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The purpose of this paper is to understand the effect of pressurized steam on surface changes, structures of intermetallic particles and corrosion behavior of AA1050 aluminium.

Industrially pure aluminium (AA1050, 99.5 per cent) surfaces were exposed to pressurized steam produced from a commercial pressure cooker at the maximum temperature of 116oC for 10 min. Surface morphology was observed using SEM‐EDX and FIB‐SEM. Phase identification and compositional depth profiling were investigated using XRD and GDOES, respectively. Potentiodynamic polarization measurements were used to study corrosion behavior.

A 590 nm boehmite oxide layer was generated on AA1050 associated with partially dissolved and/or fallen off Fe‐containing intermetallic particles after exposure to pressurized steam. A significant reduction (25 times) in anodic and cathodic reactivities was observed due to the formation of the compact oxide layer.

This paper reveals a detailed investigation of how pressurized steam can affect the corrosion behaviour of AA1050 aluminium and the structure of Fe‐containing intermetallic particles.

The purpose of this paper is to study how cryogenic CO₂ cooling during the welding process affects corrosion behaviour of friction stir welding (FSW) AA7010‐T7651.

Friction stir welded AA7010‐T7651 was produced with a rotation speed of 288 rpm and a travel speed of 58 mm/min. The liquid CO₂ was sprayed onto the weld centre line immediately after the toolpiece. The microstructures of welds in different regions were observed using Field Emission Gun Scanning Electron Microscope (FEG‐SEM). The effect on the corrosion susceptibility was investigated using a gel visualisation test and potentiodynamic polarisation measurements using a micro‐electrochemical technique.

The main corrosion region for both FSWs AA7010‐T7651 produced with and without cryogenic CO₂ cooling is in the HAZ region, which exhibited intergranular attack. Cryogenic cooling does not show any influence on anodic reactivity of the weld region (both nugget and HAZ) compared to uncooled weld metal. However, the width of the reactive HAZ is reduced after cooling, as compared to the uncooled weld. The cooled welds show higher cathodic reactivity in the nugget region than does the nugget region of uncooled welds.

There has been no previous work to investigate the effect of cryogenic CO₂ cooling on the corrosion behaviour of FSW AA7010‐T7651. The paper relates the microstructures of both uncooled and cooled welds to their anodic and cathodic reactivities using a micro‐electrochemical technique.

The purpose of this paper is to investigate the effects of chloride ion concentration and applied bias voltage on the electrochemical migration (ECM) behavior between Cu and Ag under an NaCl thin electrolyte layer (TEL).

A self-made experimental setup for the ECM behavior between Cu and Ag was designed. An HD video measurement microscopy was used to observe the typical dendrite/corrosion morphology and pH distribution. Short-circuit time (SCT), short-circuit current density and the influence of the galvanic effect between Cu and Ag on their ECM behavior were studied by electrochemical tests. The surface morphology and composition of dendrite were characterized by FESEM/EDS.

The SCT increased with increasing NaCl concentration but decreased with increasing applied bias voltage, and the SCT between Cu and Ag was less than that between Cu and Cu because their galvanic effect accelerated the dissolution and migration of Cu. When NaCl concentration was less than or equal to 6 mmol/L, cedar-like dendrite was formed, whereas no dendrite formed and only precipitation occurred at high chloride ion concentration (100 mmol/L). The composition of the dendrite between Cu and Ag was copper.

The significance of this study is to clarify the ECM failure mechanism of printed circuit board (PCB) with an immersion silver surface finish (PCB-ImAg).

This study provides a basic theoretical basis for the selection of protective measures and metal coatings for PCB.

The social implication of this study is to predict the service life of PCB.

The ECM behavior of dissimilar metals under a TEL was investigated, the influence of the galvanic effect between them on their ECM was discussed, and the SCT increased with increasing NaCl concentration.

The purpose of this study is to show that the humidity levels for surface insulation resistance (SIR)-related failures are dependent on the type of activators used in no-clean flux systems and to demonstrate the possibility of simulating the effects of humidity and contamination on printed circuit board components and sensitive parts if typical SIR data connected to a particular climatic condition are available. This is shown on representative components and typical circuits.

