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Article
Publication date: 1 March 2001

91

Abstract

Details

Assembly Automation, vol. 21 no. 1
Type: Research Article
ISSN: 0144-5154

Keywords

Article
Publication date: 1 June 2005

Ilpo Karjalainen, Teemu Sandelin, Riku Heikkilä and Reijo Tuokko

Aims to research the possibilities of using piezoelectric technology to improve accuracy and other characteristics of parallel servo grippers.

Abstract

Purpose

Aims to research the possibilities of using piezoelectric technology to improve accuracy and other characteristics of parallel servo grippers.

Design/methodology/approach

The paper presents in detail two different kinds of developed two‐fingered servo grippers based on piezoelectric technology with parallel moving mechanics. The first gripper is based on standing wave ultrasonic motors. The other gripper is a traditional gripper, the characteristics of which have been improved with integrated piezoelectric stack actuators. Both servo grippers have been tested and the test results and experiences are introduced in the paper.

Findings

It is possible to improve the accuracy and characteristics of a parallel servo gripper with piezoelectric technology.

Research limitations/implications

In the future it is necessary to concentrate on the mechanical design of gripper bodies and the fingers. Grasping force feedback signal should be even more linear and noiseless.

Practical implications

Piezoelectric stack actuator's limited displacement is a problem in many practical applications when elastic or rough surface parts are handled. When integrated piezoelectric stacks are used with servo grippers, it is very important to focus on gripper's mechanical design and especially on the mechanical rigidity for getting the best possible results.

Originality/value

Further developed versions of these servo grippers can be used in high accuracy industry applications instead of traditional servo gripper technologies.

Details

Assembly Automation, vol. 25 no. 2
Type: Research Article
ISSN: 0144-5154

Keywords

Article
Publication date: 1 March 2004

Ilpo Karjalainen, Teemu Sandelin, Jani Uusitalo and Reijo Tuokko

Currently, adhesive films are replacing glue in many applications in semiconductor packaging and microelectronic assembly. When adhesive films are used to mount components on a…

Abstract

Currently, adhesive films are replacing glue in many applications in semiconductor packaging and microelectronic assembly. When adhesive films are used to mount components on a PCB, the success of the automatic joining operation depends on many different things. Manufacturers of adhesives use three main values when they are discussing processing parameters in their data sheets. The paper describes in detail the concept of the developed assembly environment for making test joints of miniature and MEMS components using adhesive films.

Details

Assembly Automation, vol. 24 no. 1
Type: Research Article
ISSN: 0144-5154

Keywords

Content available
Article
Publication date: 22 February 2008

76

Abstract

Details

Assembly Automation, vol. 28 no. 1
Type: Research Article
ISSN: 0144-5154

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