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The analysis of the processes determining unemployment in an open economy has been considerably advanced by the work of Layard, Nickell and Jackman in their book Unemployment: Macroeconomic Performance and the Labour Market. Reviews their contribution. They have developed an analysis based on the role of the “wedge” between the producer and consumer wages. This wedge depends, in part, on the real exchange rate. A change in the wedge may change the bargain between unions and employers. If it does, then a change in the real exchange rate may change the equilibrium level of unemployment. It is frequently claimed that this is, indeed, the case. Argues that the theoretical and empirical support for this proposition is rather weak.

Aim of the present monograph is the economic analysis of the role of MNEs regarding globalisation and digital economy and in parallel there is a reference and examination of some legal aspects concerning MNEs, cyberspace and e‐commerce as the means of expression of the digital economy. The whole effort of the author is focused on the examination of various aspects of MNEs and their impact upon globalisation and vice versa and how and if we are moving towards a global digital economy.

The purpose of this study/paper is regarding analysis of electrical discontinuity in penultimate layer of a few batches of Multilayer Boards (MLB) fabricated and supplied by a vendor. The ever-increasing demand of miniaturization in launch vehicle and spacecraft electronics systems has led to the usage of multilayer printed circuit boards (PCBs) for realizing high-performance electronics circuitry. Multilayer boards (MLBs) fabricated by qualified agencies based on the customer requirement are being used in the critical launch vehicle/spacecraft systems after evaluating the preliminary test results supplied by the vendor. However, a few batches of MLBs fabricated and supplied by a particular vendor (“A”) showed a discontinuity problem in a few PCB tracks connected by soldering pads. As these MLBs are part of Flight critical systems of both launch vehicle and spacecraft, a malfunction in the board may lead to fatal errors during fight or on-orbit, thereby jeopardizing the mission.

A systematic approach was followed to have a thorough understanding of the problem, and major tests such as inspection, continuity measurement, microsection of the plated through hole (PTH) and Scanning Electron Microscopy–Energy Dispersive X-ray Analysis tests were conducted on identified test boards based on Ishikawa model. Emphasis was given for horizontal microsection, as it has got a clear edge in detecting defects at any point of PTH barrel to inner-layer copper interface.

Systematic testing and evaluation on specimen revealed the presence of unwanted material at the bonding area of inner-layer copper and PTH copper due to inadequate fabrication process. The un-cleaned epoxy materials present at the bonding area creates a weak bond between barrel and inner-layer copper. Electrical strength of the MLB is the strength of this link. This weaker interconnection leads to electrical discontinuity of inner-layer tracks.

MLBs are part of Flight critical systems of both Launch Vehicle and Spacecraft; a malfunction in the board may lead to fatal errors during fight or on-orbit, thereby jeopardizing the mission. Case study of an original failure observed in MLBs helped to achieve normal functioning of systems and avoided failures at later stage of mission.

In both decorative and industrial applications of gold plating, but even more critically in the latter, accurate measurement of coating thickness is of vital importance to both the manufacturer and the user. To the former, working to increasingly stringent specifications, it may, in extreme cases, mean the difference between profit and loss if an excessive thickness is inadvertently applied due to some change in electrolyte or processing conditions, or if an unduly high average thickness must be used on barrel or vat plated components to ensure a minimum requirement on functional areas. To the user, it can equally mean the difference between operational success and failure of a gold plated part if plating thickness is below specification and the means used for measurement are not sufficiently precise to detect this. Control of coating thickness in gold plating is therefore a matter of vital concern, and never more so than at the present time when, in the face of the spectacular price increases of recent years, and in the virtual absence of viable alternatives to meet the exacting demands of applications in printed circuitry, semiconductor technology and the electronics industry in general, the need for maximum economy in gold usage has become increasingly urgent, as evidenced by the vigorous efforts currently devoted to the development and improvement of selective plating techniques, and the recent interest manifest in the possible replacement of essentially pure gold coatings by alloy deposits of 18 carat and lower where these may be technically acceptable. The present article offers a wide‐ranging survey of methods available for thickness measurement, with particular reference to gold plating, but including also some techniques which, whilst not finding current use, may be of potential interest in this context. This is the second and final part of this article, the first having appeared in Volume 1, Number 1, October (1974).

The importance of the quality of the plated‐through‐hole copper barrel in double‐sided and multilayer PCBs is considered with regard to the problem of voids and blowholes in the solder fillet. The thickness of the copper, and its integrity and adherence to the drilled surface define its ability to withstand the pressure burst of gas from the outgassing laminate during the few seconds of the thermal spike induced by the molten solder prior to solidification. The ability of copper electroplate to bridge over areas devoid of electroless copper and produce a barrel free of pinholes is shown to be crucial to this problem. In addition, the use of a nickel layer is shown to enhance greatly the impermeability of the barrel to the evolving gases.

One family of defects in soldered electronic assemblies that is almost invariably re‐worked is that due to outgassing, manifested as visible blowholes and solder blow‐out. It is known that re‐working can be very detrimental to the service life of an electronic assembly and should be avoided whenever possible. This paper describes work aimed to determine whether outgassing faults such as blowholes are harmful to service performance or whether more harm will be done by re‐working such faults. Standard test plated‐through‐hole (PTH) assemblies with controlled degrees of outgassing faults have been subjected to mechanical testing, thermal shock testing, mechanical fatigue, low cycle thermal fatigue and corrosion testing. Measurements in all these régimes have been carried out quantitatively with baseline controls. No evidence of significant loss of solder joint performance has been found, even for severe cases of solder loss. On the contrary, in cyclic fatigue testing, solder fillets with outgassing faults exhibit statistically significant performance enhancement. The conspicuous nature of blowholing and solder blow‐out undoubtedly over‐emphasises the problem during visual quality control inspection. Provided the copper barrel has been wet by the solder, outgassing faults should not be re‐worked. These faults should be used as process indicators and to draw attention to processes and the need for process control.

For zero‐defect wave soldering of double‐sided and multilayer printed circuit boards, the copper through‐hole‐plating must be impervious to gas generated in the laminate for the period of a few seconds while the solder is molten. The kinetics of the gas evolution during soldering have been related quantitatively to the integrity of the plated copper. This in turn is related to the quality of the electroless copper (evaluated using the backlighting test), the nature and distribution of the catalyst (evaluated using X‐ray photoelectron spectroscopy) and the methods and effectiveness of the hole‐wall preparation (evaluated using scanning electron microscopy). The relevance of laboratory measurements has been confirmed on a wide range of industrial production plating lines.