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This paper aims to propose the method of automatic robotic assembly of two or more parts placed without fixing instrumentation and positioning on the pallet.

Assembly tasks performed by industrial robots are usually based on a constant program, extensive tooling, fixing objects in a given place and a relatively limited sensory system. In this study, a different approach is presented. The industrial robot program is adjusted to the location of parts for assembly in the work space. This leads to a transition from a clearly defined assembly sequence realized by the industrial robot to the one in which the order of execution of the assembly operations can be determined by the mutual position of parts to be assembled.

The method presented in this study combines many already known algorithms. The contribution of the authors is to test and select the appropriate combination of methods capable of supporting robotic assembly process based on data from optical 3D scanners. The sequence of operations from scanning to place the parts in the installation position by an industrial robot is developed. A set of parameters for selected methods is presented. The result is a universal procedure that determines the position of the preset models in partial measurements performed at a fixed relative position of the sensor, the measurement object.

The developed procedure for determining the position of the parts is essential to develop a flexible robotic assembly system. It will be able to perform the task of assembly on the basis of appropriate search algorithms taking into account the selected and implemented sequence of assembly position and orientation of parts, particularly the base unit freely placed on an assembly pallete. It is also the basis of a system for testing different algorithms to optimize the flexible robotic assembly.

The purpose of this paper is to deal with material and technological aspects of SiC diodes assembly in ceramic packages. The usefulness of combinations of different materials and assembly techniques for the creation of inner connection system in the ceramic package, as well as the formation of outer connections able to work at temperatures up to 350°C, were evaluated.

The ceramic package consists of direct bonded copper (DBC) substrate with Cu pads electroplated by Ni or Ni/Au layers on which a SiC diode was assembled by sintering process using Ag microparticles. For the connections inside the ceramic package, the authors used Al/Ni and Au-Au material system based on aluminium or gold wire bonding. The authors sealed the ceramic package with glass encapsulation and achieved a full encapsulation. Outer connections were manufactured using Cu ribbon plated with Ag layer and sintered to DBC by Ag micro particle. The authors investigated the long-term stability of electrical parameters of SiC diodes assembled in ceramic package at temperature 350°C.

The authors have shown that Schottky and PiN SiC diodes assembled with different technologies and materials in ceramic package keep their I-V characteristics unchanged during ageing at 350°C for 400 h.

The SiC diodes assembled into ceramic package with Al/Ni or Au-Au inner electrical connection systems and outer connections system based on Ag microparticles sintering process of Cu/Ag ribbon to DBC substrate can work reliably in temperature range up to 350°C.