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This study aims to minimize the warpage issue in memory-computing integrated chiplets with 2.5D packaging on a large-scale wafer subjected to multistress through synergistic optimization of key structure paraeters.

In this study, memory-computing integrated chiplet-based 2.5D packaging was designed and the warpage optimization under electro-thermal-vibration coupling was conducted with finite element analysis simulation. Compared studies were also conducted with the imposing condition of single electrical and thermal stress.

The research results indicated that electrical and thermal stress had a significant impact on the packaging warpage while that of vibration on warpage was minimal. For structure parameters, the chiplet thickness had a significant effect on the warpage of the model, while the influence of chiplet size was relatively small. When the chiplet thickness decreased to 100 µm, the warpage was reduced by 8.96%. Under thermal stress loading, the impact of packaging density on the overall warpage of the chiplet-based 2.5D packaging model is relatively small. However, under the loading of electrical stress or electro-thermal coupling, the packaging density has a severe impact on warpage, with the maximum approaching 1.3011 µm for just one chiplet. Compared with vibration alone, electro-thermal-vibration coupling slightly increased the warpage, which is primarily evident in the exacerbation of warpage in stacked chiplets and edge locations. Lower packaging density with 150 µm chiplet thickness contributed to a minimal warpage in stacked chiplet, the edge locations of which exhibited a relatively severe warpage.

The research provides a theoretical basis for warpage optimization of memory-computing integrated chiplets with 2.5D packaging subjected to multistress coupling.

When designing the layout of chips for large-sized high-reliability silicon substrates, this method can be used to control the most severely warped areas at the edges, thus making it easier to optimize warpage.

With the approaching of physical limits dictated by Moore’s Law, advanced packaging technologies, primarily centered around 2.5D packaging and three-dimensional packaging, were attached importance to. It can integrated multifunctional chips, which have become increasingly complex, leading to greater difficulty in design and implementation, and an obvious increase in overall manufacturing costs. In this context, chiplets offered a viable approach for future chip designs. With the high demand for high-performance computing, memory-computing integrated chiplets were designed. The warpage of 2.5D packaging by altering structural parameters under multiphysical field coupling conditions was studied to provide a theoretical basis for warpage optimization of memory-computing integrated chiplets with 2.5D packaging.

The submitted paper is mainly concerned with the cracking of blind and buried vias of printed circuit board (PCB) for smartphones which were encountered with abnormal display problems like scramble display or no display during service and had to be recalled.

To found out the root causes of this failure and dissolve this commercial dispute, comprehensive failure analysis was performed on the printed circuit board assemblies (PCBAs) and PCBs of the failed smartphone, such as macrograph and micrograph observation, chemical compositions analysis, thermal performance testing and blind via pull-off experiment, which finally helped to determine the causes. Besides that, the failure mechanisms were discussed in detail, and pertinent countermeasures were proposed point by point.

It was found that the PCB blind vias cracking was the main reason for the scramble display or no display of the smartphone, and the incomplete cleaning process before copper plating was the root cause of the blind vias cracking.

Achievement of this paper would not only help to provide the solid evidence for determining the responsibility of this commercial dispute but also lead to a better understanding of the failure mechanisms and prevention methods for similar failure cases of other advanced mobile phones.

Most failure analysis researches of PCBAs only focused on the unqualified products from manufacturing, while this paper addressed a failure analysis case of PCBAs products for smartphones from actual services, which was relatively rarely reported in the past.

This study aims to investigate scholars’ roles in resolving environmental community conflict, as environmental community conflict is becoming an increasingly serious problem in contemporary China, and it explored the underlying factors and mechanisms that influence successful conflict resolution.

Based on a combination of three types of sources – interviews, participant observation and existing literature, the study compared and contrasted 35 cases through a two-stage study project with 25 environmental community conflict cases in the first stage and ten non-environmental cases in the second.

