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Article
Publication date: 1 June 2000

P.Di Barba

Introduces papers from this area of expertise from the ISEF 1999 Proceedings. States the goal herein is one of identifying devices or systems able to provide prescribed…

990

Abstract

Introduces papers from this area of expertise from the ISEF 1999 Proceedings. States the goal herein is one of identifying devices or systems able to provide prescribed performance. Notes that 18 papers from the Symposium are grouped in the area of automated optimal design. Describes the main challenges that condition computational electromagnetism’s future development. Concludes by itemizing the range of applications from small activators to optimization of induction heating systems in this third chapter.

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COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, vol. 19 no. 2
Type: Research Article
ISSN: 0332-1649

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Article
Publication date: 1 April 1995

S.M. Jenei, O.S. Aleksić, L.D. Živanov and D.I. Raković

Ni‐ferrite powder average grain size less than 0.9µm was used for the ferrite paste preparation. Ferrite paste was printed on Al2O3 substrate and fired 850°C/10min. After…

57

Abstract

Ni‐ferrite powder average grain size less than 0.9µm was used for the ferrite paste preparation. Ferrite paste was printed on Al2O3 substrate and fired 850°C/10min. After Ni‐ferrite thick film characterization had been done, simple planar inductor geometry, such as square spirals, were printed on it. Measurements were done, using an HP 4194A impedance analyser. The experimental results were summarized and compared with theoretical predictions given by the electromagnetic analysis using the method of current images for the reason of accounting the effect of magnetic substrate. The computer program, developed here, allows determination of the required thickness of the substrate which will produce inductance enhancement of the given permeability of the substrate material. The same results can also be used to determine the permeability of magnetic film or substrate quickly and are directly applicable to the design of the planar inductors.

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COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, vol. 14 no. 4
Type: Research Article
ISSN: 0332-1649

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Article
Publication date: 1 August 1999

Jaroslav Mackerle

This paper gives a bibliographical review of the finite element methods (FEMs) applied to the analysis of ceramics and glass materials. The bibliography at the end of the paper…

2633

Abstract

This paper gives a bibliographical review of the finite element methods (FEMs) applied to the analysis of ceramics and glass materials. The bibliography at the end of the paper contains references to papers, conference proceedings and theses/dissertations on the subject that were published between 1977‐1998. The following topics are included: ceramics – material and mechanical properties in general, ceramic coatings and joining problems, ceramic composites, ferrites, piezoceramics, ceramic tools and machining, material processing simulations, fracture mechanics and damage, applications of ceramic/composites in engineering; glass – material and mechanical properties in general, glass fiber composites, material processing simulations, fracture mechanics and damage, and applications of glasses in engineering.

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Engineering Computations, vol. 16 no. 5
Type: Research Article
ISSN: 0264-4401

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Article
Publication date: 1 June 2000

P.Di Barba

Introduces the fourth and final chapter of the ISEF 1999 Proceedings by stating electric and magnetic fields are influenced, in a reciprocal way, by thermal and mechanical fields…

480

Abstract

Introduces the fourth and final chapter of the ISEF 1999 Proceedings by stating electric and magnetic fields are influenced, in a reciprocal way, by thermal and mechanical fields. Looks at the coupling of fields in a device or a system as a prescribed effect. Points out that there are 12 contributions included ‐ covering magnetic levitation or induction heating, superconducting devices and possible effects to the human body due to electric impressed fields.

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COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, vol. 19 no. 2
Type: Research Article
ISSN: 0332-1649

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Article
Publication date: 24 August 2018

N. Faraz and Y. Khan

This paper aims to explore the variable properties of a flow inside the thin film of a unsteady Maxwell fluid and to analyze the effects of shrinking and stretching sheet.

126

Abstract

Purpose

This paper aims to explore the variable properties of a flow inside the thin film of a unsteady Maxwell fluid and to analyze the effects of shrinking and stretching sheet.

