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Article
Publication date: 1 March 1988

G. De Mey, L. Rottiers, M. Driscart, E. Boone and L. Van Schoor

In this paper the temperature distribution in hybrid circuits will be studied in two different ways. First of all the results of numerical simulations obtained with the programs…

27

Abstract

In this paper the temperature distribution in hybrid circuits will be studied in two different ways. First of all the results of numerical simulations obtained with the programs PROMETHEE and HYBRITHERM will be shown. Secondly, experimental temperature plots obtained with infra‐red thermography will be compared with the theoretical results. The influence of the substrate material (epoxy, glass, Al2O3, AlN and BeO) on the temperature distribution will be demonstrated. Various ways of cooling will also be considered. It will be shown that using high quality substrates such as AlN or BeO is not always useful from a thermal point of view.

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Microelectronics International, vol. 5 no. 3
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 1 February 1990

G. De Mey

In this contribution a short review is given on thermal analysis of hybrid circuits using 2‐D, 3‐D and time‐dependent models. It will be shown which models are necessary to be…

19

Abstract

In this contribution a short review is given on thermal analysis of hybrid circuits using 2‐D, 3‐D and time‐dependent models. It will be shown which models are necessary to be included in a CAD system for hybrid circuit design.

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Microelectronics International, vol. 7 no. 2
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 1 January 1988

G. De Mey and L. Van Schoor

In this contribution a linear thermal model for hybrid circuits is presented. Both the heat dissipated in screen printed resistors and in mounted components such as transistors…

30

Abstract

In this contribution a linear thermal model for hybrid circuits is presented. Both the heat dissipated in screen printed resistors and in mounted components such as transistors and integrated circuits is taken into account.

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Microelectronics International, vol. 5 no. 1
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 1 January 1991

C. Zardini, F. Rodes, G. Duchamp and J.‐L. Aucouturier

Among the main factors to be considered for the thermal optimisation of hybrid power modules are: the thermal resistance between the power chips and the bottom of the case; the…

18

Abstract

Among the main factors to be considered for the thermal optimisation of hybrid power modules are: the thermal resistance between the power chips and the bottom of the case; the thermal coupling between adjacent chips; and the ability of the module to withstand the thermal overloads induced by electrical surges. In this paper, the authors show how a finite element code can be used to optimise a hybrid power assembly in both steady‐and unsteady‐state. Comparisons made between results obtained with 3D and 2D simulations show that for hybrid power modules 2D simulations are generally unreliable. However, thermal studies cannot guarantee the reliability of hybrid power assemblies. Studies relative to hybrid power circuits must be thermomechanical.

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Microelectronics International, vol. 8 no. 1
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 1 January 1994

A. Kos

The paper presents a two‐dimensional and three‐dimensional thermal model of the power hybrid circuit. Measurement of the accuracy of temperature computation using the…

17

Abstract

The paper presents a two‐dimensional and three‐dimensional thermal model of the power hybrid circuit. Measurement of the accuracy of temperature computation using the two‐dimensional model is carried out. Based on both models, the AUTO_T program for thermal analysis is created. This program chooses the proper model according to the required accuracy of computation. The reduction of the computational time is evident.

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Microelectronics International, vol. 11 no. 1
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 1 March 1991

G. De Mey

Computer algebra or symbolic manipulation is nothing else than performing analytical calculations with the help of a computer. This offers the advantage that lengthy and…

28

Abstract

Computer algebra or symbolic manipulation is nothing else than performing analytical calculations with the help of a computer. This offers the advantage that lengthy and complicated calculations can be carried out without errors in a very short time. Computer algebra techniques have also been applied to solve electrical networks. This offers particular advantages for hybrid circuit design, as will be outlined extensively in this paper.

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Microelectronics International, vol. 8 no. 3
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 1 December 2000

B. Radojcoić, R. Ramović and O. Aleksić

A two‐dimensional model for hybrid circuits is presented in this paper. Simulation results of a hybrid power module for different power dissipation of components and ambient…

191

Abstract

A two‐dimensional model for hybrid circuits is presented in this paper. Simulation results of a hybrid power module for different power dissipation of components and ambient temperature are given. The experimental contribution is based on thermal measurements of the realized hybrid power module using a matrix of flip‐chip sensors. Thermal measurements were taken at different ambient temperatures and different hybrid module power values. The temperature distributions obtained theoretically and experimentally are compared and analyzed. Finally, the contribution of the temperature distributions and measured temperatures to the reliability of the hybrid power module is given.

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Microelectronics International, vol. 17 no. 3
Type: Research Article
ISSN: 1356-5362

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