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This paper aims to investigate the steady-state creep of the multilayer Silver-Tin transient liquid phase (AgSn-TLP) interconnects of the power modules using experiments and constitutive modeling.

A series of engineered creep tests is executed at different temperatures and stress levels to produce creep strain versus time data. Accordingly, steady-state creep parameters are acquired through nonlinear regressions. Two steady-state creep relations, including hyperbolic sine and power laws, are created, and validated with measured data. Afterwards, numerical studies are executed to examine the thermomechanical response of the AgSn-TLP interconnects compared to other bond materials.

Generally, the AgSn- TLP interconnections showed higher resistance to the accumulation of creep strains, indicating their potential to perform efficiently in high temperature applications.

This paper models the steady-state creep response of the silver-tin TLP bonds using hyperbolic sine and power laws. These models are important for stress and strain analysis using numerical simulations.

This paper aims to present two Anand’s model parameter sets for the multilayer silver–tin (AgSn) transient liquid phase (TLP) foils.

The AgSn TLP test samples are manufactured using pre-defined optimized TLP bonding process parameters. Consequently, tensile and creep tests are conducted at various loading temperatures to generate stress–strain and creep data to accurately determine the elastic properties and two sets of Anand model creep coefficients. The resultant tensile- and creep-based constitutive models are subsequently used in extensive finite element simulations to precisely survey the mechanical response of the AgSn TLP bonds in power electronics due to different thermal loads.

The response of both models is thoroughly addressed in terms of stress–strain relationships, inelastic strain energy densities and equivalent plastic strains. The simulation results revealed that the testing conditions and parameters can significantly influence the values of the fitted Anand coefficients and consequently affect the resultant FEA-computed mechanical response of the TLP bonds. Therefore, this paper suggests that extreme care has to be taken when planning experiments for the estimation of creep parameters of the AgSn TLP joints.

In literature, there is no constitutive modeling data on the AgSn TLP bonds.

This study aims to explore the opportunities offered by interactive and situated learning (e-learning and m-learning) in support of education for sustainability in disciplines of the built environment.

The paper illustrates the development of an online portal and a mobile app aimed at promoting students’ motivation and engagement with sustainability in design, and discusses the outcomes of their testing, investigating users’ acceptance, comparing academic results and analysing feedback.

The findings add empirical evidence to the view that information and communication technology-enhanced pedagogies can substantially contribute to the agenda of sustainability in higher education, primarily due to their affordance of interactive communication and contextualisation of knowledge, while guaranteeing flexible time and pace of learning.

The study solely focused on the development and testing of e-learning and m-learning tools to foster students’ competence of sustainability in design studio work. The tools trialled were mostly at their prototypical stage and their testing included a relatively short-term evaluation and a narrow, self-selected, user base. However, the approach and findings are felt to be applicable to a much wider range of educational contexts.

Interactive and situated pedagogical methods and tools have the potential to prompt a departure from transmissive educational models, encompassing at once theoretical, experiential and analytic learning processes. This is of value to education for sustainability in disciplines of the built environment due to the requirement to holistically consolidate multi-/inter-/trans-disciplinary knowledge into a coherent design whole.