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Article
Publication date: 1 July 2006

Daniel Ioan, Gabriela Ciuprina and Marius Radulescu

The paper has the purpose of proposing a new open boundary condition to be used in conjunction with the finite integration technique (FIT) for the modelling of passive on‐chip…

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Abstract

Purpose

The paper has the purpose of proposing a new open boundary condition to be used in conjunction with the finite integration technique (FIT) for the modelling of passive on‐chip components.

Design/methodology/approach

This boundary condition is ensured by using a virtual layer that surrounds the computational domain.

Findings

The paper proves which are the optimal material properties of the equivalent layer of open boundary.

Practical implications

When modelling passive on‐chip components with FIT, the method proposed is more efficient than the strategic dual image technique.

Originality/value

The paper shows the advantage of this approach – that the analysis algorithm remains unchanged, while saving the field‐circuit compatibility properties, such as current conservation.

Details

COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, vol. 25 no. 3
Type: Research Article
ISSN: 0332-1649

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