Search results

1 – 10 of 106
Per page
102050
Citations:
Loading...
Access Restricted. View access options
Article
Publication date: 1 March 1984

F.N. Sinnadurai and D.J. Small

Following extensive studies that demonstrated that some types of plastic encapsulation can be used in high reliability environments, the EPIC chip carrier was conceived and…

34

Abstract

Following extensive studies that demonstrated that some types of plastic encapsulation can be used in high reliability environments, the EPIC chip carrier was conceived and developed as a cost‐effective micropackage for ICs. The EPIC chip carrier is manufactured by adaptations of PCB techniques with metallisation suitable for auto‐wire bonding. It is a low‐cost alternative to the ceramic chip carrier, but with a much better electrical performance, derived from lower parasitics of the materials employed. Reliability studies have confirmed the suitability of the EPIC for 20 year life operations to which an added benefit is the avoidance of TCE mismatch problems sometimes obtained with ceramic chip carriers on PCBs.

Details

Circuit World, vol. 10 no. 4
Type: Research Article
ISSN: 0305-6120

Access Restricted. View access options
Article
Publication date: 1 February 1984

C. Maunder, D. Roberts and N. Sinnadurai

Testing has become one of the dominant costs in the process of bringing a product from initial conception to the market place. Because of this, it is now imperative that the…

22

Abstract

Testing has become one of the dominant costs in the process of bringing a product from initial conception to the market place. Because of this, it is now imperative that the impact of any technology change on the test process is considered at an early stage. In this light, the increasing trend towards the use of surface‐mounting techniques in the fabrication of electronic systems is examined, with particular emphasis on the consequences on product testing during design validation, manufacture and repair. The aim is to highlight areas in which new attitudes and replacements for traditional solutions will be needed if surface‐mounting techniques are to be as cost‐effective as possible.

Details

Microelectronics International, vol. 2 no. 1
Type: Research Article
ISSN: 1356-5362

Access Restricted. View access options
Book part
Publication date: 9 November 2023

Reny Damayanti Safitri, Tastaftiyan Risfandy, Inas Nurfadia Futri and Rizky Yudaruddin

The practice of real earnings management (REM) or earnings manipulation through the company’s real activities is increasingly widespread. Companies that want to achieve profit…

Abstract

The practice of real earnings management (REM) or earnings manipulation through the company’s real activities is increasingly widespread. Companies that want to achieve profit targets have switched from accrual-based to REM, especially in the firm family owner, who is an active manager. Our study aims to determine whether family ownership in a company will be a factor in the existence of greater REM practices. The authors collected 2,613 observational data from non-financial companies on the Indonesia Stock Exchange (IDX) during 2013–2018 using a purposive sampling method and then analyzed using panel random effect (RE) regression. The results show that family ownership significantly negatively affects abnormal operating cash flow which means that family firms are more likely to reduce operating cash flow to report higher income than non-family firms. Thus, it can be concluded that family firms in Indonesia are more likely to be involved in REM than non-family firms.

Details

Macroeconomic Risk and Growth in the Southeast Asian Countries: Insight from Indonesia
Type: Book
ISBN: 978-1-83797-043-8

Keywords

Access Restricted. View access options
Article
Publication date: 1 February 1990

H. Binner, H.T. Law, N. Sinnadurai, G. Jones and P.E. Ongley

Following the discussion at our recent Annual General Meeting, a questionnaire was sent out to all members. Almost half of them replied despite the fact that the time allowed for…

23

Abstract

Following the discussion at our recent Annual General Meeting, a questionnaire was sent out to all members. Almost half of them replied despite the fact that the time allowed for returning the questionnaire had been kept very short. Some members even provided detailed comments.

