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Publication date: 9 December 2024

Choon Sen Seah, Yin Xia Loh, Mohammad Falahat, Wing Son Loh and Ahmad Najmi Amerhaider Nuar

The exponential rise of digital payments has underscored the critical importance of digital payment security, particularly in payment gateway systems. This chapter delves into the…

Abstract

The exponential rise of digital payments has underscored the critical importance of digital payment security, particularly in payment gateway systems. This chapter delves into the vulnerabilities within these systems and proposes a comprehensive security enhancement framework to address them. Recent security breaches, such as those at SONY and Ontario’s birth registry, have emphasised the urgent need for improved protective measures. The proposed framework integrates advanced technologies like data encryption, next-generation firewalls (NGFWs), unified threat management (UTM), network traffic analysis, and multi-factor authentication (MFA). It aims not only to defend against current cyber threats but also to remain adaptable to future vulnerabilities, ensuring the integrity, confidentiality, and availability of transactional data. Moreover, aligning with regulatory standards such as the Payment Card Industry Data Security Standard (PCI DSS) and the General Data Protection Regulation (GDPR) is crucial for building trust and ensuring security in the digital transaction ecosystem. This chapter also highlights the importance of balancing security measures with user experience and advocates for user education and user-centric security solutions. Emerging technologies like artificial intelligence (AI) and blockchain are proposed for real-time fraud detection and maintaining immutable transaction records, offering innovative solutions to contemporary security challenges. Empirical analysis supports the efficacy of the proposed framework, showing improvements in data loss prevention, user satisfaction, and fraud mitigation. This framework, termed ‘Guardians of Trust’, represents a paradigm shift in payment gateway security, providing a scalable and forward-looking model that balances robust security protocols with user experience and compliance considerations. This chapter contributes significantly to the academic discourse on digital payment security.

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Augmenting Retail Reality, Part A: Blockchain, AR, VR, and the Internet of Things
Type: Book
ISBN: 978-1-83608-635-2

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Article
Publication date: 1 February 1987

C. Lea, F.H. Howie and M.P. Seah

The amount of gas blowing into the molten solder in plated‐through‐holes during wave soldering is dependent upon the moisture content of the board and the strength of the copper…

26

Abstract

The amount of gas blowing into the molten solder in plated‐through‐holes during wave soldering is dependent upon the moisture content of the board and the strength of the copper barrels to withstand the pressure of gas. This strength is dependent, in turn, upon both the thickness of the copper electroplate and the quality of the original electroless copper deposit. The problem of blowholing may be overcome by improving the copper quality and/or by baking the PCB prior to soldering. This paper gives a scientific framework linking the important parameters involved in the control of blowholing. Full data are given to enable the allowable moisture content of a PCB to be calculated in respect of the pressure generated during soldering and of the strength of the copper barrels. If baking is required to attain the required low moisture levels, then certain data are required to quantify the effects of the storage times and the environment conditions between that bake and the subsequent soldering. These data are given.

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Circuit World, vol. 13 no. 3
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 April 1986

C. Lea, M.P. Seah and F.H. Howie

The importance of the quality of the plated‐through‐hole copper barrel in double‐sided and multilayer PCBs is considered with regard to the problem of voids and blowholes in the…

27

Abstract

The importance of the quality of the plated‐through‐hole copper barrel in double‐sided and multilayer PCBs is considered with regard to the problem of voids and blowholes in the solder fillet. The thickness of the copper, and its integrity and adherence to the drilled surface define its ability to withstand the pressure burst of gas from the outgassing laminate during the few seconds of the thermal spike induced by the molten solder prior to solidification. The ability of copper electroplate to bridge over areas devoid of electroless copper and produce a barrel free of pinholes is shown to be crucial to this problem. In addition, the use of a nickel layer is shown to enhance greatly the impermeability of the barrel to the evolving gases.

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Circuit World, vol. 13 no. 1
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 February 1988

C.A. Smith

Water absorption is a serious problem in all polymeric materials, including the glass fibre‐epoxide resin laminates used in printed circuit board manufacture. This paper describes…

97

Abstract

Water absorption is a serious problem in all polymeric materials, including the glass fibre‐epoxide resin laminates used in printed circuit board manufacture. This paper describes experiments to determine the level of water absorption in these materials under different conditions of relative humidity and temperature using thermogravimetric analysis.

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Circuit World, vol. 14 no. 3
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 March 1986

M.P. Seah, F.H. Howie and C. Lea

This is the third paper in the series of eight, studying voids and blowholes in PTH printed circuit boards. In the previous papers the industrial significance of this problem has…

32

Abstract

This is the third paper in the series of eight, studying voids and blowholes in PTH printed circuit boards. In the previous papers the industrial significance of this problem has been established and moisture identified as the primary cause of the gassing. Now, particular attention is focused on the understanding of the mechanisms and kinetics of moisture uptake in the FR‐4 laminate. From the authors' data the rate of moisture uptake and the rate of drying of laminate can be predicted as a function of temperature and relative humidity.

