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This paper describes the nature of burnout among teachers, examines the differences in burnout between teachers and school‐based administrators, and explores the extent to which specific work factors predict teacher burnout. Teachers were experiencing less Emotional Exhaustion and Depersonalization burnout, but more Personal Accomplishment burnout than other helping service professionals. Their levels of Emotional Exhaustion and Personal Accomplishment burnout were higher than those for administrators. Both job satisfaction and job challenge were significant predictors of each burnout sub‐scale. The findings indicate that burnout is both the result of organizational factors such as work load, as well as the result of failure of the job to satisfy the motivational needs of teachers to be challenged and rewarded by their work. These results dispute some established research findings, and contribute new evidence to the growing data base on educator burnout.

The purpose of this paper is to demonstrate a novel 3D system-in-package (SiP) approach. This new packaging approach is based on stacked silicon submount technology. As demonstrators, a smart lighting module and a sensor systems were successfully developed by using the fabrication and assembly process described in this paper.

The stacked module consists of multiple layers of silicon submounts which can be designed and fabricated in parallel. The 3D stacking design offers higher silicon efficiency and miniaturized package form factor. This platform consists of silicon submount design and fabrication, module packaging, system assembling and testing and analyzing.

In this paper, a smart light emitting diode system and sensor system will be described based on stacked silicon submount and 3D SiP technology. The integrated smart lighting module meets the optical requirements of general lighting applications. The developed SiP design is also implemented into the miniaturization of particular matter sensors and gas sensor detection system.

SiP has great potential of integrating multiple components into a single compact package, which has potential implementation in intelligent applications.

Despite many advances during the last decade in both infra‐red sensor and solid state camera technology, until now little headway has been made in the production of cost‐effective semiconductor sensor arrays capable of operating far into the infra‐red. Old ideas, renewed by the capabilities offered by the latest micromachine technology, may change all this. Reviews the problems associated with building such sensor arrays before introducing some interesting new research results.

This study aims to provide a flexible and cost-effective solution of 3D heterogeneous integration for applications such as micro-electro-mechanical system (MEMS) applications and smart sensor systems.

A novel 3D system-in-package (SiP) based on stacked silicon submount technology was successfully developed and well-demonstrated by the fabrication and assembly process of a selected smart lighting module.

The stacked module consists of multiple layers of silicon submounts which can be designed and fabricated in parallel. The bonding and interconnecting process is quite simple and does not require complicated equipment. The 3D stacking design offers higher silicon efficiency and miniaturized package form factor. The submount wafer can be assembled and tested at the wafer level, thus reducing the cost and improving the yield.

The embedding design presented in this paper is applicable for modules with limited number of passives. When it comes to cases with more passive devices, new process needs to be developed to achieve fast, inexpensive and reliable assembly.

The presented 3D SiP design is novel for applications such as smart lighting, Internet of Things, MEMS systems, etc.

In this work an original humidity sensor is described. It is based on the study of Seebeck voltage evolution during the water evaporation of a micro‐module Peltier (MMP). The measurement principle is to detect (after cooling) the small temperature decrease created when total water evaporation occurs over the MMP. All the active thin layers of the sensor are made from (Bi₂Te₃)_0.9(Bi₂Se₃)_0.1 (N) films and (Bi₂Te₃)_0.25(Sb₂Te₃)_0.75 (P) films flash evaporated. Experimental measures were performed in a climatic chamber for several values of relative humidity (50 to 90 per cent). The phenomenon (evaporation) appears after a delay time τ. This delay time is the response time of the sensor. Therefore it is possible to draw the evaporation delay time as a function of relative humidity.

The increasing incidence of educator stress and burnout is cause for concern. Nonetheless, the findings of this Canadian‐based study indicate that school principals are experiencing less than average levels of Emotional Exhaustion and Depersonalization burnout, and an average level of Personal Accomplishment burnout. Work conditions most likely to contribute to burnout were work stress, work overload, a deteriorating sense of status and recognition, and unsatisfactory interpersonal relationships. The implications of the study are discussed in terms of both individual and organizational factors.

This study of 491 government secondary school teachers in Victoria, Australia, explores the relationship between sources and types of social support and teacher burnout. Examines both a conceptual model of social support and a social support instrument based on House′s typology developed for the purpose of the study. The major finding that principal support is a significant predictor of burnout is consistent with established research. However, the result that certain types of social support contribute to burnout presents a unique dimension on the social support‐burnout relationship. Also examines the support provided to others by teachers themselves and its impact on burnout. Explains the implications of the findings for theory and practice.

The present paper aims to propose a basic current mirror-sensing circuit as an alternative to the traditional Wheatstone bridge circuit for the design and development of high-sensitivity complementary metal oxide semiconductor (CMOS)–microelectromechanical systems (MEMS)-integrated pressure sensors.

This paper investigates a novel current mirror-sensing-based CMOS–MEMS-integrated pressure-sensing structure based on the piezoresistive effect in metal oxide field effect transistor (MOSFET). A resistive loaded n-channel MOSFET-based current mirror pressure-sensing circuitry has been designed using 5-μm CMOS technology. The pressure-sensing structure consists of three identical 10-μm-long and 50-μm-wide n-channel MOSFETs connected in current mirror configuration, with its input transistor as a reference MOSFET and output transistors are the pressure-sensing MOSFETs embedded at the centre and near the fixed edge of a silicon diaphragm measuring 100 × 100 × 2.5 μm. This arrangement of MOSFETs enables the sensor to sense tensile and compressive stresses, developed in the diaphragm under externally applied pressure, with respect to the input reference transistor of the mirror circuit. An analytical model describing the complete behaviour of the integrated pressure sensor has been described. The simulation results of the pressure sensor show high pressure sensitivity and a good agreement with the theoretical model has been observed. A five mask level process flow for the fabrication of the current mirror-sensing-based pressure sensor has also been described. An n-channel MOSFET with aluminium gate was fabricated to verify the fabrication process and obtain its electrical characteristics using process and device simulation software. In addition, an aluminium gate metal-oxide semiconductor (MOS) capacitor was fabricated on a two-inch p-type silicon wafer and its CV characteristic curve was also measured experimentally. Finally, the paper presents a comparative study between the current mirror pressure-sensing circuit with the traditional Wheatstone bridge.

The simulated sensitivities of the pressure-sensing MOSFETs of the current mirror-integrated pressure sensor have been found to be approximately 375 and 410 mV/MPa with respect to the reference transistor, and approximately 785 mV/MPa with respect to each other. The highest pressure sensitivities of a quarter, half and full Wheatstone bridge circuits were found to be approximately 183, 366 and 738 mV/MPa, respectively. These results clearly show that the current mirror pressure-sensing circuit is comparable and better than the traditional Wheatstone bridge circuits.

The concept of using a basic current mirror circuit for sensing tensile and compressive stresses developed in micro-mechanical structures is new, fully compatible to standard CMOS processes and has a promising application in the development of miniaturized integrated micro-sensors and sensor arrays for automobile, medical and industrial applications.

This paper presents an organizational learning framework for reframing management practices within large bureaucratic organizations. Reviewing the relevant literature, the paper argues managers' control orientations and practices effectively stifle learning and personal development by severely limiting the ability of employees to exert control or change the nature of their work activities. To encourage organizational learning, a number of reframing tools are proposed The paper concludes by discussing how reframing tools may be used in conjunction with other psychoanalytic techniques to challenge and change managers' control orientations and practices.

This issue is a selected bibliography covering the subject of leadership.