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Article
Publication date: 1 April 2001

Sunit Rane and Vijaya Puri

In this paper studies on the lab formulated fritless silver thick film paste with two different binder compositions that have been used to fabricate λ/2 microstrip rejection…

216

Abstract

In this paper studies on the lab formulated fritless silver thick film paste with two different binder compositions that have been used to fabricate λ/2 microstrip rejection filter in the X and Ku band are reported. These have been compared with ESL (USA) paste and copper thin film metallization for the same circuit. The thick film circuits were overlayed with TiO2 thick film of different thickness and changes in the characteristics studied. In the X band, the Q of the filter improves with overlay and is also dependent on the Ag paste formulation, whereas in the Ku band there are no thick film paste dependent properties observed due to overlay. Thickness of overlay and metallization paste formulation dependent factors should be taken into consideration during fabrication of high density and multi‐layer microwave integrated circuits.

Details

Microelectronics International, vol. 18 no. 1
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 27 June 2008

Jayashri Bangali, Sunit Rane, Girish Phatak and Shashikala Gangal

The purpose of this paper is to investigate and report the impact of glass frit variation in silver thick film pastes used as surface conductors in low temperature co‐fired…

687

Abstract

Purpose

The purpose of this paper is to investigate and report the impact of glass frit variation in silver thick film pastes used as surface conductors in low temperature co‐fired ceramics technology (LTCC), especially on the properties such as warpage of LTCC associated with conductors, microstructure of the fired thick films, sheet resistance and adhesion on LTCC.

Design/methodology/approach

Silver thick film paste compositions were formulated by changing the silver glass frit ratio. The compatibility of these formulated paste compositions with LTCC (DP 951AX) substrate were evaluated. The properties such as microstructure developments, the change in sheet resistance, warpage of LTCC substrate with respect to glass frit ratio of the developed silver films on LTCC were evaluated.

Findings

The results reveal that the glass frit percentage used in paste formulation is equally responsible for the disturbance in the properties such as microstructure, warping and electrical properties of the fired thick films on LTCC. It was observed that the paste composition, in particular sample SP10B containing the highest glass frit percentage, is compatible with the LTCC tape under processing conditions. The sheet resistance value in the range of 5 mΩ/□ and the fired films showed very good adhesion (3.95 N), irrespective of the glass frit composition.

Originality/value

The paper provides useful evaluations of properties such as microstructure developments, changes in sheet resistance and warpage of LTCC substrate with respect to glass frit ratio of the developed silver pastes on LTCC.

Details

Soldering & Surface Mount Technology, vol. 20 no. 3
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 8 May 2009

Shweta Jagtap, Sunit Rane, Suresh Gosavi and Dinesh Amalnerkar

The purpose of this paper is to study the properties of disc type negative temperature coefficient (NTC) thermistors based on the spinel system Mn‐Co‐Ni‐O with the doping of RuO2

351

Abstract

Purpose

The purpose of this paper is to study the properties of disc type negative temperature coefficient (NTC) thermistors based on the spinel system Mn‐Co‐Ni‐O with the doping of RuO2 for the low‐resistance applications.

Design/methodology/approach

Emphasis was placed on the properties of ruthenium dioxide doped manganite spinel system for low‐resistance applications. The properties such as microstructure, X‐ray diffraction analysis and electrical properties are reported.

Findings

The prepared NTC thermistor compositions revealed the room temperature resistance and thermistor constant in the range of 28‐2,950 Ω and 1,539‐3,428 K, respectively. Hence, the prepared NTC thermistors with low resistance and moderate sensitivity are suitable from an industrial applications point of view.

Originality/value

The paper reports upon a synthesis procedure which is a straightforward preparation of highly densified ternary oxide (Mn‐Co‐No‐O) thermistors.

Details

Microelectronics International, vol. 26 no. 2
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 24 April 2007

Shweta Jagtap, Sunit Rane, Uttamrao Mulik and Dinesh Amalnerkar

Aims to focus on temperature sensors.

1046

Abstract

Purpose

Aims to focus on temperature sensors.

Design/methodology/approach

Negative temperature co‐efficient thermistor powders of ternary Mn, Co, Ni oxide along with RuO2 synthesized at relatively moderates temperature (1,000°C). Thick film thermistor paste compositions were formulated by mixing the semiconducting oxide powder, glass frit and organic vehicle. The physico‐chemical analysis, viz. X‐ray diffraction, scanning electron microscopy and thermogravimetry and IR spectroscopy were carried out for the synthesized powder and the resultant thick films. The X‐ray analysis of the powders showed the cubic spinel structure. The electrical properties like thermistor constant, sensitivity index and activation energy of the thick film NTC thermistor were determined.

Findings

The room temperature resistance is observed to range from 490 KΩ to 4.13 MΩ with thermistor constant ranging from 3,275 to 3,980 K, in the temperature range of 25‐300°C.

Originality/value

Describes research work on temperature sensors that are used for monitoring and control in many fields such as in home appliances, manufacturing industries, biomedical and automobile industries.

Details

Microelectronics International, vol. 24 no. 2
Type: Research Article
ISSN: 1356-5362

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