A range of SIR values obtained on SIR patterns with 1,476 squares was used as input data for the circuit analysis. The SIR data were compared to the surface resistance values observable on a real device printed circuit board assembly. SIR issues at the component and circuit levels were analysed on the basis of parasitic circuit effects owing to the formation of a water layer as an electrical conduction medium.

This paper provides a summary of the effects of contamination with various weak organic acids representing the active components in no-clean solder flux residue, and demonstrates the effect of humidity and contamination on the possible malfunctions and errors in electronic circuits. The effect of contamination and humidity is expressed as drift from the nominal resistance values of the resistors, self-discharge of the capacitors and the errors in the circuits due to parasitic leakage currents (reduction of SIR).

The methodology of the analysis of the circuits using a range of empirical leakage resistance values combined with the knowledge of the humidity and contamination profile of the electronics can be used for the robust design of a device, which is also important for electronic products relying on low current consumption for long battery lifetime.

Examples provide a basic link between the combined effect of humidity and contamination and the performance of electronic circuits. The methodology shown provides the possibility of addressing the climatic reliability of an electronic device at the early stage of device design by using typical SIR data representing the possible climate exposure.

The aim of this work is to investigate the decomposition behaviour of the activator species commonly used in the wave solder no-clean flux systems and to estimate the residue amount left after subjecting the samples to simulated wave soldering conditions.

Changes in the chemical structure of the activators were studied using Fourier transform infrared spectroscopy technique and were correlated to the exposure temperatures within the range of wave soldering process. The amount of residue left on the surface was estimated using standardized acid-base titration method as a function of temperature, time of exposure and the substrate material used.

The study shows that there is a possibility of anhydride-like species formation during the thermal treatment of fluxes containing weak organic acids (WOAs) as activators (succinic and DL-malic). The decomposition patterns of solder flux activators depend on their chemical nature, time of heat exposure and substrate materials. Evaporation of the residue from the surface of different materials (laminate with solder mask, copper surface or glass surface) was found to be more pronounced for succinic-based solutions at highest test temperatures than for adipic acid. Less left residue was found on the laminate surface with solder mask (∼5-20 per cent of initial amount at 350°C) and poorest acid evaporation was noted for glass substrates (∼15-90 per cent).

The findings are attributed to the chemistry of WOAs typically used as solder flux activators. The results show the importance WOA type in relation to its melting/boiling points and the impact on the residual amount of contamination left after soldering process.

The results show that the evaporation of the flux residues takes place only at significantly high temperatures and longer exposure times are needed compared to the temperature range used for the wave soldering process. The extended time of thermal treatment and careful choice of fluxing technology would ensure obtaining more climatically reliable product.

The effect of tolyltriazole (TTA) on the corrosion of Al‐Cu, Al‐Si‐Cu and Al‐Cu‐Fe alloys in HCl (pH = 0.5) and NaCl (pH = 6 and 11) respectively at 15^○C, 25^○C and 35^○C has been studied by electrochemical methods. Corrosion potentials, corrosion rates, polarization resistances, inhibition efficiencies and activation energies have been determined. The results have shown that the inhibition efficiencies of TTA changed with pH and temperature. TTA has been adsorbed on the alloys to form Cu(I)‐TTA film. TTA was more efficient at pH = 0.5 and 6 than at pH = 11. Increasing the temperature from 15^○C to 35^○C decreased the inhibition effect of TTA.

The purpose of this paper is to investigate the decomposition behavior of binary mixtures of organic activators commonly used in the no-clean wave flux systems upon their exposure to thermal treatments simulating wave soldering temperatures. The binary blends of activators were studied at varying ratios between the components.

Differential scanning calorimetry and thermogravimetric analysis were used to study the characteristics of weak organic acid (WOA) mixtures degradation as a function of temperature. The amount of residue left on the surface after the heat treatments was estimated by gravimetric measurements as a function of binary mixture type, temperature and exposure time. Ion chromatography analysis was used for understanding the relative difference between decomposition of activators in binary blends. The aggressivity of the left residue was assessed using the acidity indication gel test, and effect on reliability was investigated by DC leakage current measurement performed under varying humidity and potential bias conditions.