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Circuit World, vol. 12 no. 4
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 January 1987

F.H. Howie, D. Tilbrook and C. Lea

For a given batch of printed circuit boards of a particular quality and with a particular level of moisture absorption, the parameters of a wave soldering machine may be tuned to…

24

Abstract

For a given batch of printed circuit boards of a particular quality and with a particular level of moisture absorption, the parameters of a wave soldering machine may be tuned to minimise the amount of visible blowholing. This paper shows the inter‐relationships of blowholing with other soldering faults such as icicling, bridging and poor pull‐through. The inter‐relationships result from adjusting each machine parameter in turn. This is important since blowholing cannot be minimised without regard to these other effects. The effect of the quality of the printed circuit boards on the response to machine parameters is predicted from a model, and measurements are found to be in agreement with the predictions.

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Circuit World, vol. 13 no. 2
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 March 1991

J. Lau, S. Leung, R. Subrahmanyan, D. Rice, S. Erasmus and C.Y. Li

In this study, the reliability of solder joints and plated‐through hole copper pads/barrels of pin grid array assemblies under rework condition has been determined by fatigue…

37

Abstract

In this study, the reliability of solder joints and plated‐through hole copper pads/barrels of pin grid array assemblies under rework condition has been determined by fatigue experiments. The cross‐sections of the re‐worked PGA assemblies (before and after fatigue tests) are also provided for a better understanding of the failure mechanisms of the composite structure. Furthermore, the load‐drop curves of the PGA interconnects for up to three reworks are provided for a better estimate of their fatigue life.

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Circuit World, vol. 17 no. 4
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 April 1986

C. Lea and F.H. Howie

The drilling and preparation of a hole in FR‐4 laminate prior to the deposition of electroless copper is considered in relation to the quality of soldering achieved on the…

37

Abstract

The drilling and preparation of a hole in FR‐4 laminate prior to the deposition of electroless copper is considered in relation to the quality of soldering achieved on the finished printed circuit board. Data pertaining to the drill speed, drill feed, and stack position are presented and the effect of drilling temperature is demonstrated. The variability of laminate is discussed in relation to outgassing during soldering. Finally the importance of the post‐drilling treatment of the hole‐wall is shown. The relative effects of baking after drilling, ultrasonic cleaning and chemical treatments such as alkaline potassium permanganate are illustrated.

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Circuit World, vol. 13 no. 1
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 March 1986

C. Lea and F.H. Howie

This paper introduces a series of eight describing the research work undertaken into the most pervasive of quality assurance problems in the mass soldering of plated‐through‐hole…

26

Abstract

This paper introduces a series of eight describing the research work undertaken into the most pervasive of quality assurance problems in the mass soldering of plated‐through‐hole (PTH) printed circuit boards, namely the occurrence of voids and blowholes in the solder fillets. The research programme has been carried out at NPL with advice and practical involvement of members of the Soldering Science and Technology Club whose contributions have played a large part in its successful outcome. The work has led to an understanding of the mechanisms giving rise to this problem and recommendations for production procedures to fully control it. In this first paper, results are presented of a UK‐wide survey of the electronics assembly industry and of the assessment made regarding the extent, the harmfulness and the cost of the problem of voids and blowholes.

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Circuit World, vol. 12 no. 4
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 March 1990

C. Lea

One family of defects in soldered electronic assemblies that is almost invariably re‐worked is that due to outgassing, manifested as visible blowholes and solder blow‐out. It is…

25

Abstract

One family of defects in soldered electronic assemblies that is almost invariably re‐worked is that due to outgassing, manifested as visible blowholes and solder blow‐out. It is known that re‐working can be very detrimental to the service life of an electronic assembly and should be avoided whenever possible. This paper describes work aimed to determine whether outgassing faults such as blowholes are harmful to service performance or whether more harm will be done by re‐working such faults. Standard test plated‐through‐hole (PTH) assemblies with controlled degrees of outgassing faults have been subjected to mechanical testing, thermal shock testing, mechanical fatigue, low cycle thermal fatigue and corrosion testing. Measurements in all these régimes have been carried out quantitatively with baseline controls. No evidence of significant loss of solder joint performance has been found, even for severe cases of solder loss. On the contrary, in cyclic fatigue testing, solder fillets with outgassing faults exhibit statistically significant performance enhancement. The conspicuous nature of blowholing and solder blow‐out undoubtedly over‐emphasises the problem during visual quality control inspection. Provided the copper barrel has been wet by the solder, outgassing faults should not be re‐worked. These faults should be used as process indicators and to draw attention to processes and the need for process control.

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Circuit World, vol. 16 no. 4
Type: Research Article
ISSN: 0305-6120

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