Search results

1 – 1 of 1
Per page
102050
Citations:
Loading...
Access Restricted. View access options
Article
Publication date: 1 June 1999

John H. Lau, Tony Chen and Tai‐Yu Chou

A family of cavity‐down plastic ball grid array (PBGA) packages have been designed by split via connection (SVC) and split wrap around (SWA) methods. Because of the special…

223

Abstract

A family of cavity‐down plastic ball grid array (PBGA) packages have been designed by split via connection (SVC) and split wrap around (SWA) methods. Because of the special designs, these packages consist of a single core of organic material and two‐metal layers of copper and are manufactured with the conventional printed circuit board (PCB) process at very low cost. The electrical performances of the packages are studied by both numerical simulations and experimental measurements. Parasitic parameters are extracted from time domain reflectometer (TDR) and time domain transmission (TDT) measurements. Cross‐talk and simultaneous switch output (SSO) noise of the packages are also investigated.

Details

Circuit World, vol. 25 no. 2
Type: Research Article
ISSN: 0305-6120

Keywords

1 – 1 of 1
Per page
102050