Chongbin Hou, Yang Qiu, Xingyan Zhao, Shaonan Zheng, Yuan Dong, Qize Zhong and Ting Hu
By investigating the thermal-mechanical interaction between the through silicon via (TSV) and the Cu pad, this study aimed to determine the effect of electroplating defects on the…
Abstract
Purpose
By investigating the thermal-mechanical interaction between the through silicon via (TSV) and the Cu pad, this study aimed to determine the effect of electroplating defects on the upper surface protrusion and internal stress distribution of the TSV at various temperatures and to provide guidelines for the positioning of TSVs and the optimization of the electroplating process.
Design/methodology/approach
A simplified model that consisted of a TSV (100 µm in diameter and 300 µm in height), a covering Cu pad (2 µm thick) and an internal drop-like electroplating defect (which had various dimensions and locations) was developed. The surface overall deformation and stress distribution of these models under various thermal conditions were analyzed and compared.
Findings
The Cu pad could barely suppress the upper surface protrusion of the TSV if the temperature was below 250 ?. Interfacial delamination started at the collar of the TSV at about 250 ? and became increasingly pronounced at higher temperatures. The electroplating defect constantly experienced the highest level of strain and stress during the temperature increase, despite its geometry or location. But as its radius expanded or its distance to the upper surface increased, the overall deformation of the upper surface and the stress concentration at the collar of the TSV showed a downward trend.
Originality/value
Previous studies have not examined the influence of the electroplating void on the thermal behavior of the TSV. However, with the proposed methodology, the strain and stress distribution of the TSV under different conditions in terms of temperature, dimension and location of the electroplating void were thoroughly investigated, which might be beneficial to the positioning of TSVs and the optimization of the electroplating process.
Details
Keywords
Zicheng Zhang, Xinyue Lin, Shaonan Shan and Zhaokai Yin
This study aims to analyze government hotline text data and generating forecasts could enable the effective detection of public demands and help government departments explore…
Abstract
Purpose
This study aims to analyze government hotline text data and generating forecasts could enable the effective detection of public demands and help government departments explore, mitigate and resolve social problems.
Design/methodology/approach
In this study, social problems were determined and analyzed by using the time attributes of government hotline data. Social public events with periodicity were quantitatively analyzed via the Prophet model. The Prophet model is decided after running a comparison study with other widely applied time series models. The validation of modeling and forecast was conducted for social events such as travel and educational services, human resources and public health.
Findings
The results show that the Prophet algorithm could generate relatively the best performance. Besides, the four types of social events showed obvious trends with periodicities and holidays and have strong interpretable results.
Originality/value
The research could help government departments pay attention to time dependency and periodicity features of the hotline data and be aware of early warnings of social events following periodicity and holidays, enabling them to rationally allocate resources to handle upcoming social events and problems and better promoting the role of the big data structure of government hotline data sets in urban governance innovations.