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Because of growing demand for slim, thin and cheap handheld devices, reduced-volume solder interconnects like land grid array (LGA) are becoming attractive and popular choices over the traditional ball grid array (BGA) packages. This study aims to investigate the mechanical shock and impact reliability of various solder alloys and BGA/LGA interconnect configurations.

Therefore, this paper uses drop testing experiments and numerical finite element simulations to evaluate and compare the reliability performance of both LGA and BGA components when exposed to drop and impact loadings. Additionally, three common solder alloys, including 63Sn37Pb, SAC305 and Innolot, are discussed.

The results of this study showed that electronic packages’ drop and impact reliability is strongly driven by the solder configuration and the alloy type. Particularly, the combination of stiff solder alloy and shorter joint, LGA’s assembled with SAC305, results in highly improved drop reliability. Moreover, the BGA packages’ performance can be considerably enhanced by using ductile and compliant solder alloys, that is, 63Sn37Pb. Finally, this paper discussed the failure mode of the various solder configurations and used simulation results to explain the crack and failure situations.

In literature, there is a lack of published work on the drop and impact reliability evaluation and comparison of LGA and BGA solders. This paper provides quantitative analysis on the reliability of lead-based and lead-free solders when assembled with LGA and BGA interconnects.

This paper aims to compare and evaluate the influence of package designs and characteristics on the mechanical reliability of electronic assemblies when subjected to harmonic vibrations.

Using finite element analysis (FEA), the effect of package design-related parameters, including the interconnect array configuration, i.e. full vs perimeter, and package size, on solder mechanical stresses are fully addressed.

The results of FEA simulations revealed that the number of solder rows or columns available in the array, could significantly affect solder stresses. In addition, smaller packages result in lower solder stresses and differing distributions.

In literature, there are no papers that discuss the effect of solder array layout on electronic packages vibration reliability. In addition, general rules for designing electronic assemblies subjected to harmonic vibration loadings are proposed in this paper.

There are several lead-free solder alloys available in the industry. Over the years, the most favorable solder composition of tin-silver-copper (Sn-Ag-Cu [SAC]) has been vastly used and accepted for joining the electronic components. It is strongly believed that the silver (Ag) content has a significant impact on the solder mechanical behavior and thus solder thermal reliability performance. This paper aims to assess the mechanical response, i.e. creep response, of the SAC solder alloys with various Ag contents.

A three-dimensional nonlinear finite element simulation is used to investigate the thermal cyclic behavior of several SAC solder alloys with various silver percentages, including 1%, 2%, 3% and 4%. The mechanical properties of the unleaded interconnects with various Ag amounts are collected from reliable literature resources and used in the analysis accordingly. Furthermore, the solder creep behavior is examined using the two famous creep laws, namely, Garofalo’s and Anand’s models.

The nonlinear computational analysis results showed that the silver content has a great influence on the solder behavior as well as on thermal fatigue life expectancy. Specifically, solders with relatively high Ag content are expected to have lower plastic deformations and strains and thus better fatigue performance due to their higher strengths and failure resistance characteristics. However, such solders would have contrary fatigue performance in drop and shock environments and the low-Ag content solders are presumed to perform significantly better because of their higher ductility.

Generally, this research recommends the use of SAC solder interconnects of high silver contents, e.g. 3% and 4%, for designing electronic assemblies continuously exposed to thermal loadings and solders with relatively low Ag-content, i.e. 1% and 2%, for electronic packages under impact and shock loadings.

The purpose of this paper is to investigate the thermomechanical response of four well-known lead-free die attach materials: sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds.

This examination is conducted through finite element analysis. The mechanical properties of all die attach systems, including elastic and Anand creep parameters, are obtained from relevant literature and incorporated into the numerical analysis. Consequently, the bond stress-strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined.

The results indicate that silver-tin TLP bonds are prone to exhibiting higher inelastic strain energy densities, while sintered silver and copper interconnects tend to possess higher levels of plastic strains and deformations. This suggests a higher susceptibility to damage in these metallic die attachments. On the other hand, the more expensive gold-based solders exhibit lower inelastic strain energy densities and plastic strains, implying an improved fatigue performance compared to other bonding configurations.

The utilization of different metallic material systems as die attachments in power electronics necessitates a comprehensive understanding of their thermomechanical behavior. Therefore, the results of the present paper can be useful in the die attach material selection in power electronics.

This paper aims to use rigorous finite element simulations to investigate the impact of different substrate systems on the warpage behavior of silicon (Si) chips of power modules exposed to thermal loading.

Three common substrate systems: direct copper bonded (DCB), insulated metal substrate (IMS) and printed circuit board (PCB) configurations examined. In addition, three lead-free bonding materials: silver-tin transient liquid phase (TLP), sintered silver (Ag) and sintered copper (Cu). This results in nine assembly configurations. Finite element models of the electronic modules are developed using ANSYS to apply thermal loads from room temperature to 250°C to induce deformations, strains and stresses in the electronic structure. Accordingly, the silicon chip deformations and maximum principal stresses of each assembly configuration are thoroughly examined.

The results indicate that DCB-based power modules markedly reduce Si die warpage and maximum principal stresses, suggesting enhanced resistance to thermal loads. In contrast, IMS systems exhibit the highest levels of die warpage and out-of-plane deformation. PCB substrates, however, induce the highest maximum principal stress values in the silicon die, potentially leading to accelerated crack initiation and propagation. While the die attach system has a minimal effect on die warpage, the silver-tin TLP bonds generate significantly higher die stresses compared with sintered Ag and sintered Cu, which both result in reduced stresses.

