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The purpose of this study is to explore the impact of asymmetric trust on construction project management performance in China's construction industry. Moreover, the authors explore the mediating role of two types of knowledge sharing (explicit knowledge sharing and tacit knowledge sharing) in explaining the association between asymmetric trust and project management performance.

A theoretical model based on the research hypotheses proposed in this study was developed and a questionnaire survey was conducted with 271 professionals. The data collected was analyzed by the structural equation modeling (SEM) technique.

The results of this study indicate that there is a significant and negative association between asymmetric trust and project management performance. Moreover, two types of knowledge sharing (explicit knowledge sharing and tacit knowledge sharing) have different degrees of impact on improving project management performance. In addition, tacit knowledge sharing is a mediator between asymmetric trust and project management performance.

The data used in this study is from Chinese scenarios, so the research conclusions and application effects based on this are bound to have certain regional limitations. Besides, there are many factors that affect project management performance improving, and the relationships among them are so complex. The theoretical model proposed in this study may not be fully considered. Therefore, follow-up researchers can consider bringing more suitable variables into their researches, so that the theoretical researches can be more in line with the actual project management practice, and the specific mechanism for improving project management performance can be explained more deeply.

This research's value is as follows: Firstly, this paper contributes to the trust and relational governance literature by expanding the research perspective of mutual trust to asymmetric trust. Specially, this research designs a measurement scale for asymmetric trust and then reveals the impact mechanism of it on project management performance, which will certainly promote research paradigm change of trust. Secondly, this research is beneficial to knowledge sharing literature in the construction management field by expanding the research scope of knowledge sharing from a cross-organizational perspective.

The purpose of this paper is to focus on the fabrication of SnAgCu (SAC) nanocomposites solder and study the effect of Cu nanopowders (nano-Cu) addition on the microstructure evolution of resultant nanocomposite solder after reflow and thermal aging.

Mechanical mixing is used in this work to incorporate nanoparticles into the solder and produce more homogeneous mixture. Standard metallographic procedures are applied for microstructural analysis of solder joints.

It is found that nano-Cu doped into Sn0.7Ag0.5Cu-BiNi solder has no appreciable influence on melting temperature of the composite solder. The addition of Cu nanoparticles refines the microstructure of bulk solder and suppresses the growth of interfacial intermetallic compound (IMC) layers. However, interfacial IMC grain size increases slightly after 1.0 per cent nano-Cu added.

The paper demonstrates a method of nano-composite solder paste preparation by means of mechanical mixing and a comparison study of the microstructure evolution of composite solder with the basic SAC solder.

Through the study, we identified four effective paths to improve governance performance and also found the key direction for future research on digital twin urban implementation of public crisis governance, i.e. how to find a balance between the cost and the effectiveness of governance.

A total of 22 urban public emergencies were selected based on key influencing factors, and four action paths to improve the performance of public crisis governance in digital twin cities were obtained using a fuzzy set qualitative comparative analysis model.

This paper identified digital twin technologies in urban public crisis governance, analyzed the key factors of public crisis governance in the digital twin city and proposed a path of action to improve the performance of public crisis governance in digital twin cities.

This study focuses on the influencing factors of public crisis governance in digital twin cities and the action paths to promote improved governance performance.

This study aims to analyze government hotline text data and generating forecasts could enable the effective detection of public demands and help government departments explore, mitigate and resolve social problems.

In this study, social problems were determined and analyzed by using the time attributes of government hotline data. Social public events with periodicity were quantitatively analyzed via the Prophet model. The Prophet model is decided after running a comparison study with other widely applied time series models. The validation of modeling and forecast was conducted for social events such as travel and educational services, human resources and public health.

The results show that the Prophet algorithm could generate relatively the best performance. Besides, the four types of social events showed obvious trends with periodicities and holidays and have strong interpretable results.

The research could help government departments pay attention to time dependency and periodicity features of the hotline data and be aware of early warnings of social events following periodicity and holidays, enabling them to rationally allocate resources to handle upcoming social events and problems and better promoting the role of the big data structure of government hotline data sets in urban governance innovations.

By investigating the thermal-mechanical interaction between the through silicon via (TSV) and the Cu pad, this study aimed to determine the effect of electroplating defects on the upper surface protrusion and internal stress distribution of the TSV at various temperatures and to provide guidelines for the positioning of TSVs and the optimization of the electroplating process.

A simplified model that consisted of a TSV (100 µm in diameter and 300 µm in height), a covering Cu pad (2 µm thick) and an internal drop-like electroplating defect (which had various dimensions and locations) was developed. The surface overall deformation and stress distribution of these models under various thermal conditions were analyzed and compared.

The Cu pad could barely suppress the upper surface protrusion of the TSV if the temperature was below 250 ?. Interfacial delamination started at the collar of the TSV at about 250 ? and became increasingly pronounced at higher temperatures. The electroplating defect constantly experienced the highest level of strain and stress during the temperature increase, despite its geometry or location. But as its radius expanded or its distance to the upper surface increased, the overall deformation of the upper surface and the stress concentration at the collar of the TSV showed a downward trend.

Previous studies have not examined the influence of the electroplating void on the thermal behavior of the TSV. However, with the proposed methodology, the strain and stress distribution of the TSV under different conditions in terms of temperature, dimension and location of the electroplating void were thoroughly investigated, which might be beneficial to the positioning of TSVs and the optimization of the electroplating process.