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Article
Publication date: 1 June 2003
Describes the application methods currently available for liquid photoimageable (LPI) soldermasks and discusses how these different methods influence the soldermask's processing…
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Abstract
Describes the application methods currently available for liquid photoimageable (LPI) soldermasks and discusses how these different methods influence the soldermask's processing and its capability at the three main processing stages of coating, drying and imaging. The paper concludes with a description of the use of an evaluation matrix based on LPI application key success factors (KSF) derived from current and future demands.
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Circuit World, vol. 29 no. 2
Type: Research Article
ISSN: 0305-6120
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Article
Publication date: 1 December 2006
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