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This paper presents possibility of laser application for fabrication of 3D elements and structures. The Aurel NAVS‐30 Laser Trimming and Cutting System with special software was used. It was applied successfully for fabrication of vias (minimum diameter – 50 μm) in fired and unfired LTCC ceramics and channels with width between 100 μm and 5 mm. The achievements and problems are presented and discussed. The influence of lamination process on quality of vias and channels as well as the problems connected with interaction of laser beam with ceramic tapes are shown. Three‐dimensional resistors and microfluidic system were successfully designed and fabricated based on our investigations. Chosen electrical and thermal parameters of constructed devices are shown, too.

The purpose of this paper is to develop the device made of low temperature co-fired ceramics (LTCC) and lead zirconate titanate (PZT) by co-firing both materials. In the paper, the technology and properties of a miniature uniaxial ceramic accelerometer are presented.

Finite element method (FEM) is applied to predict properties of the sensor vs main dimensions of the sensor. The LTCC process is applied during manufacturing of the device. All the advantages of the technology are taken into account during designing three-dimensional structure of the sensor. The sensitivity and resonant frequency of the accelerometer are measured. Real material parameters of PZT are estimated according to measurement results and FEM simulations.

The ceramic sensor integrated with SMD package with outer dimensions of 5 × 5 × 5 mm3 is manufactured. The accelerometer exhibits sensitivity of 0.75 pC/g measured at 100 Hz. The resonant frequency is equal to about 2 kHz. Useful frequency range is limited by 3 dB sensitivity change at about 1 kHz.

Sensitivity of the device is limited by interaction between LTCC and PZT materials during co-firing process. The estimated d parameters are ten times worse comparing to bulk Pz27 material. Further research on materials compatibility should be carried out.

The sensor can be easily integrated into various devices made of standard electronic printed circuit boards (PCBs). Applied method of direct integration of piezoelectric transducers with LTCC material enables manufacturing of complex ceramic systems with built-in accelerometer in the substrate.

The accelerometer is a sensor and a package simultaneously. The miniature ceramic device is compatible with surface mounting technology; hence, it can be used directly on PCBs for vibration monitoring inside electronic devices and systems.

Capacitors are frequently used in electronic circuits. Thick‐film technology allows fabrication of such components in the case of small‐ and medium‐capacitance values. They can also be manufactured in LTCC structures. The paper seeks to investigate the electrical properties of thick‐film and LTCC capacitors for as‐fired and long‐term thermally aged test structures in a wide frequency and temperature range.

Sandwich and interdigitated planar capacitors were fabricated on alumina or LTCC substrates using standard screen printing and laser shaping. Various dielectric inks and electrodes materials were used. The crystalline phases in thick‐film dielectric films were identified.

Planar and sandwich LTCC and thick‐film capacitors were designed and fabricated. Different technology variations were tested. X‐ray analysis indicated that both used commercial compositions, compatible with LTCC substrates are based on barium and titatium compounds. The difference in their dielectric constants probably are related with kind of crystalline phases, presented in these compositions and crystalline phase/glass ratio.

This paper presents results of investigations made on thick‐film and LTCC microcapacitors.