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Article
Publication date: 1 August 2004

John Lau, Dongkai Shangguan, Todd Castello, Rob Horsley, Joe Smetana, Nick Hoo, Walter Dauksher, Dave Love, Irv Menis and Bob Sullivan

Failure analyses of the lead‐free and SnPb solder joints of high‐density packages such as the plastic ball grid array and the ceramic column grid array soldered on SnCu hot‐air…

798

Abstract

Failure analyses of the lead‐free and SnPb solder joints of high‐density packages such as the plastic ball grid array and the ceramic column grid array soldered on SnCu hot‐air solder levelling electroless nickel‐immersion gold or NiAu, and organic solderability preservative Entek printed circuit boards are presented. Emphasis is placed on determining the failure locations, failure modes, and intermetallic compound composition for these high‐density packages' solder joints after they have been through 7,500 cycles of temperature cycling. The present results will be compared with those obtained from temperature cycling and finite element analysis.

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Soldering & Surface Mount Technology, vol. 16 no. 2
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 1 August 2004

John Lau, Nick Hoo, Rob Horsley, Joe Smetana, Dongkai Shangguan, Walter Dauksher, Dave Love, Irv Menis and Bob Sullivan

Temperature cycling tests, and statistical analysis of the results, for various high‐density packages on printed‐circuit boards with Sn‐Cu hot‐air solder levelling, electroless…

899

Abstract

Temperature cycling tests, and statistical analysis of the results, for various high‐density packages on printed‐circuit boards with Sn‐Cu hot‐air solder levelling, electroless nickel‐immersion gold, and organic solder preservative finishes are investigated in this study. Emphasis is placed on the determination of the life distribution and reliability of the lead‐free solder joints of these high‐density package assemblies while they are subjected to temperature cycling conditions. A data acquisition system, the relevant failure criterion, and the data extraction method will be presented and examined. The life test data are best fitted to the Weibull distribution. Also, the sample mean, population mean, sample characteristic life, true characteristic life, sample Weibull slope, and true Weibull slope for some of the high‐density packages are provided and discussed. Furthermore, the relationship between the reliability and the confidence limits for a life distribution is established. Finally, the confidence levels for comparing the quality (mean life) of lead‐free solder joints of high‐density packages are determined.

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Soldering & Surface Mount Technology, vol. 16 no. 2
Type: Research Article
ISSN: 0954-0911

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Available. Content available
Article
Publication date: 1 August 2004

36

Abstract

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Soldering & Surface Mount Technology, vol. 16 no. 2
Type: Research Article
ISSN: 0954-0911

Available. Content available
Article
Publication date: 1 March 2005

34

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Soldering & Surface Mount Technology, vol. 17 no. 1
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 1 February 2005

Roger Reinsch

E‐commerce plays an important role in today’s business environment, and that role will continue to grow each year. eMarketer predicts that by “2004, world wide e‐commerce revenues…

5755

Abstract

E‐commerce plays an important role in today’s business environment, and that role will continue to grow each year. eMarketer predicts that by “2004, world wide e‐commerce revenues are expected to total USD 2.7 trillion”. E‐commerce continues to grow in the United States. “The Census Bureau of the Department of Commerce announced today that the estimate of U.S. retail e‐commerce sales for the first quarter of 2004, not adjusted for seasonal, holiday, and trading‐day differences, was $15.5 billion, an increase of 28.1 per cent (±2.9 per cent) from the first quarter of 2003.” “According to a new study by RoperASW and AOL Time Warner, Europeans spent on average EUR430 on line between August and October 2002.” This compares with an average spend of EUR543 per head in the US over the same period.

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Managerial Law, vol. 47 no. 1/2
Type: Research Article
ISSN: 0309-0558

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Book part
Publication date: 24 October 2022

Eugene Beresin

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Music
Type: Book
ISBN: 978-1-83867-316-1

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Publication date: 30 December 2004

Ruth Soenen

In this article the everyday relationships of children in the context of the contemporary multicultural city will be discussed. It is based on ethnographic research into social…

Abstract

In this article the everyday relationships of children in the context of the contemporary multicultural city will be discussed. It is based on ethnographic research into social relationships of city dwellers in Antwerp, a Flemish city in Belgium, within the framework of the reflection on community life, conflict and public space. In this research several city dwellers were interviewed about their social relationships, a small number of individual city dwellers were followed in their everyday life and participant observation was done in shops and on public transport. The fieldwork on public transport was carried out over a period of eight months. Observations were done on one specific tramline and its stops; drivers were informally interviewed and the researcher took part in the ticket control with inspectors of the public transport company. The fieldwork in the shops consisted of participant observations (not anonymous) for six months in a small shoe shop, a baby shop and a department store with a refreshment bar in it. Next to this in a specific city neighbourhood 30 interviews were done with different city inhabitants about their relationships and contacts and three of them were each followed for two months in their daily activities in and around the city. An elderly woman, a working man and a child were involved. The research unit was not formed by a specific ethnic, socio-economic or age group but by the relationships between different city dwellers. Special attention is given to crosscutting ties, those ties between individuals that run through delineated social groups and geographical boundaries. This article offers only descriptions of everyday relationships of children from the ethnographical research projects described above.

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Identity, Agency and Social Institutions in Educational Ethnography
Type: Book
ISBN: 978-1-84950-297-9

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Article
Publication date: 1 October 1979

Clive Bingley, Sarah Lawson, Edwin Fleming and Kate Hills

AS FAIRLY WARNED to you earlier this year would transpire, what you are now reading is the 100th issue of NEW LIBRARY WORLD, a span of issues which has encompassed some 8½ years…

21

Abstract

AS FAIRLY WARNED to you earlier this year would transpire, what you are now reading is the 100th issue of NEW LIBRARY WORLD, a span of issues which has encompassed some 8½ years, several million words, a sizeable copse of trees to produce the paper on which those issues have been printed.

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New Library World, vol. 80 no. 10
Type: Research Article
ISSN: 0307-4803

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