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The purpose of this paper is to develop a hybrid additive/subtractive manufacturing platform for the production of high density ceramic components.

Fabrication of near-net shape components is achieved using 96 per cent Al3O2 ceramic paste extrusion and a planarizing machining operations. Sacrificial polymer support can be used to aid the creation of overhanging or internal features. Post-processing using a variety of machining operations improves tolerances and fidelity between the component and CAD model while reducing defects.

This resultant three-dimensional monolithic ceramic components demonstrated post sintering tolerances of ±100 µm, surface roughness’s of ∼1 µm Ra, densities in excess of 99.7 per cent and three-point bending strength of 221 MPa.

This method represents a novel approach for the digital fabrication of ceramic components, which provides improved manufacturing tolerances, part quality and capability over existing additive manufacturing approaches.

This paper aims to demonstrate the improved functionality of additive manufacturing technology provided by combining multiple processes for the fabrication of packaged electronics.

This research is focused on the improvement in resolution of conductor deposition methods through experimentation with build parameters. Material dispensing with two different low temperature curing isotropic conductive adhesive materials was characterised for their application in printing each of three different conductor designs, traces, z-axis connections and fine pitch flip chip interconnects. Once optimised, demonstrator size can be minimised within the limitations of the chosen processes and materials.

The proposed method of printing z-axis through layer connections was successful with pillars 2 mm in height and 550 µm in width produced. Dispensing characterisation also resulted in tracks 134 µm in width and 38 µm in height allowing surface mount assembly of 0603 components and thin-shrink small outline packaged integrated circuits. Small 149-µm flip chip interconnects deposited at a 457-µm pitch have also been used for packaging silicon bare die.

This paper presents an improved multifunctional additive manufacturing method to produce fully packaged multilayer electronic systems. It discusses the development of new 3D printed, through layer z-axis connections and the use of a single electrically conductive adhesive material to produce all conductors. This facilitates the surface mount assembly of components directly onto these conductors before stereolithography is used to fully package multiple layers of circuitry in a photopolymer.

This paper aims to explore the potential of ultrasonic additive manufacturing (UAM) to incorporate the direct printing of electrical materials and arrangements (conductors and insulators) at the interlaminar interface of parts during manufacture to allow the integration of functional and optimal electrical circuitries inside dense metallic objects without detrimental effect on the overall mechanical integrity. This holds promise to release transformative device functionality and applications of smart metallic devices and products.

To ensure the proper electrical insulation between the printed conductors and metal matrices, an insulation layer with sufficient thickness is required to accommodate the rough interlaminar surface which is inherent to the UAM process. This in turn increases the total thickness of printed circuitries and thereby adversely affects the integrity of the UAM part. A specific solution is proposed to optimise the rough interlaminar surface through deforming the UAM substrates via sonotrode rolling or UAM processing.

The surface roughness (Sa) could be reduced from 4.5 to 4.1 µm by sonotrode rolling and from 4.5 to 0.8 µm by ultrasonic deformation. Peel testing demonstrated that sonotrode-rolled substrates could maintain their mechanical strength, while the performance of UAM-deformed substrates degraded under same welding conditions ( approximately 12 per cent reduction compared with undeformed substrates). This was attributed to the work hardening of deformation process which was identified via dual-beam focussed ion beam–scanning electron microscope investigation.

The sonotrode rolling was identified as a viable methodology in allowing printed electrical circuitries in UAM. It enabled a decrease in the thickness of printed electrical circuitries by ca. 25 per cent.

Wafer-level stencil printing of a type-6 Pb-free SAC solder paste was statistically evaluated at 200 and 150 μm pitch using three different stencil manufacturing technologies: laser cutting, DC electroforming and micro-engineered electroforming. This investigation looks at stencil differences in printability, pitch resolution, maximum achievable bump height, print co-planarity, paste release efficiency, and cleaning frequency. The paper aims to discuss these issues.

In this paper, the authors present a statistical evaluation of the impact of stencil technology on type-6 tin-silver-copper paste printing. The authors concentrate on performances at 200 and 150 μm pitch of full array patterns. Key evaluated criteria include achievable reflowed bump heights, deposit co-planarity, paste release efficiency, and frequency of stencil cleaning. Box plots were used to graphically view print performance over a range of aperture sizes for the three stencil types.

Fabrication technologies significantly affect print performance where the micro-engineered electroformed stencil produced the highest bump deposits and the lowest bump height deviation. Second in performance was the conventional electroformed, followed by the laser-cut stencil. Comparisons between the first and fifth consecutive print demonstrated no need for stencil cleaning in the case for the micro-engineered stencil for all but the smallest spacings between apertures. High paste transfer efficiencies, i.e. above 85 per cent, were achieved with the micro-engineered stencil using low aperture area ratios of 0.5.

