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The purpose of this paper is to develop a hybrid additive/subtractive manufacturing platform for the production of high density ceramic components.

Fabrication of near-net shape components is achieved using 96 per cent Al3O2 ceramic paste extrusion and a planarizing machining operations. Sacrificial polymer support can be used to aid the creation of overhanging or internal features. Post-processing using a variety of machining operations improves tolerances and fidelity between the component and CAD model while reducing defects.

This resultant three-dimensional monolithic ceramic components demonstrated post sintering tolerances of ±100 µm, surface roughness’s of ∼1 µm Ra, densities in excess of 99.7 per cent and three-point bending strength of 221 MPa.

This method represents a novel approach for the digital fabrication of ceramic components, which provides improved manufacturing tolerances, part quality and capability over existing additive manufacturing approaches.

This paper aims to demonstrate the improved functionality of additive manufacturing technology provided by combining multiple processes for the fabrication of packaged electronics.

This research is focused on the improvement in resolution of conductor deposition methods through experimentation with build parameters. Material dispensing with two different low temperature curing isotropic conductive adhesive materials was characterised for their application in printing each of three different conductor designs, traces, z-axis connections and fine pitch flip chip interconnects. Once optimised, demonstrator size can be minimised within the limitations of the chosen processes and materials.

The proposed method of printing z-axis through layer connections was successful with pillars 2 mm in height and 550 µm in width produced. Dispensing characterisation also resulted in tracks 134 µm in width and 38 µm in height allowing surface mount assembly of 0603 components and thin-shrink small outline packaged integrated circuits. Small 149-µm flip chip interconnects deposited at a 457-µm pitch have also been used for packaging silicon bare die.

This paper presents an improved multifunctional additive manufacturing method to produce fully packaged multilayer electronic systems. It discusses the development of new 3D printed, through layer z-axis connections and the use of a single electrically conductive adhesive material to produce all conductors. This facilitates the surface mount assembly of components directly onto these conductors before stereolithography is used to fully package multiple layers of circuitry in a photopolymer.

This paper aims to explore the potential of ultrasonic additive manufacturing (UAM) to incorporate the direct printing of electrical materials and arrangements (conductors and insulators) at the interlaminar interface of parts during manufacture to allow the integration of functional and optimal electrical circuitries inside dense metallic objects without detrimental effect on the overall mechanical integrity. This holds promise to release transformative device functionality and applications of smart metallic devices and products.

To ensure the proper electrical insulation between the printed conductors and metal matrices, an insulation layer with sufficient thickness is required to accommodate the rough interlaminar surface which is inherent to the UAM process. This in turn increases the total thickness of printed circuitries and thereby adversely affects the integrity of the UAM part. A specific solution is proposed to optimise the rough interlaminar surface through deforming the UAM substrates via sonotrode rolling or UAM processing.

The surface roughness (Sa) could be reduced from 4.5 to 4.1 µm by sonotrode rolling and from 4.5 to 0.8 µm by ultrasonic deformation. Peel testing demonstrated that sonotrode-rolled substrates could maintain their mechanical strength, while the performance of UAM-deformed substrates degraded under same welding conditions ( approximately 12 per cent reduction compared with undeformed substrates). This was attributed to the work hardening of deformation process which was identified via dual-beam focussed ion beam–scanning electron microscope investigation.

The sonotrode rolling was identified as a viable methodology in allowing printed electrical circuitries in UAM. It enabled a decrease in the thickness of printed electrical circuitries by ca. 25 per cent.

May 17, 1973 Industrial Relations — Unfair dismissal — Employee's notice to terminate employment accepted — Subsequent unfair dismissal during period of notice — Whether employee could unilaterally withdraw notice.

Humanity faces many crises – climate change, food insecurity, persistent poverty – what Brown, Harris, and Russell (2010) call wicked problems. These problems implicate us all, with possible solutions transcending disciplinary, organizational, and national boundaries. Therefore educators need to nurture graduates able to engage as future practitioners – and citizens – in seeking solutions which recognize “the personal, the local and the strategic, as well as specialized contributions to knowledge” (Brown et al., 2010, p. 4).

A model of service-learning which draws on the principles of social pedagogy, cultural-based learning and co-production provides the foundations for a more reflexive pedagogy, supporting the “development of student attention, emotional balance, empathetic connection, compassion and altruistic behavior” (Zajonc, 2013, p. 83). This approach advocates that community organizations play a pivotal role in co-designing knowledge. Drawing on an applied research module at University of Wolverhampton this chapter will argue that by engaging community groups as co-producers of knowledge, learning can be extended beyond students to the wider community (Murphy & Joseph, 2019). Not only will this enhance the potential of service learning to benefit the community and the students, but it has the potential to produce graduates more sensitive to the needs of communities themselves.

The article argues that local social networks are crucial to addressing the perceived shortfall in ‘respect’ and civility. Meanings of ‘respect’ are explored and older people's narratives of the decline of neighbourliness are used to explore the sense that for many people ‘community’ has been lost. It is argued that policy and practice have a role to play in the reinvigoration of local social networks.

This chapter reviews the evidence on the role of physicians in shaping inequalities in access to and utilisation of healthcare. The authors examine three types of physician decisions that can influence inequalities in access and utilisation: location decisions, decisions to work in the public and/or private sector, and decisions or behaviours in the doctor–patient encounter. For each, the authors summarise the issues and empirical evidence on possible policies to help reduce inequalities in access. Future research to reduce inequalities should focus on changes to health systems that influence physician decisions, such as health insurance expansions, the public–private mix and financial incentives, as well as physician training and policies for a more diverse physician workforce.

A growing body of work suggests that welfare and punishment should be understood as alternative, yet interconnected ways of governing poor and marginalized populations. While there is considerable evidence of a punitive turn in welfare and penal institutions over the past half century, recent studies show that welfare and carceral institutions increasingly comanage millions of people caught at the intersection of the welfare and penal sectors. The growth of “mass supervision” and the expansion of the social services sector help explain the blurring of welfare and punishment in the United States in daily practice. We suggest that these developments complicate the idea of an institutional trade-off and contend that welfare and punishment are best understood along a continuum of state management in which poor and socially marginalized populations are subjected to varying degrees of support, surveillance, and sanction. In presenting the punishment–welfare continuum, we pay particular attention to the “murky middle” between the two spheres: an interinstitutional space that has emerged in the context of mass supervision and a social services–centric safety net. We show that people caught in the “murky middle” receive some social supports and services, but also face pervasive surveillance and control and must adapt to the tangle of obligations and requirements in ways that both extend punishment and limit their ability to successfully participate in mainstream institutions.

Scholarship on reputation in and of organizations has been going on for decades, and it always has separated along level of analysis issues, whereby the separate literatures on individual, group/team/unit, and organization reputation fail to acknowledge each other. This sends the implicit message that reputation is a fundamentally different phenomenon at the three different levels of analysis. We tested the validity of this implicit assumption by conducting a multilevel review of the reputation literature, and drawing conclusions about the “level-specific” or “level-generic” nature of the reputation construct. The review results permitted the conclusion that reputation phenomena are essentially the same at all levels of analysis. Based on this, we frame a future agenda for theory and research on reputation.