Stephen O’ Reilly, John Flannery, Terence O’ Donnell, Andrew Muddiman, Gerard Healy, Michael Byrne and Sean Cian Ó Mathúna
Multilayer aircore inductors fabricated in a range of interconnection technologies which are MCM compatible are presented and compared. These consist of thick‐film, low…
Abstract
Multilayer aircore inductors fabricated in a range of interconnection technologies which are MCM compatible are presented and compared. These consist of thick‐film, low temperature cofired ceramic (LTCC), printed circuit board (PCB) and fine‐line plated copper on ceramic (copper plating). From a comparison of simulated and measured results, it can be concluded that a predictive design capability has been achieved for inductance and self‐resonant frequency (SRF). Modelling of AC resistance and Q requires further investigation.
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Stephen O’Reilly, Maeve Duffy, Terence O’Donnell, Paul McCloskey and Seán Cian Ó Mathúna
This paper will focus on the work which was carried out under the Brite‐EuRAM funded project, COMPRISE (BE 96‐3371), the objective of which was to develop new materials and…
Abstract
This paper will focus on the work which was carried out under the Brite‐EuRAM funded project, COMPRISE (BE 96‐3371), the objective of which was to develop new materials and manufacturing processes to embed passive components (resistors, inductors, capacitors) within printed wiring structures fabricated from laminate materials. For the realisation of integrated resistors, a commercially available planar resistor material is incorporated in different test structures. The technology consists of a copper foil of standard thickness on which a resistive layer is deposited by means of electroless plating. For the realisation of capacitors in multi‐layered PCB structures, significant progress was made in the development and fabrication of very thin laminates. Higher dielectric constants of these laminate materials enable the increase of the capacitance per unit area. For inductors, both aircore (no magnetic material) and magnetic core components have been investigated.
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Thirty‐six people attended this SMART Group Seminar at the Bowler Hat Hotel in Birkenhead, Merseyside, on 20 February 1990. The technical programme in the morning comprised five…
This design‐based seminar was aimed at broadening the horizons of designers and engineers. The greatest area of cost reduction in any electronics project is in making the right…
Abstract
This design‐based seminar was aimed at broadening the horizons of designers and engineers. The greatest area of cost reduction in any electronics project is in making the right choices at the conception and design phases. This seminar was one step in this direction: a piece of 1·6 mm FR‐4 is not always the best substrate to use.