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Article
Publication date: 23 November 2010

Keryn Lian, Manes Eliacin, Robert Lempkowski, Marc Chason, Matthew O'Keefe and James Drewniak

The purpose of this paper is to present a new class of printed circuit board (PCB)‐based, radio frequency micro‐electro‐mechanical systems (RF‐MEMS) switches and to describe the…

674

Abstract

Purpose

The purpose of this paper is to present a new class of printed circuit board (PCB)‐based, radio frequency micro‐electro‐mechanical systems (RF‐MEMS) switches and to describe the packaging method and evaluate performance.

Design/methodology/approach

Traditional PCB materials and processes were combined with photolithographic high‐density interconnect (HDI) and MEMS to form 3D high‐performance RF switches.

Findings

A new type of MEMS RF switch has been developed on a PCB platform. Using processes analogous to those used for silicon MEMS, PCB, and HDI technologies were utilized to fabricate these 3D structures. The PCB‐based microstructures are “mil‐scale” rather than the “micro‐scale” of silicon MEMs. A co‐fabrication packaging method for the MEMS RF switch was also developed. The PCB‐based MEMS switches have demonstrated excellent RF performance and “hot‐switching” RF power‐handling capability. PCB‐based MEMS RF switches have the advantages of low cost and amenability to scale‐up for a high degree of integration.

Research limitations/implications

Further development on photo imageable dielectric materials will enable this technology to improve yield and processability.

Originality/value

The paper describes the development of PCB‐based MEMS RF switches. These elements will enable new applications and enhance the functionality of PCBs. They are also more amenable to system integration compared with silicon MEMS.

Details

Circuit World, vol. 36 no. 4
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 December 2002

47

Abstract

Details

Circuit World, vol. 28 no. 4
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 21 August 2009

Keryn Lian, Shawn O'Rourke, Daniel Sadler, Claudia Gamboa, Robert Terbrueggen and Marc Chason

The purpose of this paper is to present the development of printed wiring board (PWB)‐based microfluidic building blocks and their integration into systems for DNA amplification…

393

Abstract

Purpose

The purpose of this paper is to present the development of printed wiring board (PWB)‐based microfluidic building blocks and their integration into systems for DNA amplification and electronic detection.

Design/methodology/approach

Technologies from embedded passives (EP) and photolithographic high‐density interconnect are integrated into a traditional PWB platform to enable multifunctional electrochemical sensors for on‐chip detection of biological assays.

Findings

PWB materials and processes can be applied to develop microelectromechanical systems (MEMS) and microfluidic systems. On‐chip heaters using EP have been demonstrated with excellent accuracy. The on‐chip heaters can be used for localized temperature control as well as heat air pumps. The integration of EP and microchannels is a promising approach to add functionalities to the PWB‐based microsystems.

Research limitations/implications

Further integration of microchannels with the embedded heaters and electrochemical sensors will increase the compactness, functionality, and value of the PWB‐based microfluidic systems.

Originality/value

The paper describes the development and integration of PWB‐based building‐blocks such as EP and microchannels for MEMS and microfluidic applications. These elements will enable new applications and enhanced functionalities of PWB.

Details

Circuit World, vol. 35 no. 3
Type: Research Article
ISSN: 0305-6120

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