Details

Microelectronics International, vol. 7 no. 2
Type: Research Article
ISSN: 1356-5362

Access Restricted. View access options
Article
Publication date: 1 September 1995

N. Sinnadurai

45

Abstract

Details

Microelectronics International, vol. 12 no. 3
Type: Research Article
ISSN: 1356-5362

Access Restricted. View access options
Article
Publication date: 1 February 1988

T. Kwikkers, J. Lantaires, R.B. Turnbull, H.T. Law, Barry George and Dave Savage

On 20 April ISHM‐Benelux held its 1988 Spring meeting at the Grand Hotel Heerlen. This meeting was totally devoted to implantable devices, in particular to the technologies used…

38

Abstract

On 20 April ISHM‐Benelux held its 1988 Spring meeting at the Grand Hotel Heerlen. This meeting was totally devoted to implantable devices, in particular to the technologies used for these high reliability, extremely demanding devices. For this meeting ISHM‐Benelux was the guest of the Kerkrade facility of Medtronic. Medtronic (headquartered in Minneapolis, USA) is the world's leading manufacturer of implantable electronic devices. Apart from the assembly of pacemakers and heart‐wires, the Kerkrade facility acts as a manufacturing technology centre for Medtronic's European facilities.

Details

Microelectronics International, vol. 5 no. 2
Type: Research Article
ISSN: 1356-5362

Access Restricted. View access options
Article
Publication date: 1 February 1983

Brian Waterfield, Peter Moran and Nihal Sinnadurai

ISHM (UK) presented a technical meeting on this topic on the 23rd October 1982 at the Cunard International Hotel, London. The meeting was attended by some 50 engineers, both those…

25

Abstract

ISHM (UK) presented a technical meeting on this topic on the 23rd October 1982 at the Cunard International Hotel, London. The meeting was attended by some 50 engineers, both those involved in the field of hybrids and potential users. It was generally felt that this was a useful meeting but more especially that it would have appealed to many potential users of hybrids, had the right people been able to be contacted.

Details

Microelectronics International, vol. 1 no. 2
Type: Research Article
ISSN: 1356-5362

Access Restricted. View access options
Article
Publication date: 1 May 1995

N. Sinnadurai

15

Abstract

Details

Microelectronics International, vol. 12 no. 2
Type: Research Article
ISSN: 1356-5362

Access Restricted. View access options
Article
Publication date: 1 February 1986

Nihal Sinnadurai, G. Kersuzan, B.S. Sonde, Boguslaw Herod, Brian C. Waterfield, J.B. Knowles and M.A. Stein

I was an invited speaker to the ISHM‐Benelux meeting. As I arrived early, I also sat in on the committee meeting as an observer. Jos B. Peeters was the outgoing president and the…

15

Abstract

I was an invited speaker to the ISHM‐Benelux meeting. As I arrived early, I also sat in on the committee meeting as an observer. Jos B. Peeters was the outgoing president and the incoming committee was widened to about 15 members compared with the previous 6. Following the unanimous election of all those nominated, the committee reconvened and elected Mr Kwikkers as the new president of ISHM‐Benelux. He is a professor at the Technische Hogeschole in Delft.

Details

Microelectronics International, vol. 3 no. 2
Type: Research Article
ISSN: 1356-5362

Access Restricted. View access options
Article
Publication date: 1 February 1985

R.R. Sutherland and I.D.E. Videlo

The accelerated life test methods used by British Telecom to demonstrate the probability of 20 year life of electronic components in non‐hermetic packages have now been applied to…

55

Abstract

The accelerated life test methods used by British Telecom to demonstrate the probability of 20 year life of electronic components in non‐hermetic packages have now been applied to small geometry printed circuit boards from four different manufacturers. The reliability hazards found included the migration of copper from conductor tracks through one dry‐film solder resist, and the delamination of a second from the board. Wet‐film solder resists caused comparatively minor problems. Migration of lead and tin across the exposed surface of a board between solder pads was also observed, probably due to inadequate cleaning.

Details

Circuit World, vol. 11 no. 3
Type: Research Article
ISSN: 0305-6120

1 – 10 of 106
Per page
102050