Stencil technology influences the maximum reflowed solder bump heights achievable, and bump co-planarity. To date, no statistical analysis comparing the impact of stencil technology for wafer-level bumping has been carried out for pitches of 200 μm and below. This paper gives new insight into how stencil technology impacts the print performance for fine pitch stencil printing. The volume of data collected for this investigation enabled detailed insight into the limitations of the printing process and as a result for suitable design guidelines to be developed. The finding also shows that the accepted industry guidelines on stencil design developed by the surface mount industry can be broken if the correct stencil technology is selected, thereby increasing the potential application areas of stencil printing.

The purpose of this paper is to present a detailed overview of the current stencil printing process for microelectronic packaging.

This paper gives a thorough review of stencil printing for electronic packaging including the current state of the art.

This article explains the different stencil technologies and printing materials. It then examines the various factors that determine the outcome of a successful printing process, including printing parameters, materials, apparatus and squeegees. Relevant technical innovations in the art of stencil printing for microelectronics packaging are examined as each part of the printing process is explained.

Stencil printing is currently the cheapest and highest throughput technique to create the mechanical and electrically conductive connections between substrates, bare die, packaged chips and discrete components. As a result, this process is used extensively in the electronic packaging industry and therefore such a review paper should be of interest to a large selection of the electronics interconnect and assembly community.

In this chapter we argue that a theoretical position derived from a combination of autopoietic theory and complexity theory provides a means for addressing two fundamental problems with the knowledge management (KM) concept. These problems are a lack of consistent epistemology — inadequate theorization about the nature of knowledge and a tendency to identify knowledge as residing primarily at the level of individuals. It represents an opportunity to move away from the reified view of knowledge that dominates most discussions of KM to one of knowledge which is deeply situated and contextualized. We argue that organizations are complex systems of a particular class; they comprise human (biological, reflexive) agents. This has important implications for the range and type of behaviors we can expect from organizations, but it also has implications for how we theorize about them.

Many approaches to understanding organization change approach “the organization” as a relatively static entity. Punctuated equilibrium models have also become popular, but here too the notion of unfreeze–change–refreeze suggests change as an exception — a break with the more normal stability upon which organizational control is predicated (Taplikis, 2005). By contrast, Tsoukas and Chia (2002, p. 570) have argued that “Change must not be thought of as a property of organization. Rather, organization must be understood as an emergent property of change. Change is ontologically prior to organization — it is the condition of possibility for organization.” Intuitively we agree with their position. However, it raises some significant questions for practitioners, principal among them: If change is constitutive of the organization rather than something which managers can control, then to what extent can change be subject to strategic influence?

Organizations are becoming increasingly aware of the importance of aligning information systems with organizational processes, goals and strategies. One way of representing and analysing strategic alignment is through the creation of a causal‐loop diagram, a subject which this paper seeks to examine.

The exploratory research presented here involved six senior IS/IT managers during three two‐hour focus group sessions, which led to the development of such a diagram. The focus group sessions were recorded, transcribed and analysed using content analysis.

The diagram presents a systemic view of IS/business alignment within organizations, as seen through the lens of these practitioners. The research suggests that, although practitioners understand that a high level of connection between IS and business planning processes may be dependent on the level of integration between the IS group and other sections of the organization, they are still unable to develop the necessary relationships. It appears that the culture of many organizations is impeding the development of this integration.

The research method and technique allowed a systemic view of IS/business alignment within a typical organization. It highlights the inter‐relationship between the social and intellectual dimensions of alignment and shows that these should not be studied in isolation. In particular, the research highlights the inter‐relationship between the social and intellectual dimensions of alignment.

The metaphor which is central to all of the activities at the Centre for Systemic Development at the University of Western Sydney, Hawkesbury, is that of the critical learning system (CLS), a construct developed as the framework for the systemic education of students in the School of Agriculture and Rural Development at Hawkesbury. CLSs are construed as coherent groups of individuals who are co‐operating together, in learning how to learn collectively to deal with complex matters which are relevant to their own sustainable development as organizations (or more typically, organizational units). The action researching processes common to the centre’s research and consultancy activities, its postgraduate curricula, and its own management practices, are all grounded in experiential learning principles and practices as informed by systems theories and philosophies. The research/consultancy staff and the postgraduate students work together in collaboration with “real‐world” clients who are committed to the sustainable development of their own organizations and/or communities, while bringing a CLS perspective to their programmes and projects. From this CLS perspective, the crucial competences for all those concerned with the sustainable development of organizations, are to understand, create and use CLSs as their vehicles for informed change about, and in, a complex world. Addresses the logic, concepts and methods of the CLS approach, as a contribution to debates about the utility of the learning organization approach to development.