Nikolai K. Myshkin and Alexander Kovalev
The purpose of this paper is to review the advances in mechanics and tribology of polymers and polymer-based materials. It is focused on the understanding of the correlation of…
Abstract
Purpose
The purpose of this paper is to review the advances in mechanics and tribology of polymers and polymer-based materials. It is focused on the understanding of the correlation of contact mechanics and the tribological behavior of polymers and polymer composites by taking account of surface forces and adhesion in the contact.
Design/methodology/approach
Mechanical behavior of polymers is considered a viscoelasticity. Tribological performance is estimated while considering the parts of deformation and adhesion in friction arising in the contact. Surface energy, roughness, load and temperature effects on the tribological behavior of polymers are evaluated. Polymer composites produced by reinforcing and by the addition of functional additives are considered as materials for various applications in tribology. Particular attention is given to polymer-based nanocomposites.
Findings
A review of studies in tribology has shown that polymer-based materials can be most successfully used as self-lubricating components of sliding bearings. The use of the fillers provides changes in the tribological performance of neat polymers and widens their areas of application in the industry. Thin polymer films were found to be prospective lubricants for memory storage devices, micro-electro-mechanical systems and precision mechanisms. Further progress in polymer tribology should be achieved on solving the problems of contact mechanics, surface physics and tribochemistry by taking account of the scale factor.
Originality/value
The review is based on the experience of the authors in polymer mechanics and tribology, their research data and on data of many other literature sources published in this area. It can be useful for specialists in polymer research and industrial engineers working in tribology and industrial lubrication.
Details
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Mohammed S. Gumaan, Rizk Mostafa Shalaby, Mustafa Kamal Mohammed Yousef, Esmail A.M. Ali and E. E. Abdel-Hady
This study aims to investigate the structural, mechanical, thermal and electrical properties of tin–silver–nickel (Sn-Ag-Ni) melt-spun solder alloys. So, it aims to improve the…
Abstract
Purpose
This study aims to investigate the structural, mechanical, thermal and electrical properties of tin–silver–nickel (Sn-Ag-Ni) melt-spun solder alloys. So, it aims to improve the mechanical properties of the eutectic tin–silver (Sn-Ag) such as tensile strength, plasticity and creep resistance by adding different concentrations of Ni content.
Design/methodology/approach
Ternary melt-spun Sn-Ag-Ni alloys were investigated using x-ray diffractions, scanning electron microscope, dynamic resonance technique (DRT), Instron machine, Vickers hardness tester and differential scanning calorimetry.
Findings
The results revealed that the Ni additions 0.1, 0.3, 0.5, 0.7, 1, 3 and 5 Wt.% to the eutectic Sn-Ag melt-spun solder were added. The “0.3wt.%” of Ni was significantly improved its mechanical properties to efficiently serve under high strain rate applications. Moreover, the uniform distribution of Ag3Sn intermetallic compound with “0.3wt.%” of Ni offered the potential benefits, such as high strength, good plasticity consequently and good mechanical performance through a lack of dislocations and microvoids. The tensile results showed improvement in 17.63 per cent tensile strength (26 MPa), 21 per cent toughness (1001 J/m3), 22.83 per cent critical shear stress (25.074 MPa) and 11 per cent thermal diffusivity (2.065 × 10−7 m2/s) when compared with the tensile strength (21.416 MPa), toughness (790 J/m3), critical shear stress (19.348 MPa) and thermal diffusivity (1.487 × 10−7 m2/s) of the eutectic Sn-Ag. Slight increments have been shown for the melting temperature of Sn96.2-Ag3.5-Ni0.3 (222.62°C) and electrical resistivity to (1.612 × 10−7 Ω.m). It can be said that the eutectic Sn-Ag solder alloy has been mechanically improved with “0.3wt.%” of Ni to become a suitable alloy for high strain rate applications. The dislocation movement deformation mechanism (n = 4.5) without Ni additions changed to grain boundary sliding deformation mechanism (n = 3.5) with Ni additions. On the other hand, the elastic modulus, creep rate and strain rate sensitivity with “0.3wt.%” of Ni have been decreased. The optimum Ni-doped concentration is “0.7wt.%” of Ni in terms of refined microstructure, electrical resistivity, Young’s Modulus, bulk modulus, shear modulus, thermal diffusivity, maximum shear stress, tensile strength and average creep rate.
Originality/value
This study provides nickel effects on the structural of the eutectic Sn-Ag rapidly solidified by melt-spinning technique. In this paper, the authors have compared the elastic modulus of the melt-spun compositions which has been resulted from the tensile strength tester with these results from the DRT for the first time to best of the authors’ knowledge. This paper presents new improvements in mechanical and electrical performance.