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The purpose of this paper is to characterize the motivations used into migrating to lead‐free solder by providing examples and directions for those making the material change.

This work achieves its objective of identifying which electronic industry actions towards lead‐free soldering have been successful and why. The research reported the various motivating factors considered in adopting lead‐free electronics. To that end, the authors researched industry literature and discussed approaches with various companies and agencies. The scope of this paper is largely the board‐component level soldering process and companies involved in the international electronics industry.

The motivation to migrate to lead‐free solder has been and continues to be multi‐faceted. Issues include regulatory, commercial, and technical. Processing with lead‐free solder is successful, so the electronics industry's move towards environmentally compatible processes will meet regulated dates for change.

A company can learn how to incorporate environmental improvement principles resulting from the migration to lead‐free solder. Using that migration as a case study, the company can realize additional benefits by applying these principles to other product lines. Those interested in developing environmentally friendly products and processes can adopt the lessons that this paper identifies. Incorporation of lead‐free techniques, rather than resistance to change, is the result of adopting the lessons.

The paper presents a synopsis of the electronic industry's migration to lead‐free products and processes. It compares motivations for change that other studies have not compared. Manufacturers searching for direction and example to meet waste minimization goals will find the paper useful in providing such.

This paper seeks to investigate the electronics industry's reaction to environmental regulations specifically in terms of lead‐free solders and halogen‐free flame‐retardants (FRs).

This work achieves its objective by discussing the various international environmental regulations pertaining to electronics manufacturing and relating the industry reactions to those regulations. It also provides the market trends related to lead‐ and halogen‐free products. The electronics industry is pursuing lead‐free solders and halogen‐free FRs, in part due to regulations. However, the paper includes examples of how the industry is successful in implementing environmentally friendly changes.

The authors compared regulations from Japan, the European Union, the USA, and China. While the regulations themselves vary in scope, industry actions to find alternatives do have common purposes. Electronics manufacturers recognize that environmentally motivated changes are beneficial in terms of waste minimization.

Electronics manufacturers that are interested in green design will benefit from understanding present regulations. They will also benefit from the included examples of product and process improvement for the purpose of environmental compatibility.

This paper derives its perspective from a similar review of literature and company findings that the authors completed in 2006. As refinement of the regulations has continued, the electronics industry has developed improvements in basic materials and processes.

The purpose of this paper is to investigate the electronic industry's reaction to environmental regulations specifically in terms of lead‐free solders and halogen‐free flame‐retardants (FRs).

This work achieves its objective by discussing the various international regulations pertaining to electronics manufacturing and relating the industry reactions to those regulations. The electronics industry is pursuing lead‐free solders and halogen‐free FRs, in part due to regulations. However, the paper includes examples of how the industry is successful in implementing environmentally friendly changes.

The authors compared regulations from Japan, the European Union, and the US. While the regulations themselves vary in scope, industry actions to find alternatives do have common purposes. Electronics manufacturers recognize that environmentally motivated changes are beneficial in terms of waste minimization. Regardless of the regulatory motivation, minimization does lead to energy and economic efficiency.

Electronics manufacturers that are interested in green design will benefit from understanding present regulations. They will also benefit from the included examples of product and process improvement for the purpose of environmental compatibility. The paper includes specific examples of material alternatives to banned substances.

This paper derives its perspective from a similar review of literature and company findings that the authors completed in 2001. As refinement of the regulations has continued, the electronics industry has developed improvements in basic materials and processes.

Eliminating lead in electronics is an environmentally considerate approach that is made prior to manufacture. Recently enacted legislation encourages increased recycling of electrical and electronic products. However, recycling is typically an end‐of‐use action occurring just before final disposal. From an environmentally‐considerate perspective, lead elimination or replacement is a better approach. Short of having a definitive study to follow, industry, regulators, and consumers are proceeding with the change. Various lead‐free alloys have been tested and used for electronic components and assemblies. There are many replacements for eutectic tin‐lead solder, and alloys containing tin, silver, copper, and bismuth have been used successfully. Assessing how the electronics industry is addressing the change to lead‐free materials and processes requires answers to various questions. These questions regard the effects of changes to electronic products and their processes. What drives lead‐free migration, how processes can develop, and when products will be available are issues which define the assessment.