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Article
Publication date: 21 May 2009

Sutapa Das, Kim Leng Poh and Michael Yit Lin Chew

Besides designing a comprehensive building maintainability scoring system, this paper aims to develop a standard and reliable method for acquisition of tacit knowledge in facility…

1097

Abstract

Purpose

Besides designing a comprehensive building maintainability scoring system, this paper aims to develop a standard and reliable method for acquisition of tacit knowledge in facility management (FM) and convert the same into organizational records so that the current dearth of information and poor feedback leading to recurrent defects and arbitrary FM strategies can be eliminated.

Design/methodology/approach

Nine major building elements in terms of maintainability were compared by analytic hierarchy process (AHP). Various aspects of consistency checking and group decision making were reviewed to find the best suitable method. During data collection via an AHP questionnaire in face‐to‐face interviews, logical reasoning employed by experts was noted and later matched with the subjective data.

Findings

It was observed that technical viability of services and business profile given by building height and location, respectively, set different priorities for major building elements. HVAC system is the prime element followed by elevator and façade. Such priorities can be derived from consistent judgment which improves steadily with a decision‐maker's work experience. A threshold of 10 per cent consistency and aggregating individual priorities (AIP) using geometric mean method of AHP were found most appropriate.

Practical implications

Adaptation of this framework will help industry experts to document their tacit knowledge in a structured manner without facing present constraints. By tracking the recorded facts and logical reasoning, neophytes can learn the multi‐faceted aspects of FM without trial and error.

Originality/value

This research establishes AHP as a standard and reliable method for knowledge acquisition and thus elevates its status from a multi‐criteria decision analysis tool to decision enhancement tool.

Details

Facilities, vol. 27 no. 7/8
Type: Research Article
ISSN: 0263-2772

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Article
Publication date: 25 January 2008

Jochen Wirtz, Loizos Heracleous and Nitin Pangarkar

The purpose of this paper is to explore the nature of Singapore Airline's human resource (HR) management practices that enable the company to deliver consistent service excellence…

21804

Abstract

Purpose

The purpose of this paper is to explore the nature of Singapore Airline's human resource (HR) management practices that enable the company to deliver consistent service excellence in an efficient manner and achieve sustainable competitive advantage.

Design/methodology/approach

The paper presents an in‐depth case study based on primary and secondary data, and especially in‐depth interviews of senior management and senior flight crew.

Findings

The study finds that Singapore Airlines' HR practices involve stringent selection and recruitment processes, extensive training and retraining, successful service delivery teams, empowerment of front‐line staff to control service quality, and motivating staff through rewards and recognition.

Practical implications

This research has implications for organisations that aim to deliver consistent service excellence, by outlining HR practices that assist in this goal; and for senior management, particularly highlighting the importance and contribution of HR to competitive advantage, and the importance of strategic alignment between functional strategies and business‐level strategies.

Originality/value

The paper contributes to the understanding of how HR practices contribute to service excellence and competitive advantage, this being a key dimension of strategic alignment.

Details

Managing Service Quality: An International Journal, vol. 18 no. 1
Type: Research Article
ISSN: 0960-4529

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Article
Publication date: 27 May 2014

Ervina Efzan Mhd Noor and Amares Singh

The aim of the present study was to gather and review all the important properties of the Sn–Ag–Cu (SAC) solder alloy. The SAC solder alloy has been proposed as the alternative…

855

Abstract

Purpose

The aim of the present study was to gather and review all the important properties of the Sn–Ag–Cu (SAC) solder alloy. The SAC solder alloy has been proposed as the alternative solder to overcome the environmental concern of lead (Pb) solder. Many researchers have studied the SAC solder alloy and found that the properties such as melting temperature, wettability, microstructure and interfacial, together with mechanical properties, are better for the SAC solder than the tin – lead (SnPb) solders. Meanwhile, addition of various elements and nanoparticles seems to produce enhancement on the prior bulk solder alloy as well. These benefits suggest that the SAC solder alloy could be the next alternative solder for the electronic packaging industry. Although many studies have been conducted for this particular solder alloy, a compilation of all these properties regarding the SAC solder alloy is still not available for a review to say.

