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1 – 4 of 4Danqing Fang, Chengjin Wu, Yansong Tan, Xin Li, Lilan Gao, Chunqiu Zhang and Bingjie Zhao
The paper aims to study the effect of sintering temperature on the microstructure, shear strength and ratcheting fatigue life of nanosilver sintered lap shear joint. In addition…
Abstract
Purpose
The paper aims to study the effect of sintering temperature on the microstructure, shear strength and ratcheting fatigue life of nanosilver sintered lap shear joint. In addition, the Gerber model is used to predict the ratcheting fatigue lives of nanosilver sintered lap shear joints at different sintering temperatures.
Design/methodology/approach
In this paper, the nanosilver sintered lap shear joints were prepared at three sintering temperatures of 250 °C, 280 °C and 310 °C. The bonding quality was characterized by scanning electron microscopy, X-ray diffraction, transmission electron microscope and shear tests, and the long-term reliability was studied by conducting ratcheting fatigue tests. In addition, three modified models based on Basquin equation were used to predict the ratcheting fatigue life of nanosilver sintered lap shear joint and their accuracies were evaluated.
Findings
When the sintering temperature is 250°C, the nanosilver sintered lap shear joint shows the porosity of 22.9 ± 1.6 %, and the shear strength of 22.3 ± 2.4 MPa. Raising the sintering temperature enhances silver crystallite size, strengthens sintering necks, thus improves shear strength and ratcheting fatigue life in joints. In addition, the ratcheting fatigue lives of the joints sintered at different temperatures are effectively predicted by three equivalent force models, and the Gerber model shows the highest life prediction accuracy.
Research limitations/implications
The sintered silver bondline is suffering a complex stress state. The study only takes the shear stress into consideration. The tensile stress and the combination of shear stress and tensile stress can to be considered in the future study.
Practical implications
The paper provides the experimental and theoretical support for robust bonding and long-term reliability of sintered silver structure.
Social implications
The introduced model can predict the ratcheting fatigue lives of the joints sintered at different temperatures, which shows a potential in engineering applications.
Originality/value
The study revealed the relationship between the sintering temperature and the microstructure, the shear strength and the ratcheting fatigue life of the joint. In addition, the Gerber model can predict the ratcheting fatigue life accurately at different sintering temperatures.
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Abstract
Purpose
This review paper aims to provide a better understanding of formulation and processing of anisotropic conductive adhesive film (ACF) material and to summarize the significant research and development work for the mechanical properties of ACF material and joints, which helps to the development and application of ACF joints with better reliability in microelectronic packaging systems.
Design/methodology/approach
The ACF material was cured at high temperature of 190°C, and the cured ACF was tested by conducting the tensile experiments with uniaxial and cyclic loads. The ACF joint was obtained with process of pre-bonding and final bonding. The impact tests and shear tests of ACF joints were completed with different aging conditions such as high temperature, thermal cycling and hygrothermal aging.
Findings
The cured ACF exhibited unique time-, temperature- and loading rate-dependent behaviors and a strong memory of loading history. Prior stress cycling with higher mean stress or stress amplitude restrained the ratcheting strain in subsequent cycling with lower mean stress or stress amplitude. The impact strength and adhesive strength of ACF joints increased with increase of bonding temperature, but they decreased with increase of environment temperature. The adhesive strength and life of ACF joints decreased with hygrothermal aging, whereas increased firstly and then decreased with thermal cycling.
Originality/value
This study is to review the recent investigations on the mechanical properties of ACF material and joints in microelectronic packaging applications.
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Hong Gao, Jianhua Ma, Lilan Gao, Dunji Yu and Jinsheng Sun
The purpose of this paper is to determine: how the thermal cycling aging affects the ratcheting behavior of anisotropic conductive adhesive film (ACF); how the loading conditions…
Abstract
Purpose
The purpose of this paper is to determine: how the thermal cycling aging affects the ratcheting behavior of anisotropic conductive adhesive film (ACF); how the loading conditions and loading history affect the ratcheting strain and strain rate of ACF with different thermal cycling aging histories.
Design/methodology/approach
The ACF of CP6920F was cured at 190°C in an electro-thermal vacuum drying apparatus for 30 s. The cured specimens were put into the thermal cycling chamber (−40-150°C) for aging to 25, 50, 100, 200 and 500 cycles. A series of uniaxial ratcheting tests of aged ACF after different thermal cycles was carried out under stress control at 80°C.
Findings
The ACF subjected to larger number of thermal aging cycles exhibits less ratcheting strain under the same loading conditions. The ACF with the same thermal cycling aging history shows more ratcheting strain and a higher ratcheting strain rate when loaded under a larger mean stress or stress amplitude or a lower loading rate. The ratcheting behavior of aged ACF is found to be more sensitive to the lower loading rate. The higher mean stress (or stress amplitude) enhances the deformation resistance and consequently restrains the ratcheting strain of subsequent cycling with a lower mean stress (or stress amplitude). The prior lower loading rate accelerates the plastic deformation more significantly than the higher one.
Originality/value
The influencing trends of thermal cycling aging, loading condition and loading history on ratcheting behavior of ACF are obtained, which is important for the design and safety assessment of ACF joints.
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Jingyan Gao, Lina Ren, Yang Yang, Duo Zhang and Lan Li
This research clarifies the connotations and dimensions of artificial intelligence (AI) technology stimulation and establishes a stimulus scale to explain the relationship between…
Abstract
Purpose
This research clarifies the connotations and dimensions of artificial intelligence (AI) technology stimulation and establishes a stimulus scale to explain the relationship between AI technology stimuli and smart customer experience.
Design/methodology/approach
This is an empirical study that uses SPSS 24.0 software to perform hypothesis testing on the path relationships between model elements.
Findings
Two dimensions of AI technology stimuli (i.e. passion and usability) have a significant, positive impact on smart customer experience; the moderating effects of contrasting dimensions of technology readiness (i.e. optimism and discomfort) are significantly different; smart customer experience has a significant, positive impact on the word-of-mouth (WOM) intentions of consumers.
Research limitations/implications
There are several limitations. Most importantly, the data collected in this study are only from consumers who use intelligent customer service robots in the catering industry. Future research can consider exploring relevant AI technologies in other sectors.
Practical implications
This study has several implications that guide catering companies to develop various positioning and strategies for remaining competitive effectively.
Originality/value
Based on arousal theory, customer experience theory and WOM marketing theory, this is the first novel research project that empirically discusses the dimensions of AI technology stimuli, smart customer experience and WOM intentions with regard to the moderating effect of the technology readiness of consumers toward AI technology.
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