Design/methodology/approach

The governing mathematical model has been developed by considering the boundary layer limitations. As a result of boundary layer assumption, a nonlinear partial differential equation is obtained. Later on, similarity transformations have been adopted to convert partial differential equation into an ordinary differential equation. A well-known homotopy analysis method is implemented to solve the problem. MATHEMATICA software has been used to visualize the flow behavior.

Findings

It is observed that variable viscosity does not have a significant effect on velocity field and temperature distribution either in shrinking or stretching case. It is noticed that Maxwell parameter has no dramatic effect on the flow of thin liquid fluid. It has been seen that heat flow increases by increasing the conductivity with temperature in both cases (shrinking/stretching). As a result, fluid temperature goes down when than delta = 0.05 than delta = 0.2.

Originality/value

To the best of authors’ knowledge, nobody has conducted earlier thin film flow of unsteady Maxwell fluid with variable fluid properties and comparison of shrinking and stretching sheet.

Details

International Journal of Numerical Methods for Heat & Fluid Flow, vol. 28 no. 7
Type: Research Article
ISSN: 0961-5539

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Book part
Publication date: 5 October 2018

Nima Gerami Seresht and Aminah Robinson Fayek

Fuzzy numbers are often used to represent non-probabilistic uncertainty in engineering, decision-making and control system applications. In these applications, fuzzy arithmetic…

Abstract

Fuzzy numbers are often used to represent non-probabilistic uncertainty in engineering, decision-making and control system applications. In these applications, fuzzy arithmetic operations are frequently used for solving mathematical equations that contain fuzzy numbers. There are two approaches proposed in the literature for implementing fuzzy arithmetic operations: the α-cut approach and the extension principle approach using different t-norms. Computational methods for the implementation of fuzzy arithmetic operations in different applications are also proposed in the literature; these methods are usually developed for specific types of fuzzy numbers. This chapter discusses existing methods for implementing fuzzy arithmetic on triangular fuzzy numbers using both the α-cut approach and the extension principle approach using the min and drastic product t-norms. This chapter also presents novel computational methods for the implementation of fuzzy arithmetic on triangular fuzzy numbers using algebraic product and bounded difference t-norms. The applicability of the α-cut approach is limited because it tends to overestimate uncertainty, and the extension principle approach using the drastic product t-norm produces fuzzy numbers that are highly sensitive to changes in the input fuzzy numbers. The novel computational methods proposed in this chapter for implementing fuzzy arithmetic using algebraic product and bounded difference t-norms contribute to a more effective use of fuzzy arithmetic in construction applications. This chapter also presents an example of the application of fuzzy arithmetic operations to a construction problem. In addition, it discusses the effects of using different approaches for implementing fuzzy arithmetic operations in solving practical construction problems.

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Fuzzy Hybrid Computing in Construction Engineering and Management
Type: Book
ISBN: 978-1-78743-868-2

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Article
Publication date: 6 February 2017

Dàvid Losonci, Richárd Kása, Krisztina Demeter, Balázs Heidrich and István Jenei

The purpose of this paper to examine the impact of shop floor (SF) culture (organizational culture (OC) perceived by workers) and SF subcultures assessed by the competing values…

2620

Abstract

Purpose

The purpose of this paper to examine the impact of shop floor (SF) culture (organizational culture (OC) perceived by workers) and SF subcultures assessed by the competing values framework (CVF) on the perceived use of lean production (LP) practices.

Design/methodology/approach

The authors analyse questionnaires completed by workers at the single case company undergoing a commonplace lean transformation. The survey items cover both LP items and CVF statements. The propositions are analysed applying cluster analysis and regression.

Findings

At the case company, the multidimensionality of SF culture only partially exists, and the perceived use of LP practices shows little connection to OC. The considerable differences between SF culture and SF subcultures on the one hand and among SF subcultures on the other hand indicate the existence of a special multidimensional SF culture. Altogether, SF culture’s impact on LP is weak.

Practical implications

Managers should rethink the usual lean implementation pathways and understand how values pervade SF culture and how culture types impact the perceived use of LP practices at the SF. Managers could face a trade-off: smoother lean transition by engaging in SF subculture-specific transitions and reinforcing it or by developing a homogenous lean SF culture.

