Ken‐ichiro Mori, Kozo Osakada and Shinji Takaoka
The non‐isothermal filling of a powder/binder mixture in metal injection moulding is simulated by the viscoplastic and the heat conduction finite element methods. Proposes a…
Abstract
The non‐isothermal filling of a powder/binder mixture in metal injection moulding is simulated by the viscoplastic and the heat conduction finite element methods. Proposes a simplified three‐dimensional scheme for the moulding of products with a non‐uniform thickness distribution. The computing time for the simplified three‐dimensional scheme is of the same order as that for two‐dimensional problems. Deals with complex overlapping between the surfaces of the mixture, resulting from the occurrence of jetting during the moulding, by the use of a remeshing scheme. The material flow in metal injection moulding into a rectangular die with a linear thickness distribution is simulated. The jetting behaviour is remarkably influenced by the thickness distribution of the die.