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Article
Publication date: 1 September 1999
Keith Rogers, Craig Hillman, Michael Pecht and Suzanne Nachbor
A defective printed circuit board assembly that exhibited excessive current leakage was examined to determine the responsible failure mechanisms. Observation of the failure site…
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Abstract
A defective printed circuit board assembly that exhibited excessive current leakage was examined to determine the responsible failure mechanisms. Observation of the failure site (determined electrically) by optical and electron microscopy revealed an area in the circuit board where debonded fiber bundles bridged a plated‐through‐hole (PTH) to a copper plane. This phenomenon is highly suggestive of conductive filament formation.
Details
Circuit World, vol. 25 no. 3
Type: Research Article
ISSN: 0305-6120