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Article
Publication date: 1 April 1998

Stephen O’ Reilly, John Flannery, Terence O’ Donnell, Andrew Muddiman, Gerard Healy, Michael Byrne and Sean Cian Ó Mathúna

Multilayer aircore inductors fabricated in a range of interconnection technologies which are MCM compatible are presented and compared. These consist of thick‐film, low…

378

Abstract

Multilayer aircore inductors fabricated in a range of interconnection technologies which are MCM compatible are presented and compared. These consist of thick‐film, low temperature cofired ceramic (LTCC), printed circuit board (PCB) and fine‐line plated copper on ceramic (copper plating). From a comparison of simulated and measured results, it can be concluded that a predictive design capability has been achieved for inductance and self‐resonant frequency (SRF). Modelling of AC resistance and Q requires further investigation.

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Microelectronics International, vol. 15 no. 1
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 1 December 2001

Stephen O’Reilly, Maeve Duffy, Terence O’Donnell, Paul McCloskey and Seán Cian Ó Mathúna

This paper will focus on the work which was carried out under the Brite‐EuRAM funded project, COMPRISE (BE 96‐3371), the objective of which was to develop new materials and…

697

Abstract

This paper will focus on the work which was carried out under the Brite‐EuRAM funded project, COMPRISE (BE 96‐3371), the objective of which was to develop new materials and manufacturing processes to embed passive components (resistors, inductors, capacitors) within printed wiring structures fabricated from laminate materials. For the realisation of integrated resistors, a commercially available planar resistor material is incorporated in different test structures. The technology consists of a copper foil of standard thickness on which a resistive layer is deposited by means of electroless plating. For the realisation of capacitors in multi‐layered PCB structures, significant progress was made in the development and fabrication of very thin laminates. Higher dielectric constants of these laminate materials enable the increase of the capacitance per unit area. For inductors, both aircore (no magnetic material) and magnetic core components have been investigated.

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Circuit World, vol. 27 no. 4
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 February 1990

Thirty‐six people attended this SMART Group Seminar at the Bowler Hat Hotel in Birkenhead, Merseyside, on 20 February 1990. The technical programme in the morning comprised five…

32

Abstract

Thirty‐six people attended this SMART Group Seminar at the Bowler Hat Hotel in Birkenhead, Merseyside, on 20 February 1990. The technical programme in the morning comprised five talks:

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Soldering & Surface Mount Technology, vol. 2 no. 2
Type: Research Article
ISSN: 0954-0911

Article
Publication date: 1 February 1991

Tony Wood

This design‐based seminar was aimed at broadening the horizons of designers and engineers. The greatest area of cost reduction in any electronics project is in making the right…

22

Abstract

This design‐based seminar was aimed at broadening the horizons of designers and engineers. The greatest area of cost reduction in any electronics project is in making the right choices at the conception and design phases. This seminar was one step in this direction: a piece of 1·6 mm FR‐4 is not always the best substrate to use.

Details

Soldering & Surface Mount Technology, vol. 3 no. 2
Type: Research Article
ISSN: 0954-0911

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