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Article
Publication date: 3 February 2020

Ye Tian, Heng Fang, Ning Ren, Chao Qiu, Fan Chen and Suresh Sitaraman

This paper aims to assess precise correlations between intermetallic compounds (IMCs) microstructure evolutions and the reliability of micro-joints with a Cu/SAC305solder/Ni…

145

Abstract

Purpose

This paper aims to assess precise correlations between intermetallic compounds (IMCs) microstructure evolutions and the reliability of micro-joints with a Cu/SAC305solder/Ni structure using thermal shock (TS) tests.

Design/methodology/approach

This paper uses 200-µm pitch silicon flip chips with nickel (Ni) pads and stand-off height of approximately 60 µm, assembled on substrates with copper (Cu) pads. After assembly, the samples were subjected to air-to-air thermal shock testing from 55 to 125 per cent. The transfer time was less than 5 s, and the dwell time at each temperature extreme was 15 min. To investigate the microstructure evolution and crack growth, two samples were removed from the thermal shock chamber at 0, 400, 1,200, 2,000, 5,800 and 7,000 cycles.

Findings

The results showed that one (Cu, Ni)6Sn5/(Ni, Cu)3Sn4 dual-layer structure formed at the Ni pad interface of chip side dominates the micro-joints failure. This is because substantial (Ni, Cu)3Sn4 grain boundaries provide a preferential pathway for the catastrophic crack growth. Other IMCs microstructure evolutions that cause the prevalent joints failure as previously reported, i.e. thickened interfacial (Cu, Ni)6Sn5 and Ni3P layer, and coarsened IMCs inside the solder matrix, only contributed to the occurrence of fine cracks. Moreover, the typical interfacial IMCs spalling triggered by thermally induced stress did not take place in this study, showing a positive impact in the micro-joint reliability.

Originality/value

As sustained trends toward multi-functionality and miniaturization of microelectronic devices, the joints size is required to be constantly scaled down in advanced packages. This arises a fact that the reliability of small-size joints is more sensitive to the IMCs because of their high volume proportion and greatly complicated microstructure evolutions. This paper evaluated precise correlations between IMCs microstructure evolutions and the reliability of micro-joints with a Cu/SAC305solder/Ni structure using TS tests. It found that one (Cu, Ni)6Sn5/(Ni, Cu)3Sn4 dual-layer structure formed at the Ni pad interface dominate the micro-joints failure, whereas other IMCs microstructure evolutions that cause the prevalent joints failure exhibited nearly negligible effects.

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Article
Publication date: 7 September 2015

Ye Tian, Justin Chow, Xi Liu and Suresh K. Sitaraman

The purpose of this paper is to study the intermetallic compound (IMC) thickness, composition and morphology in 100-μm pitch and 200-μm pitch Sn–Ag–Cu (SAC305) flip-chip…

276

Abstract

Purpose

The purpose of this paper is to study the intermetallic compound (IMC) thickness, composition and morphology in 100-μm pitch and 200-μm pitch Sn–Ag–Cu (SAC305) flip-chip assemblies after bump reflow and assembly reflow. In particular, emphasis is placed on the effect of solder joint size on the interfacial IMCs between metal pads and solder matrix.

Design/methodology/approach

This work uses 100-μm pitch and 200-μm pitch silicon flip chips with nickel (Ni) pads and stand-off height of approximately 45 and 90 μm, respectively, assembled on substrates with copper (Cu) pads. The IMCs evolution in solder joints was investigated during reflow by using 100- and 200-μm pitch flip-chip assemblies.

Findings

After bump reflow, the joints size controls the IMC composition and dominant IMC type as well as IMC thickness and also influences the dominant IMC morphology. After assembly reflow, the cross-reaction of the pad metallurgies promotes the dominant IMC transformation and shape coarsened on the Ni pad interface for smaller joints and promotes a great number of new dominate IMC growth on the Ni pad interface in larger joints. On the Cu pad interface, many small voids formed in the IMC in larger joints, but were not observed in smaller joints, combined with the drawing of the IMC growth process.

Originality/value

With continued advances in microelectronics, it is anticipated that next-generation microelectronic assemblies will require a reduction of the flip-chip solder bump pitch to 100 μm or less from the current industrial practice of 130 to150 μm. This work shows that as the packaging size reduced with the solder joint interconnection, the solder size becomes an important factor in the intermetallic composition as well as morphology and thickness after reflow.

Details

Soldering & Surface Mount Technology, vol. 27 no. 4
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 1 January 1993

Parimal Kopardekar, Anil Mital and Sam Anand

Inspection is an activity that controls the outgoing productquality and involves search, detection and measurement or diagnosis.Traditionally, inspection tasks have been allocated…

502

Abstract

Inspection is an activity that controls the outgoing product quality and involves search, detection and measurement or diagnosis. Traditionally, inspection tasks have been allocated to humans. Attempts to automate industrial inspection in order to eliminate errors and alleviate monotony have faced difficulties due to technological limitations and/or prohibitive implementation costs. An occasional compromise is partial automation (hybrid inspection). Reviews published research in manual, hybrid and automated inspection to understand the current research status.

Details

Integrated Manufacturing Systems, vol. 4 no. 1
Type: Research Article
ISSN: 0957-6061

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Article
Publication date: 1 April 2005

Jaroslav Mackerle

Ceramic materials and glasses have become important in modern industry as well as in the consumer environment. Heat resistant ceramics are used in the metal forming processes or…

5158

Abstract

Purpose

Ceramic materials and glasses have become important in modern industry as well as in the consumer environment. Heat resistant ceramics are used in the metal forming processes or as welding and brazing fixtures, etc. Ceramic materials are frequently used in industries where a wear and chemical resistance are required criteria (seals, liners, grinding wheels, machining tools, etc.). Electrical, magnetic and optical properties of ceramic materials are important in electrical and electronic industries where these materials are used as sensors and actuators, integrated circuits, piezoelectric transducers, ultrasonic devices, microwave devices, magnetic tapes, and in other applications. A significant amount of literature is available on the finite element modelling (FEM) of ceramics and glass. This paper gives a listing of these published papers and is a continuation of the author's bibliography entitled “Finite element modelling of ceramics and glass” and published in Engineering Computations, Vol. 16, 1999, pp. 510‐71 for the period 1977‐1998.

Design/methodology/approach

The form of the paper is a bibliography. Listed references have been retrieved from the author's database, MAKEBASE. Also Compendex has been checked. The period is 1998‐2004.

Findings

Provides a listing of 1,432 references. The following topics are included: ceramics – material and mechanical properties in general, ceramic coatings and joining problems, ceramic composites, piezoceramics, ceramic tools and machining, material processing simulations, fracture mechanics and damage, applications of ceramic/composites in engineering; glass – material and mechanical properties in general, glass fiber composites, material processing simulations, fracture mechanics and damage, and applications of glasses in engineering.

Originality/value

This paper makes it easy for professionals working with the numerical methods with applications to ceramics and glasses to be up‐to‐date in an effective way.

Details

Engineering Computations, vol. 22 no. 3
Type: Research Article
ISSN: 0264-4401

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