Examines the fifteenth published year of the ITCRR. Runs the whole gamut of textile innovation, research and testing, some of which investigates hitherto untouched aspects…
Abstract
Examines the fifteenth published year of the ITCRR. Runs the whole gamut of textile innovation, research and testing, some of which investigates hitherto untouched aspects. Subjects discussed include cotton fabric processing, asbestos substitutes, textile adjuncts to cardiovascular surgery, wet textile processes, hand evaluation, nanotechnology, thermoplastic composites, robotic ironing, protective clothing (agricultural and industrial), ecological aspects of fibre properties – to name but a few! There would appear to be no limit to the future potential for textile applications.
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This case reviews the development of Dianping. After seeing Zagat's unique business model in the United States, founder Zhang Tao found that he could bring it to China and bring…
Abstract
This case reviews the development of Dianping. After seeing Zagat's unique business model in the United States, founder Zhang Tao found that he could bring it to China and bring about local innovation. At the beginning of its establishment, the collection and promotion of comment content was the major challenge for Dianping. At the same time, Dianping faced legal issues. To solve these problems, the review mechanism of Dianping was designed to a certain extent to ensure the fairness of the review. With the advent of the mobile Internet era, Dianping began to develop a new business model. Relying on its high-quality “word-of-mouth” content and mass basis, Dianping launched group buying, online restaurant ordering, and other businesses. Dianping has always been open to strategic partners. Since 2015, Dianping has undergone historical changes, merging with Meituan. Since then, Dianping has continuously adjusted its business and organizational structure to maintain its competitiveness. Gradually, Dianping has changed from an independent business entity into a business unit of Meituan.
Bo Tao, Han Ding and Youlun Xiong
Modern manufacturing plants have a desperate need for large amounts of sensor information, to refine and improve their production. A novel peer‐to‐peer distributed sensor network…
Abstract
Purpose
Modern manufacturing plants have a desperate need for large amounts of sensor information, to refine and improve their production. A novel peer‐to‐peer distributed sensor network (DSN) framework is presented in this paper to continue the previous research of the IP sensor.
Design/methodology/approach
A device description sheet method, stemming from the TEDS of IEEE 1451 standard, is presented to achieve the self‐identify and self‐description of each IP sensor in a DSN application. Moreover, a virtual mapping mechanism, named transducer domain name server (TDNS), is also presented.
Findings
Ethernet is the backbone of the DSN architecture presented, and direct access between any two sensors located in a same DSN is allowable. With the help of the TDNS, the reallocation of each sensor's role at run‐time is achieved by performing a dynamic binding between the devices monitored and the IP sensors.
Originality/value
In the new proposal, two key problems, including the connection establishment of a large sensor network and the dynamic reallocation of each sensor's role at run‐time, are efficiently settled. All of the methods presented will be an important step towards seeking for a practical use at the production floor.
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Tao Bo, Yin Zhouping, Ding Han and Wu Yiping
The purpose of this paper is to present a novel reflow profile optimization method using mechanical reliability estimation of micro‐ball grid array (μBGA) solder joints, based on…
Abstract
Purpose
The purpose of this paper is to present a novel reflow profile optimization method using mechanical reliability estimation of micro‐ball grid array (μBGA) solder joints, based on the heating factor, Qη is introduced, where the coupling effect of reflow temperature and time on the mechanical reliability of μBGA joints is considered.
Design/methodology/approach
The method presented is actualized through vibration fatigue tests. First, a two‐parameter Weibull distribution is used to model the collected data of vibration fatigue lifetime for different Qη. After that, two explicit functions are deduced in a unified mathematic expression form, which give an intuitionistic description of the mean time to failure and reliability of solder joints against induced variable Qη, thus revealing definitely the effect of Qη on the mechanical fatigue lifetime of solder joints suffering from cyclic vibration loading. Finally, for a specified reliability goal, how to choose proper Qη values, based an improved Golden Section Search arithmetic, is discussed.
Findings
Numerical analysis and calculation are performed. The results show that the solder joints made at Qη near 510 have higher mechanical reliability, and those reflowed farther away this optimal value have less reliability.
