David R. Selviah, Andy C. Walker, David A. Hutt, Kai Wang, Aongus McCarthy, F. Anibal Fernández, Ioannis Papakonstantinou, Hadi Baghsiahi, Himanshu Suyal, Mohammad Taghizadeh, Paul Conway, John Chappell, Shefiu S. Zakariyah, Dave Milward, Richard Pitwon, Ken Hopkins, Malcolm Muggeridge, Jeremy Rygate, Jonathan Calver, Witold Kandulski, David J. Deshazer, Karen Hueston, David J. Ives, Robert Ferguson, Subrena Harris, Gary Hinde, Martin Cole, Henry White, Navin Suyal, Habib ur Rehman and Chris Bryson
The purpose of this paper is to provide an overview of the research in a project aimed at developing manufacturing techniques for integrated optical and electronic interconnect…
Abstract
Purpose
The purpose of this paper is to provide an overview of the research in a project aimed at developing manufacturing techniques for integrated optical and electronic interconnect printed circuit boards (OPCB) including the motivation for this research, the progress, the achievements and the interactions between the partners.
Design/methodology/approach
Several polymer waveguide fabrication methods were developed including direct laser write, laser ablation and inkjet printing. Polymer formulations were developed to suit the fabrication methods. Computer‐aided design (CAD) tools were developed and waveguide layout design rules were established. The CAD tools were used to lay out a complex backplane interconnect pattern to meet practical demanding specifications for use in a system demonstrator.
Findings
Novel polymer formulations for polyacrylate enable faster writing times for laser direct write fabrication. Control of the fabrication parameters enables inkjet printing of polysiloxane waveguides. Several different laser systems can be used to form waveguide structures by ablation. Establishment of waveguide layout design rules from experimental measurements and modelling enables successful first time layout of complex interconnection patterns.
Research limitations/implications
The complexity and length of the waveguides in a complex backplane interconnect, beyond that achieved in this paper, is limited by the bend loss and by the propagation loss partially caused by waveguide sidewall roughness, so further research in these areas would be beneficial to give a wider range of applicability.
Originality/value
The paper gives an overview of advances in polymer formulation, fabrication methods and CAD tools, for manufacturing of complex hybrid‐integrated OPCBs.
Details
Keywords
Shefiu S. Zakariyah, Paul P. Conway, David A. Hutt, Navin Suyal and David R. Selviah
The purpose of this paper is to present the need, and a potential solution, for in‐plane routing of optical signals for optical‐enabled circuit boards.
Abstract
Purpose
The purpose of this paper is to present the need, and a potential solution, for in‐plane routing of optical signals for optical‐enabled circuit boards.
Design/methodology/approach
Multimode waveguides and integrated 45° in‐plane mirror structures were made in a low loss acrylate‐based photopolymer using excimer laser ablation. The fabrication of multimode waveguides and mirrors was carried out in a single laser system which minimised alignment issues.
Findings
It was established that in‐plane mirror fabrication using laser ablation can be achieved and can potentially be used to define mirrors in waveguides made by other methods such as photolithography.
Research limitations/implications
While the concept (integrated in‐plane mirror) was demonstrated, the viability of its deployment will depend on the results of optical loss measurements for which further research is required.
Originality/value
The paper gives an overview of the design concept and fabrication steps for an in‐plane embedded mirror.