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This paper focuses on the renewed interest in the use of condensation, or vapour‐phase, soldering in lead‐free surface mount assembly soldering and notes also the corresponding legislation, which will preclude the use of lead‐based solders in most applications by 2006. The process is once again becoming popular, because of the absolute control of soldering temperature, and because high‐quality batch and in‐line equipment is now available. It notes that condensation heating with perfluorocarbon liquids and present well‐designed equipment can be used not only in the mass‐assembly of electronic circuit boards, but also for a large variety of other heating tasks in many industries.

Since its early conception, the group has grown from a handful of enthusiastic engineers to the largest trade association in Europe, if not the world, for Surface Mount. As in previous years, SMART will be arranging Seminars, Hands‐on Workshops and Open Forums, giving valuable knowledge for those just entering or those already experienced in SMT. Open forums allow the opportunity for the exchange of information on a variety of different topics, building experience in the technology which would otherwise be unobtainable.

This conference, in the series being run by the National Physical Laboratory to help the electronics assembly industry consider the problems of CFC phase‐out, was essentially an updated repeat of the event held on 30 April, which had been a complete, standing‐room‐only sell‐out. Surprisingly, this repeat performance also attracted a full house and the format used has proved to be the most popular of all the NPL non‐CFC options conferences.

Since its early conception, the group has grown from a handful of enthusiastic engineers to the largest trade association in Europe, if not the world, for Surface Mount. As in previous years, SMART will be arranging Seminars, Hands‐on Workshops and Open Forums, giving valuable knowledge for those just entering or those already experienced in SMT. Open forums allow the opportunity for the exchange of information on a variety of different topics, building experience in the technology which would otherwise be unobtainable.

Design for manufacture and testability seems to be a very hot topic. This seminar organised by Bob Willis was over‐subscribed within the first two weeks of announcement, and the standby places were already sufficient to warrant a repeat seminar during September. This will be held in Chelmsford on 9 September.

A large group of SMART Group members visited the Henley premises of Electrovert on 9 May. After the welcome and introduction where Mike Judd emphasised Electrovert's commitment to SMT, a number of papers were presented by the Electrovert team during the morning session.

The decision to split Internepcon/UK into two component parts, the production and the packaging sectors, seemed justified in April when over 9,000 representatives from the electronics industry visited the Show over its three‐day duration.

Title: BABS One‐day Seminar: ‘Nitrogen or New Soldering Processes’ Date: 21 April 1993 Venue: Institute of Materials, London Title: BABS One‐day Seminar: ‘Challenges for Soldering Electronics in the 1990s’ Date: September 1993 (to be decided) Venue: To be decided Title: BABS Two‐day Autumn Conference Dates: 20–21 October 1993 Venue: To be decided Further details of the above events are available from: BABS Secretariat, c/o The Welding Institute, Abinaton Hall, Abinaton, Cambridge CB1 6AL. Telephone: (0223) 891162. Fax: (0223) 892588.

The purpose of this paper is to illustrate the generation of basic garment pattern using three‐dimensional body measurement data.

A pre‐defined garment model is deformed using free‐form deformation method and the model is flattened to generate flat patterns.

The paper finds that individual basic garment patterns are automatically generated and verified to be well fit on human subjects.

The current approach is to focus on the generation of basic bodice patterns; however, other patterns can also be generated by this method by preparing more garment models.

This method can reduce the time required to design basic patterns as well as enhance their fitness.

The automatic generation of individually fitted garment pattern is one of the most important steps in future garment production process.