Noor H. Jabarullah and Hafezali Iqbal Hussain
The purpose of this paper is to examine the impact of the use of problem-based learning (PBL) with engineering students at a technical university in Malaysia.
Abstract
Purpose
The purpose of this paper is to examine the impact of the use of problem-based learning (PBL) with engineering students at a technical university in Malaysia.
Design/methodology/approach
The setting provided a unique opportunity to evaluate the impact of PBL, since Universiti Kuala Lumpur offers both the traditional, predominantly classroom-focussed approach to engineering and the more hands-on approach referred to as Higher Technical and Vocational Education and Training (HTVET). The study sample consisted of 453 third-year students’ enroled in both programmes at Universiti Kuala Lumpur.
Findings
Students in the HTVET programme responded better to PBL teaching methods, as evidenced by improved performance on written as well as lab-based assessments. This result indicates that students using the hands-on approach advocated by HTVET tend to obtain the greatest benefit from experiential, student-centred learning approaches. The analysis suggests the possibility that the PBL approach is a moderator of student performance in HTVET programmes. This possibility merits further investigation.
Research limitations/implications
The sample included students from only one institution of higher learning, which was chosen because both types of programmes are offered there. In addition, the current study does not consider potential mediating or moderating variables.
Originality/value
The findings provide an empirical basis for implementing PBL as a form of experiential learning at higher education institutions, especially those using the HTVET model. Furthermore, they provide a justification for designing curriculum structures and student learning time with an emphasis on active and experiential learning, thereby maximising the effectiveness of a hands-on approach, rather than the “minds-on” theoretical approach advocated by traditional engineering programmes in enhancing the teaching and learning experience.
Details
Keywords
Buen Zhang, Noor H. Jabarullah, Ayad F. Alkaim, Svetlana Danshina, Irina V. Krasnopevtseva, Yuan Zheng and Nisith Geetha
This paper aims to establish a more accurate model for lifetime estimation.
Abstract
Purpose
This paper aims to establish a more accurate model for lifetime estimation.
Design/methodology/approach
Finite element model simulation and experimental tests are used to enhance the lifetime prediction model of the solder joint.
Findings
A more precise model was found.
Originality/value
It is confirmed that the paper is original.
Details
Keywords
Supriyono, Tzu-Chia Chen, Lis M. Yapanto, Zagir Azgarovich Latipov, Angelina Olegovna Zekiy, Lyubov A. Melnikova, Lakshmi Thangavelu, A. Surendar, Nikolay I. Repnikov and Zeinab Arzehgar
In this paper, a lifetime estimation model for the solder joint is proposed which is capable of considering both severe and running mechanical shocks which is the real case in…
Abstract
Purpose
In this paper, a lifetime estimation model for the solder joint is proposed which is capable of considering both severe and running mechanical shocks which is the real case in electric converters in the automotive and aerospace applications. This paper aims to asses the reliability of the solder joint under mixed exposure of mechanical loads.
Design/methodology/approach
Mechanical failure process may put at risk the perfect performance of any kinds of electronic systems regardless of the applications they are prepared for. Observation of solder joint health in an electronic assembly under simultaneous exposure of severe and running shocks is an open problem. Three commonly used soldering compositions are considered while the electronic assembly is exposed to three well-known driving cycles.
Findings
The results show that the best performance is achieved using SAC405 soldering alloy in comparison with Sn63Pb37 and SAC387 solder alloy. Consideration of mixed exposure to the mechanical loads leads to much more accurate lifetime estimation of the solder joint in the electronic assemblies.
Originality/value
The originality of the paper is confirmed.