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Publication date: 1 January 1993

Peter Ongley has joined Alpha Metals as Manager of the company's Advanced Products Division. He will be responsible for the technical support and marketing of polymer and…

15

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Peter Ongley has joined Alpha Metals as Manager of the company's Advanced Products Division. He will be responsible for the technical support and marketing of polymer and silica‐glass die attach adhesives, superconductors, Gel‐Packs (chip carriers) and the advancement of related product ranges.

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Soldering & Surface Mount Technology, vol. 5 no. 1
Type: Research Article
ISSN: 0954-0911

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Publication date: 1 February 1993

Despite recent economic gloom, Bolton based Vantage Circuit Products Ltd have achieved continued growth and have recently appointed Bernard Mulhall as Sales Manager responsible…

18

Abstract

Despite recent economic gloom, Bolton based Vantage Circuit Products Ltd have achieved continued growth and have recently appointed Bernard Mulhall as Sales Manager responsible for their rapidly developing business in chemicals and materials for the electronics industry in the South of England.

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Circuit World, vol. 19 no. 3
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 September 2006

181

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Microelectronics International, vol. 23 no. 3
Type: Research Article
ISSN: 1356-5362

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Publication date: 1 August 2005

35

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Microelectronics International, vol. 22 no. 2
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 1 December 2005

39

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Microelectronics International, vol. 22 no. 3
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 1 September 2005

34

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Soldering & Surface Mount Technology, vol. 17 no. 3
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 1 August 1999

Ken Gilleo and Peter Ongley

Reviews the traditional use of thermoset (epoxy) adhesives for various bonding applications and highlights some limitations in today’s microelectronics arena. In particular…

1162

Abstract

Reviews the traditional use of thermoset (epoxy) adhesives for various bonding applications and highlights some limitations in today’s microelectronics arena. In particular, concerns for thermal and stress management associated with large area silicon bonded to a wide variety of substrate materials has led to an increasing interest in thermoplastic adhesive technology. Thermoplastics are not always the best solution for every application. This paper sets out to address the “pros and cons” of each polymer technology for different microelectronic applications taking into account some of the key physical properties such as Tg, TCE and modulus. In addition, practical issues such as handling, storage and processing are considered in detail.

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Microelectronics International, vol. 16 no. 2
Type: Research Article
ISSN: 1356-5362

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Publication date: 1 August 2002

Michael A. Previti and Peter Ongley

No‐Flow or fluxing underfills will play a key role in the future of flip chip processing. Properly formulated No‐Flow Underfills decrease manufacturing time and cost of producing…

579

Abstract

No‐Flow or fluxing underfills will play a key role in the future of flip chip processing. Properly formulated No‐Flow Underfills decrease manufacturing time and cost of producing flip chip packages. The reliability and processing ability allows these underfills to be incorporated into many unique applications. Processing yields and reliability on ceramic, flex and organic substrates will allow No‐Flow Underfills to be used successfully in future Bluetooth and wireless telecommunication products. This work gives the reliability of a commercially available No‐Flow Underfill on three flip chip and two BGA/CSP test vehicles. A detailed failure mode analysis of the underfill was also performed.

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Microelectronics International, vol. 19 no. 2
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 1 August 1999

Ken Gilleo, Matthew Witt, David Blumel and Peter Ongley

Most flip chip assemblies require underfill to bestow reliability that would otherwise be ravished by stress due to thermomechanical mismatch between die and substrate. While…

288

Abstract

Most flip chip assemblies require underfill to bestow reliability that would otherwise be ravished by stress due to thermomechanical mismatch between die and substrate. While underfill can be viewed as “polymer magic” and the key to modern flip chip success, many see it as the process “bottleneck” that must be eliminated in the future. Both views are accurate. A substantial amount of R&D is being focused on making underfill more user‐friendly. Electronic materials suppliers, various consortia, government labs and university researchers are working diligently to shatter the bottleneck and fully enable flip chip ‐ the final destination for micropackaging. This paper will describe these efforts and provide a status report on state‐of‐the‐art underfill technologies. We will also examine new processing strategies.

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Microelectronics International, vol. 16 no. 2
Type: Research Article
ISSN: 1356-5362

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Publication date: 1 March 1988

Richard Tait and R.B. Turnbull

Kulicke and Soffa Industries, Inc. have announced the appointment of Dr Arthur J. Schneider as Vice President of Research and Development. Dr Schneider is based in Willow Grove…

36

Abstract

Kulicke and Soffa Industries, Inc. have announced the appointment of Dr Arthur J. Schneider as Vice President of Research and Development. Dr Schneider is based in Willow Grove and reports directly to Donald R. VanLuvanee, K & S President.

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Microelectronics International, vol. 5 no. 3
Type: Research Article
ISSN: 1356-5362

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