Results indicate that scholars serve seven roles in community conflict resolution: identification persons for potential sources of community conflict and supporters for the people who evaluate conflict problems before attempting to solve them; advisers for conflict protagonists; leaders of many knowledge-related activities; organizers of entrepreneurial activities for other community members; information brokers between community members and other stakeholders; representatives of the government, firms, community members and other stakeholders; and self-interested participants. While scholars’ participation is important for resolving community conflict, their actions are often not effective. Successful community conflict resolution involving scholars must satisfy eight underlying factors: local scholars’ sustained participation; high capacity; improvement on the organizational level of community members; emphasis on high efficiency knowledge and information transmission; effective finding and use of the community’s social capital; continual optimization on their action strategies; obtainability of some benefits; and non-local scholars’ sustained external support through social capital. The more closely these rules are followed, the more successful scholars’ participation in community conflict resolution will be.

The findings have practical implications for improving the effectiveness of scholars’ participation in community conflict resolution in contemporary China and even in other countries.

The purpose of this paper is to understand the mediating effects of Chief Executive officer (CEO) attributes on the earliness of internationalization and performance in context of Indian small and medium enterprises (SMEs).

The proposed framework is tested through analysis of a sample of 102 internationalized SMEs of the engineering industry in the Bangalore city region of India.

Results highlight that CEOs age and educational background moderates between early internationalization and performance in the Indian SME context.

Overall results facilitate in leveraging the decision-maker’s capabilities to successfully formulate and strategize their international marketing efforts to achieve higher performance.

The study enriches the importance of CEO attributes in influencing the early internationalization and degree of internationalization in the context of an emerging economy where studies are limited.

The purpose of this paper is to study the reasons and decision-making processes of heterogeneous firms’ bribery behavior, and how they will affect an aggregate economy’s development and corruption status.

The authors build a dynamic model to study a firm’s joint decision to bribe and invest, and how the decision is determined by its production and infrastructure status. The authors simulate the firm-level decision and development paths, and then build an aggregate economy consisting of heterogeneous firms. The authors then also simulate the development and corruption growth paths of the economy, by calibrating the model according to Chinese manufacturing firms in 2012.

Following the simulation results, the authors conduct counterfactual policy analyses. By comparing between the simulation results of two different counterfactual scenarios, the authors study how a government could control bribing better – as to decrease the number of bribers, and the average amount of the bribery payments. It is found that directly raising the bribery costs works more efficiently in controlling corruption, compared with reducing the benefits received by the bribers. The finding provides insightful policy implications for the government to clear up its economy.

The paper makes a novel and unique contribution to the literature by filling the current theoretical gap. The authors introduce a dynamic firm-level model to interpret firms’ bribery decisions and replicate the aggregate stylized facts. The paper innovatively treats bribery as both discrete and continuous decisions. Given both types of bribery decisions, now the authors can successfully simulate and quantify a firm’s intertemporal status and growth path.

This paper aims to develop the thermal resistance network model based on the heat dissipation paths from the multi-die stack to the ambient and takes into account the composite effects of the thermal spreading resistance and one-dimensional (1D) thermal resistance. The thermal spreading resistance comprises majority of the thermal resistance when heat flows in the horizontal direction of a large plate. The present study investigates the role of determining the temperature increase compared to the thermal resistances intrinsic to the 3D technology, including the thermal resistances of bonding layers and through silicon vias (TSVs).

This paper presents an effective method that can be applied to predict the thermal failure of the heat source of silicon chips. An analytical model of the 3D integrated circuit (IC) package, including the full structure, is developed to estimate the temperature of stacked chips. Two fundamental theories are used in this paper – Laplace’s equation and the thermal resistance network – to calculate 1D thermal resistance and thermal spreading resistance on the 3D IC package.

This paper provides a comprehensive model of the 3D IC package, thus improving the existing analytical approach for predicting the temperature of the heat source on the chip for the 3D IC package.

Based on the aforementioned shortcomings, the present study aims to determine if the use of an analytical resistance model would improve the handling of a temperature increase on the silicon chips in a 3D IC package. To achieve this aim, a simple rectangular plate is utilized to analyze the temperature of the heat source when applying the heat flux on the area of the heat source. Next, the analytical model of a pure plate is applied to the 3D IC package, and the temperature increase is analyzed and discussed.

The main contribution of this paper is the use of a simple concept and a theoretical resistance network model to improve the current understanding of thermal failure by redesigning the parameters or materials of a printed circuit board.