Originality/value
This paper presents a useful and applicable solution to achieve reflow profile optimization and process control for a quantitative mechanical reliability estimation of μBGA solder joints.
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Bo Tao, Zhouping Yin and Youlun Xiong
From the viewpoint of degree of cure, the purpose of this paper is to find how to improve the reliability of flip‐chip packaging modules based on an anisotropically conductive…
Abstract
Purpose
From the viewpoint of degree of cure, the purpose of this paper is to find how to improve the reliability of flip‐chip packaging modules based on an anisotropically conductive adhesive film (ACF) interconnection process.
Design/methodology/approach
The work begins by revealing the correlation of adhesive strength and contact resistance of flip‐chip joint interfaces with the degree of cure of the ACF. The effect of different degrees of curing on the electrical and mechanical properties of some typical ACF‐interconnected joints is studied, and the optimum degree of cure is suggested to achieve highly reliable ACF joints, where the performance variations of the adhesion strength and contact resistance are considered simultaneously. First, the degradation data of the contact resistance of some ACF assemblies, bonded with several degrees of cure, is collected during a standard high‐hydrothermal fatigue test. The resistance distribution is verified using a two‐parameter Weibull model and the distribution parameters are estimated, respectively. After that, a reliability analysis method based on the degradation data of contact resistance is achieved, instead of the traditional failure time analysis, and the reliability index, as well as the mean‐time‐to‐degradation of the ACF joints, as a function of the degree of cure, is deduced, through which the optimum degree of cure value and recommend range are suggested.
Findings
Numerical analysis and calculations are performed based on the experiments. Results show that the optimum degree of cure to achieve highly reliable joints is 83 per cent, and the recommend range is from 82 to 85 per cent for the ACF tested (considering a 95 per cent confidence interval).
Originality/value
The paper provides important support for optimizing the curing process for various ACF‐based packaging applications, such as chip‐on‐glass packaging of liquid crystal displays and flip‐chip bonding of radio frequency identification, etc.
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Le-Nguyen Duc Chinh and Martin Hayden
Vietnam is firmly committed to attaining the Sustainable Development Goals articulated in the United Nations 2030 Sustainable Development Agenda. Goal 4 concerns quality…
Abstract
Vietnam is firmly committed to attaining the Sustainable Development Goals articulated in the United Nations 2030 Sustainable Development Agenda. Goal 4 concerns quality education, and target 4.3 refers to ensuring access by all men and women to quality and affordable technical, vocational and tertiary education, including university education. In 2017, the Prime Minister issued a directive that included five actions to be taken by Vietnam’s Ministry of Education and Training to achieve target 4.3 in the context of the higher education sector. This chapter provides an opportunity to review some challenges the Ministry faces in implementing the five actions specified.
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Chen Peng, Dong Fangmin, Zhao Chunhua and Guan Tao
The purpose of this paper is to present a novel registration method for augmented reality (AR) systems based on robust estimation of trifocal tensor using point and line…
Abstract
Purpose
The purpose of this paper is to present a novel registration method for augmented reality (AR) systems based on robust estimation of trifocal tensor using point and line correspondence simultaneously.
Design/methodology/approach
The proposed method distinguishes itself in following three ways: first, to establish the world coordinate system, the restriction that the four specified points must form an approximate square is relaxed, the only requirement is that these four points should not be collinear. Second, besides feature points, line segments are also used to calculate the needed trifocal tensors. The registration process can still be achieved even without the use of feature points. Third, to estimate trifocal tensors precisely, progressive sample consensus (PROSAC) is used instead of random sample consensus to remove outliers.
Findings
As shown in the experiments, the proposed method really enhances the usability of this system. To calculate trifocal tensor, a PROSAC based algebraic minimization algorithm is put forward which improves the accuracy and reduces the computation complexity.
Research limitations/implications
In current system, it is stipulated that there is no large rotation of the user's head relative to the registration scenes, because the NCC will degrade when there is a large rotation between images.
Practical implications
A more robust feature matching strategy is needed. Treating feature matching as a classification problem may be a good choice.
Originality/value
This paper presents a novel registration approach for AR system.