Abstract
Considering the equivalent circuit in Fig 1 (see November issue) it should be noted that the magnitude of Co and Ro is hardly affected by the sealing process, the progressive filling up of pores manifesting itself in C1·1 and C1·2 changes. These tend to decrease rapidly as the sealing process progresses, whilst the dielectric losses, represented by R1·1 and R1·2, slowly increase. The barrier layer capacitance and resistance, C2·0 R2·0, on the other hand, are hardly affected by the sealing process (see Fig. 13).
This is a continuation of the paper of which Part I was published in the September issue. The third and final Part will be published in the December issue.
W.H. Gühring and g Ing.
Non‐destructive coating thickness measurements The Eddy Current Methods One of the methods suitable for measuring non‐destructively the thickness of electrically non‐conductive…
Abstract
Non‐destructive coating thickness measurements The Eddy Current Methods One of the methods suitable for measuring non‐destructively the thickness of electrically non‐conductive coatings on conductive and, in general, non‐magnetic substrates is the eddy current method. Examples are anodic oxide films on aluminium (DIN 17611, 17612, 50984, BS 1615 and ASTM B 244) and coatings of dry varnish, plastic, rubber and enamel on aluminium, brass, copper and austenitic steel. Low‐conductivity metallic coatings (e.g. Cr) on high‐conductivity substrates such as aluminium, copper or brass can also be measured with an instrument of modified design.
Bharat Taneja and Kumkum Bharti
This study aims to examine the research pattern and growth trends of published research on a unified theory of acceptance and use of technology 2 (UTAUT2) from 2012 to 2019. The…
Abstract
Purpose
This study aims to examine the research pattern and growth trends of published research on a unified theory of acceptance and use of technology 2 (UTAUT2) from 2012 to 2019. The study also examines the research scope of UTAUT2 for future researchers.
Design/methodology/approach
This study has adopted a bibliometric approach followed by a structured literature review analysis to synthesize the research on UTAUT2 since 2012. In total, 163 documents were analyzed for type of studies, theories and frameworks, methodologies, author wise collaboration, organizations that contributed to the body of knowledge in the UTAUT2 research and journals that published studies in this domain. VOSviewer and Tableau were used for the data visualization, whereas TCCM, which means theory (T), context (C), characteristics (C) and methodology (M) framework is used to propose the future research directions.
Findings
The findings reveal research on UTAUT2 is growing. The structured literature analysis of the top 15 cited articles further analyzed the parsimony of new models in detail. In addition, the study highlights the inception by and promoters of UTAUT2 in a separate section. The data for this study was collected by searching the title, abstract and keywords of documents in the Scopus database.
Research limitations/implications
This study is based on research papers, published in the UTAUT2 research area, that have been extracted from the Scopus database by keywords only. Future studies can also perform a meta-analysis of various clusters generated by bibliometric analysis.
Practical implications
This study is useful for practitioners to devise strategies for increasing technology acceptance, adoption and utilization in the times to come.
Originality/value
To the best of the authors’ knowledge, this study is one of the very few and early studies, which examined patterns and growth trends of the UTAUT2 studies with the TCCM framework, to suggest scope for future research studies.