Power electronics exceptionally rely on ceramic-based and polymer-based substrate systems due to their superior thermal conductivity, heat resistance and electrical insulation properties. The strategic selection of substrate structures can significantly enhance the robustness of power. Ultimately, the findings of this research provide valuable insights for the design of highly reliable and efficient power modules subjected to thermal stress.

The present paper aims to study the influence of the substrate system on the thermomechanical response of various lead-free die attach materials used in power electronics using nonlinear finite element simulations.

Particularly, three ceramic substrate systems, including direct copper bonded (DCB) and aluminum nitride (AlN) – as well as silicon nitride (Si3N4) –based insulated metal substrate (IMS) configurations are examined in this study. Additionally, three die attach systems, namely, silver-tin transient liquid phase (TLP), sintered silver (Ag) and sintered copper (Cu) are included in the analysis. ANSYS software is employed to build the finite element models of the power modules and to conduct the nonlinear thermomechanical investigations.

The simulation results revealed that the IMS, Si3N4 and DCB-based power modules end up with significantly lower interconnect inelastic strains and inelastic strain energies suggesting better fatigue life performance. Additionally, the bonding layer stresses and expected failure mechanism are not influenced by the substrate configuration rather than the bond material. For instance, the silver-tin TLP joints develop high stresses and hence brittle failures are expected. Nonetheless, the sintered Ag and sintered Cu have significantly lower stresses which could lead to fatigue-induced failures.

Power electronics use various ceramic-based substrate systems because of their improved thermal conductivity, electrical insulation and heat resistance properties. The proper selection of the substrate structure could highly enhance the thermal fatigue of the power modules. Markedly, the findings of this research are useful for designing highly reliable and effective power modules continuously subjected to thermomechanical loadings.

In power electronics, there are various metallic material systems used as die attachments. The complete understanding of the thermomechanical behavior of such interconnections is very important. Therefore, this paper aims to examine the thermomechanical response of four famous die attach materials, including sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds, using nonlinear finite element analysis.

During the study, the mechanical properties of all die attach systems, including elastic and viscoplasticity parameters, are obtained from literature studies and hence incorporated into the numerical analysis. Subsequently, the bond stress–strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined.

The results showed that the silver-tin TLP bonds are more likely to develop higher inelastic strain energy densities, while the sintered silver and copper interconnects would possess higher plastic strains and deformations. Suggesting higher damage to such metallic die attachments. The expensive gold-based solders have developed least inelastic strain energy densities and least plastic strains as well. Thus, they are expected to have improved fatigue performance compared to other bonding configurations.

This paper extensively investigates and compares the mechanical and thermal response of various metallic die attachments. In fact, there are no available research studies that discuss the behavior of such important die attachments of power electronics when exposed to mechanical and thermomechanical loads.

This paper aims to present two Anand’s model parameter sets for the multilayer silver–tin (AgSn) transient liquid phase (TLP) foils.

The AgSn TLP test samples are manufactured using pre-defined optimized TLP bonding process parameters. Consequently, tensile and creep tests are conducted at various loading temperatures to generate stress–strain and creep data to accurately determine the elastic properties and two sets of Anand model creep coefficients. The resultant tensile- and creep-based constitutive models are subsequently used in extensive finite element simulations to precisely survey the mechanical response of the AgSn TLP bonds in power electronics due to different thermal loads.

The response of both models is thoroughly addressed in terms of stress–strain relationships, inelastic strain energy densities and equivalent plastic strains. The simulation results revealed that the testing conditions and parameters can significantly influence the values of the fitted Anand coefficients and consequently affect the resultant FEA-computed mechanical response of the TLP bonds. Therefore, this paper suggests that extreme care has to be taken when planning experiments for the estimation of creep parameters of the AgSn TLP joints.

In literature, there is no constitutive modeling data on the AgSn TLP bonds.

The purpose of this paper is to investigate the strain concentration factor in a central countersunk hole riveted in rectangular plates under uniaxial tension using finite element and response surface methods.

In this work, ANSYS software was elected to create the finite element model of the present structure, execute the analysis and generate strain concentration factor (,) data. Response surface method was implemented to formulate a second order equation to precisely compute (,) based on the geometric and material parameters of the present problem.

The computations of this formula are accurate and in a great agreement with finite element analysis (FEA) data. This equation was further used for obtaining optimum hole and plate designs.

An optimum design of the countersunk hole and the plate that minimizes the (,) value was achieved and hence validated with FEA findings.

This paper aims to examine the thermal cycling fatigue life performance of two-common solder array configurations, full and peripheral, using three-dimensional nonlinear finite element analysis.

The finite element simulations were used to identify the location of the critical solder interconnect, and using Darveaux's model, solder thermal fatigue life was computed.

The results showed that the solder array type does not significantly influence thermal fatigue life of the interconnect. However, smaller size packages result in improved life by almost 45% compared to larger package designs. Additionally, this paper provided an engineered study on the effect of the number of rows available in a perimeter array component on solder thermal fatigue performance.

General design recommendations for reliable electronic assemblies under thermal cycling loaded were offered in this research.