Originality/value

To the best of the authors’ knowledge, this is the first empirical attempt to understand the impact of SF culture on the perceived use of LP practices by adopting a validated OC measurement tool. Furthermore, the study provides insight into workers’ subcultures.

Details

International Journal of Operations & Production Management, vol. 37 no. 2
Type: Research Article
ISSN: 0144-3577

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Book part
Publication date: 13 August 2014

Arnaldo Camuffo, Raffaele Secchi and Chiara Paolino

Rolling out lean operations practices in MNCs’ plants is a complex knowledge transfer process whose design and implementation, though critical to operations performance, to date…

Abstract

Rolling out lean operations practices in MNCs’ plants is a complex knowledge transfer process whose design and implementation, though critical to operations performance, to date has not been investigated by operations management, international business, strategy, and organizational design research. Applying conceptual tools drawn from various theoretical approaches to knowledge management, transfer and diffusion, this exploratory study: (a) classifies and interprets lean roll-out processes in MNCs, framing them in terms of (i) knowledge replication strategies (template vs. principles-based), (ii) decentralization of decision making (degree of plant autonomy), and (iii) type of organizational ambidexterity (structural vs. contextual) underlying the process; (b) develops, through seven case studies of lean roll-outs in MNCs’ plants, three testable propositions about what might enhance the lean roll-out process performance, arguing about the individual and combined effect of the three above mentioned dimensions on lean roll-out effectiveness and efficiency. We posit that an approach characterized by principles-based knowledge replication, larger decentralization, and prevalence of contextual ambidexterity positively impacts on roll-out process performance.

Details

Orchestration of the Global Network Organization
Type: Book
ISBN: 978-1-78350-953-9

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Book part
Publication date: 24 February 2023

Alfredo Estrada-Merino and Aldo Alvarez-Risco

The higher education after the pandemic has put the entire university education system to test, bringing to light the need to build a genuinely sustainable academic system…

Abstract

The higher education after the pandemic has put the entire university education system to test, bringing to light the need to build a genuinely sustainable academic system composed of administrative, pedagogical, and governance processes with a social and environmental scope and oriented to the training of resilient professionals, with the ability to manage a sustainable future. Seen from a management perspective, the actors of this system have begun to work focusing on rebuilding the postpandemic world into a sustainable planet for the continuity of humanity. Regarding students, the most affected individuals by the health crisis, UNESCO indicates that the impact of the temporary cessation of on-site activities has affected them in various dimensions in terms of student stability, bringing with it more significant evidence of crises due to social, emotional, cultural, and familiar problems, among others. In that sense, the change of means of interaction in student environments represents a negative turning point in the future of professionals who are now receiving education. This allows us to reflect on the high risks involved in achieving the acquisition of not only technical and specific skills and competencies of the professional specialties but also social, ethical, and citizenship skills that take much greater relevance, especially in this context.

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Article
Publication date: 1 April 2003

G.J. Carchon, W. De Raedt and E. Beyne

High Q on‐chip inductors and low loss on‐chip interconnects and transmission lines are an important roadblock for the further development of Si‐based technologies at RF and…

480

Abstract

High Q on‐chip inductors and low loss on‐chip interconnects and transmission lines are an important roadblock for the further development of Si‐based technologies at RF and microwave frequencies. In this paper, inductors are realized on standard Si wafers (20 Ω.cm) using MCM‐D processing. This consists of realizing two low K dielectric layers (BCB) and a thick Cu interconnect layer. Inductors with 5 μm lines and spaces are demonstrated for a 5 μm thick Cu layer, hereby leading to a very compact and high performance inductors: Q‐factors in the range of 25 to 30 have been obtained for inductances in the range of 1 to 5 nH. It is also shown how the Q‐factor and resonance frequency vary as a function of the inductor layout parameters and the thickness of the BCB and Cu layers. The realized 50 Ω CPW lines (lateral dimension of 40 μm) have a measured loss of only 0.2 dB/mm at 25 GHz.

Details

Microelectronics International, vol. 20 no. 1
Type: Research Article
ISSN: 1356-5362

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