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Therapeutic landscapes can be beneficial for patients recovering from cognitive and behavioural impairments. The therapeutic garden in the Royal Talbot rehabilitation centre (RTRC) located in Kew, Melbourne is a precedent for its nature design outdoor spaces and horticultural therapy (HT) program for patients with cognitive impairments due to brain and spinal cord injuries. There have been no studies into the physical design of the RTRC therapeutic garden.

This case study unveils the critical design themes, and dominant physical elements of the RTRC therapeutic garden through site observation and analysis over the course of two months, a semi-structured interview with a key staff, and graphical representations using integrated photography and collaborative digital tools of AutoCAD and Adobe Photoshop.

Seven critical design themes are identified for the RTRC garden: (1) space layout and organization, (2) physical and visual access, (3) pathway and facility, (4) multisensory vegetation, (5) amenity, wayfinding and seasonal interest, (6) cognitive stimulation, (7) utility and HT. Qualitative and quantitative data analysed in visual and descriptive format reveal multisensory vegetation, amenity, wayfinding and seasonal interest, and utility and HT are the top three most pivotal critical design themes in the RTRC therapeutic garden.

The findings of this case study can be used to impart knowledge about the design of therapeutic landscape settings for cognitive impairments to design professionals and the public.

There is no case study has been conducted for this precedent of therapeutic garden in the Royal Talbot rehabilitation centre that targets for cognitive impairment patients. With the increasing awareness in medical and healthcare environments, this case study would help to inject mutual understanding, generate knowledge and design awareness among design professionals and public, and to cultivate more good quality healthcare settings.

The wafer level package (WLP) is a cost‐effective solution for electronic packaging and has been increasingly applied in recent years. The purpose of this paper is to propose a newly developed packaging technology, based on the concepts of the WLP, the panel base package (PBP) technology, in order to further obtain the capability of signal fan‐out for fine‐pitched integrated circuits (ICc).

In the PBP, the filler material is selected to fill the trench around the chip and provide a smooth surface for the redistribution lines. Therefore, the solder bumps could be located on both the filler and the chip surface and the pitch of the chip side is fanned‐out. The design concept and the manufacturing process of the PBP would first be described in this study. The three‐dimensional finite element model is established based on the real testing sample and the thermo‐mechanical behavior of the PBP is simulated.

It is found that the solder joint reliability of the PBP can be highly improved because of the applied stress buffer layer. However, the accumulated stress/strain from the coefficient of thermal expansion mismatch may transfer to the metal lines in package. In order to enhance the robustness of the redistribution lines, the bypassed type interconnect is suggested. Moreover, the trace/pad connecting junction and the conductive via which have smooth outline are preferred to avoid stress concentration effects.

In this paper, a low‐cost and short time‐to‐market packaging technology is proposed which is especially suitable for high density IC devices. The PBP technology has the ability to meet the requirements of major reliability testing conditions and it will have a high potential for application in the near future.