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Article
Publication date: 16 January 2007

Keng Boon Ooi, Nooh Abu Bakar, Veeri Arumugam, Lorraine Vellapan and Alex Kim Yin Loke

This paper seeks to examine employees' perceptions of TQM practices and its impact on job satisfaction within a large Malaysian outsourced semiconductor assembly and test (OSAT…

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Abstract

Purpose

This paper seeks to examine employees' perceptions of TQM practices and its impact on job satisfaction within a large Malaysian outsourced semiconductor assembly and test (OSAT) organization. Despite extensive research on TQM practices, none examines this scope of investigative study. Therefore, the proposed model was developed with the intention of examining this relationship.

Design/methodology/approach

Original research using self‐completed questionnaires, distributed to all staff within this organization, is thoroughly reported. The study sample consisted of 230 employees, resulting in a response rate of 76.6 percent. A questionnaire developed by Wright and Cropanzana was used for ascertaining the level of overall job satisfaction. Data were analyzed by employing correlation and multiple regression analysis.

Findings

The results revealed that teamwork, organizational trust, organizational culture and customer focus are positively associated with employees' job satisfaction. It is also found that, where teamwork was perceived as a dominant TQM practice, improvements in job satisfaction levels were significant. Further, the result of the multiple regression analysis supports the proposed model based on the empirically validated soft TQM instruments, which are reliable and valid.

Originality/value

The findings make a significant contribution by using a major Malaysian OSAT organization that proves to be useful as an example of a methodology that might be used to track the extent of TQM effects on job satisfaction. A firm could use this instrument to do a pre‐test baseline measurement, and then periodically re‐administer it to identify changes associated with TQM efforts.

Details

International Journal of Quality & Reliability Management, vol. 24 no. 1
Type: Research Article
ISSN: 0265-671X

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Article
Publication date: 1 September 2006

Keng Boon Ooi, Arumugam Veeri, Loke Kim Yin and Lorraine Subathra Vellapan

The main purpose of this study is to explore the relationship between total quality management (TQM) practices and employees' propensity to remain within a large Malaysian…

2876

Abstract

Purpose

The main purpose of this study is to explore the relationship between total quality management (TQM) practices and employees' propensity to remain within a large Malaysian semiconductor packaging organization. Despite extensive research on TQM practices, none examines this scope of investigative study. Therefore, the proposed model was developed with the intention of examining this relationship.

Design/methodology/approach

Original research using self‐completed questionnaires, distributed to all staff within this organization is thoroughly reported. The study sample consisted of 230 employees, resulting in a response rate of 76.6 percent. A questionnaire developed by Udo, Guimaraes and Igbaria was adapted for ascertaining the level of employees' propensity to remain. Data were analyzed by employing correlation and simple linear regression analysis.

Findings

The results revealed that customer focus, organizational trust, organizational communication, employee involvement and empowerment are positively associated with employees' propensity to remain. It is also found that where organizational trust was perceived as a dominant TQM practice; improvements in employees' propensity to remain levels were significant. Further, the result of the simple linear regression analysis supports the proposed model based on the empirically validated soft TQM instruments, which are reliable and valid.

Originality/value

The study contributes in advancing the TQM literature to a better understanding of the influence of TQM on the propensity to remain among employees within a major semiconductor sector.

Details

The TQM Magazine, vol. 18 no. 5
Type: Research Article
ISSN: 0954-478X

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