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Article
Publication date: 22 July 2021
Leonid Anatolevich Olenev, Rafina Rafkatovna Zakieva, Nina Nikolaevna Smirnova, Rustem Adamovich Shichiyakh, Kirill Aleksandrovich Ershov and Nisith Geetha
This study aims to present a more accurate lifetime prediction model considering solder chemical composition.
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Abstract
Purpose
This study aims to present a more accurate lifetime prediction model considering solder chemical composition.
Design/methodology/approach
Thermal cycling and standard creep tests as well as finite element simulation were used.
Findings
The study found lower error in the solder joint lifetime evaluation. The higher the Ag content is, the higher the lifetime is achieved.
Originality/value
It is confirmed.
Details
Soldering & Surface Mount Technology, vol. 34 no. 1
Type: Research Article
ISSN: 0954-0911