In this paper, an analytical model of a 3D IC package was proposed based on the calculation of the thermal resistance and the analysis of the network model.

The aim of this work was to estimate the mean temperature of the silicon chips and understand the heat convection paths in the 3D IC package. The results reveal these phenomena of the complete structure, including TSV and bump, and highlight the different thermal conductivities of the materials used in creating the 3D IC packages.

Most companies rarely work on sustainable development as a whole, which includes environmental, social, governance, and economic pillars. The purpose of this paper is to explore causal relationships between pillar scores and overall score of sustainability and identify the most critical pillar to which policy makers should allot limited resources with the highest priority.

Based on Thomson Reuters ASSET4 database of global corporate sustainability, this paper examines the causal relations between pillar scores and overall score of sustainability by using the three-stage integrative methodology consisting of cluster analysis, data mining, and partial least square path modeling.

This paper finds that each pillar has unequal effects on the overall corporate sustainability and that the overall score is affected by not only the direct effects from pillar scores but also the indirect effects from the causal interrelations among pillars. Moreover, the patterns of causal directions and the most critical pillar are sensitive to industries. Social performance is the most critical pillar for the majority of industries, followed by environmental performance, and economic performance, respectively. The governance performance, however, is not the most critical pillar in any industry.

To construct a roadmap for reform priorities, policy makers should follow the top-down approach which involves hierarchical decisions. Using the three-stage methodology, the policy makers first decide on the most critical pillar score before selecting the most critical category score underneath.

Relaxing traditional assumptions of simple average overall score of corporate sustainability, the three-stage integrative framework allows for causal interrelations among pillars and different weights on individual pillars.

The purpose of this study is to investigate the causal interrelations among the four pillars of corporate sustainability, which indicate a firm’s contribution to environmental, social, governance and economic activities. Moreover, this study identifies the critical drivers of corporate sustainability by focusing on the levels of market developments and geographical regions.

Based on corporate sustainability data of 2,725 global companies in 2016, this study uses a combination of analytical techniques including cluster analysis, data mining, partial least square path modeling and importance performance map analysis.

This study finds that companies in European developed markets exhibit the highest-ranking of corporate sustainability. In line with the social impact hypothesis, environmental, social and governance performance positively affects economic performance. Moreover, there is strong evidence of causal relationships and synergistic effects among the four pillars of corporate sustainability. In accordance with the institutional theory, the patterns of causal directions and the critical pillars depend on levels of market developments and geographical regions. Overall, social and environmental pillars are among the most critical drivers of corporate sustainability.

The methodology does not aim to provide a new weighting scheme for calculating the corporate sustainability index.

Corporate managers should consider sustainability practices in all dimensions to benefit from synergistic effects among environmental, social, governance and economic activities. Furthermore, corporate sustainability strategies should not be generalized across countries with different levels of market developments and geographical regions.

This study prioritizes environmental, social, governance and economic pillars of corporate sustainability in emerging and developed markets across geographical regions.

Despite their important role for small and medium-sized enterprise (SME) policy reform, the individual scores of the ten categories of business regulations in the World Bank’s Doing Business report are often overshadowed by the equal-weighted overall score and ease of doing business ranking. The purpose of this paper is to examine the causal interrelations between category scores and pinpoint the critical categories for reform.

Based on the latest 2016 Doing Business report, this paper applies the four-stage integrative framework to investigate the causal relationships between category scores and the overall score for business regulations for SMEs. The four-stage analysis includes cluster analysis, data mining, partial least square path modeling, and importance-performance map analysis (IPMA).

The overall score for business regulations is not only influenced by the direct effects of the category scores but also by the indirect effects of the causal interrelations between these scores. The IPMA suggests that policy-makers should examine the priorities of the category scores before making a decision about business regulatory reforms for SMEs. This paper suggests that policy-makers should allocate resources in order of priority – to resolving insolvency, getting credit, trading across borders, registering property, protecting minority investors, paying taxes, enforcing contracts, getting electricity, dealing with construction permits, and, finally, starting a business.

This four-stage methodology is the first attempt to construct a roadmap for business regulatory reforms for SMEs that addresses the problem of equal weighting and subjective causal relationships between category scores.