The results show that the typical range of temperatures experienced by electronics during the wave soldering process is not sufficient for the removal of significant activator amounts. If the residues contain binary mixture of WOAs, the final ratio between the components, the residue level and the corrosive effects depend on the relative decomposition behavior of individual components. Among the WOA investigated under the conventional wave soldering temperature, the evaporation and removal of succinic acid is more dominant compared to adipic and glutaric acids.

The findings are attributed to the chemistry of WOAs typically used as flux activators for wave soldering purposes. The results show the importance of controlling the WOA content and ratio between activating components in a flux formulation in relation to its tendencies for evaporation during soldering and the impact of its residues on electronics reliability.

The results show that the significant levels of flux residues can only be removed at significantly higher temperatures and longer exposure times compared to the conventional temperature range used for the wave soldering process. The potential corrosion issues related to insufficient flux residues removal will be determined by the residue amount, its composition and ratio between organic components. The proper time of thermal treatment and careful choice of fluxing formulation could ensure more climatically reliable product.

The purpose of this investigation is to understand the structure of trapped intermetallics particles and localized composition changes in the anodized anodic oxide film on AA1050 aluminium substrates.

The morphology and composition of Fe‐containing intermetallic particles incorporated into the anodic oxide films on industrially pure aluminium (AA1050, 99.5 per cent) has been investigated. AA1050 aluminium was anodized in a 100 ml/l sulphuric acid bath with an applied voltage of 14 V at 20°C ±2°C for 10 or 120 min. The anodic film subsequently was analyzed using focused ion beam‐scanning electron microscopy (FIB‐SEM), SEM, and EDX.

The intermetallic particles in the substrate material consisted of Fe or both Fe and Si with two different structures: irregular and round shaped. FIB‐SEM cross‐sectioned images revealed that the irregular‐shaped particles were embedded in the anodic oxide film as a thin strip structure and located near the top surface of the film, whereas the round‐shaped particles were trapped in the film with a spherical structure, but partially dissolved and were located throughout the thickness of the anodic film. The Fe/Si ratio of the intermetallic particles decreased after anodizing.

This paper shows that dual beam FIB‐SEM seems to be an easy, less time consuming and useful method to characterize the cross‐sectioned intermetallic particles incorporated in anodic film on aluminium.

In line with global initiatives, the state of Kerala in southern India is actively working towards formalizing its informal solid waste management (SWM) sector. Despite this, there is a dearth of studies on formalization processes, particularly focusing on the conditions of workers within this sector. This study addresses the gap by examining the challenges faced by women workers operating within the formalized framework of Kerala’s SWM sector. It aimed to investigate challenges faced by grassroots women workers in Kerala’s SWM sector during its transition from informal to formal, identifying gaps in the process through their experiences. Using a qualitative methodology, the research gathered data from 10 women workers in the SWM sector in Kozhikode, Kerala, who were part of the Haritha Karma Sena (green task force). Thematic analysis of in-depth interviews revealed two major challenges faced by these women. Firstly, there was a negative societal perception towards them, and secondly, there was a lack of appropriate state response to their needs and requirements. These challenges were attributed to gaps and pitfalls in the formalization process, leading to a lowered socio-economic status for the women, increased vulnerability to health hazards, and societal stigma. The findings underscore the need for significant improvements in the formalization process of Kerala’s waste management sector. The study advocates for targeted policy interventions to enhance the working conditions of SWM workers, emphasizing the importance of expediting and streamlining the formalization process. This, in turn, would contribute to the overall effectiveness of the SWM system in the state.

The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue distribution pattern, composition and concentration are profiled and reported. The effect of such contaminants on conformal coating was tested.

Presence of localized flux residues was visualized using a commercial residue reliability assessment testing gel test and chemical structure was identified by Fourier transform infrared spectroscopy, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode set-up. Localized extraction of residue was carried out using a commercial critical contamination control extraction system.

Results clearly show that the amount and distribution of flux residues are a function of the soldering process, and the level can be reduced by an appropriate cleaning. Selective soldering process generates significantly higher levels of residues compared to the wave and reflow process. For conformal coated PCBAs, the contamination levels generated from the tested wave and selective soldering process are found to be enough to generate blisters under exposure to high humidity levels.

Although it is generally known that different soldering processes can introduce contamination on the PCBA surface, compromising its cleanliness, no systematic work is reported investigating the relative levels of residue introduced by various soldering processes and its effect on corrosion reliability.