Mohsen Tajdinian, Shahram Montaser Kouhsari, Kazem Mohseni and Mehdi Zareian Jahromi
Decaying DC component has important effect on extracting the fundamental component phasor. It directly affects the precision of protective relaying algorithms which act based on…
Abstract
Purpose
Decaying DC component has important effect on extracting the fundamental component phasor. It directly affects the precision of protective relaying algorithms which act based on fundamental frequency component. It can be noted that decaying DC component, harmonic components and off-nominal frequency conditions are the major issues which strongly effect phasor estimation. The paper aims to discuss these issues.
Design/methodology/approach
This paper proposes a novel hybrid approach for fundamental phasor estimation in order to remove the decaying DC component using Hilbert Transform and Discrete Fourier Transform.
Findings
The proposed method (PM) converges to the original value in one cycle in presence of harmonic components and off-nominal frequency condition. In addition, proposed algorithm is able to detect the frequency fluctuation. Thus, it is applicable for static and dynamic conditions. An extensive set of simulation results across static and dynamic validations demonstrated that the proposed approach has faster convergence and better precision than the present methods. In addition, during harmonic distortion and also frequency fluctuation, the PM provides a correct and reliable response.
Originality/value
The PM can calculate the DC component exactly from fault current signals and can be used in digital protection algorithms for phasor estimation.
Details
Keywords
The processing techniques and materials utilized in the fabrication of a two-terminal electrostatically actuated micro-electro-mechanical cantilever-arrayed device used for radio…
Abstract
Purpose
The processing techniques and materials utilized in the fabrication of a two-terminal electrostatically actuated micro-electro-mechanical cantilever-arrayed device used for radio frequency tuning applications are presented in this work. The paper aims to discuss these issues.
Design/methodology/approach
The process, which is based on silicon surface micromachining, uses spin-coated photoresist as the sacrificial layer underneath the electroplated gold structural material and an insulating layer of silicon dioxide, deposited using plasma enhanced chemical vapour deposition (PECVD), to avoid a short circuit between the cantilever and the bottom electrode in a total of six major fabrication steps. These included the PECVD of the silicon dioxide insulating layer, optical lithography to transfer photomask layer patterns, vacuum evaporation to deposit thin films of titanium (Ti) and gold (Au), electroplating of Au, the dry release of the cantilever beam arrays, and finally the wafer dicing to split the different micro devices. These process steps were each sub-detailed to give a total of 14 micro-fabrication processes.
Findings
Scanning electron microscope images taken on the final fabricated device that was dry released using oxygen plasma ashing to avoid stiction showed 12 freely suspended micro-cantilevered beams suspended with an average electrostatic gap of 2.29±0.17 μm above a 4,934±3 Å thick silicon dioxide layer. Preliminary dimensional measurements on the fabricated devices revealed that the cantilevers were at least 52.06±1.93 μm wide with lengths varying from 377.97±0.01 to 1,491.89±0.01 μm and were at least 2.21±0.05 μm thick.
Originality/value
The cantilever beams used in this work were manufactured using electroplated gold, and photoresist was used as a sacrificial layer underneath the beams. Plasma ashing was used to release the beams. The beams were anchored to a central electrode and each beam was designed with varying length.