Design/methodology/approach

Soldering is identified as the metallurgical joining method in electronic packaging industry which uses filler metal, or well known as the solder, with a melting point < 425°C (Yoon et al., 2009; Ervina and Marini, 2012). The SAC solder has been developed by many methods and even alloying it with some elements to enhance its properties (Law et al., 2006; Tsao et al., 2010; Wang et al., 2002; Gain et al., 2011). The development toward miniaturization, meanwhile, requires much smaller solder joints and fine-pitch interconnections for microelectronic packaging in electronic devices which demand better solder joint reliability of SAC solder Although many studies have been done based on the SAC solder, a review based on the important characteristics and the fundamental factor involving the SAC solder is still not sufficient. Henceforth, this paper resolves in stating all its important properties based on the SAC solder including its alloying of elements and nanoparticles addition for further understanding.

Findings

Various Pb-free solders have been studied and investigated to overcome the health and environmental concern of the SnPb solder. In terms of the melting temperature, the SAC solder seems to possess a high melting temperature of 227°C than the Pb solder SnPb. Here, the melting temperature of this solder falls within the range of the average reflow temperature in the electronic packaging industry and would not really affect the process of connection. A good amendment here is, this melting temperature can actually be reduced by adding some element such as titanium and zinc. The addition of these elements tends to decrease the melting temperature of the SAC solder alloy to about 3°C. Adding nanoparticles, meanwhile, tend to increase the melting temperature slightly; nonetheless, this increment was not seemed to damage other devices due to the very slight increment and no drastic changes in the solidification temperature. Henceforth, this paper reviews all the properties of the Pb-free SAC solder system by how it is developed from overcoming environmental problem to achieving and sustaining as the viable candidate in the electronic packaging industry. The Pb-free SAC solder can be the alternative to all drawbacks that the traditional SnPb solder possesses and also an upcoming new invention for the future needs. Although many studies have been done in this particular solder, not much information is gathered in a review to give better understanding for SAC solder alloy. In that, this paper reviews and gathers the importance of this SAC solder in the electronic packaging industry and provides information for better knowledge.

Originality/value

This paper resolves in stating of all its important properties based on the SAC solder including its alloying of elements and nanoparticles addition for further understanding.

Details

Soldering & Surface Mount Technology, vol. 26 no. 3
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 17 October 2019

Muhammad Aamir, Riaz Muhammad, Majid Tolouei-Rad, Khaled Giasin and Vadim V. Silberschmidt

The research on lead-free solder alloys has increased in past decades due to awareness of the environmental impact of lead contents in soldering alloys. This has led to the…

527

Abstract

Purpose

The research on lead-free solder alloys has increased in past decades due to awareness of the environmental impact of lead contents in soldering alloys. This has led to the introduction and development of different grades of lead-free solder alloys in the global market. Tin-silver-copper is a lead-free alloy which has been acknowledged by different consortia as a good alternative to conventional tin-lead alloy. The purpose of this paper is to provide comprehensive knowledge about the tin-silver-copper series.

Design/methodology/approach

The approach of this study reviews the microstructure and some other properties of tin-silver-copper series after the addition of indium, titanium, iron, zinc, zirconium, bismuth, nickel, antimony, gallium, aluminium, cerium, lanthanum, yttrium, erbium, praseodymium, neodymium, ytterbium, nanoparticles of nickel, cobalt, silicon carbide, aluminium oxide, zinc oxide, titanium dioxide, cerium oxide, zirconium oxide and titanium diboride, as well as carbon nanotubes, nickel-coated carbon nanotubes, single-walled carbon nanotubes and graphene-nano-sheets.

Findings

The current paper presents a comprehensive review of the tin-silver-copper solder series with possible solutions for improving their microstructure, melting point, mechanical properties and wettability through the addition of different elements/nanoparticles and other materials.

Originality/value

This paper summarises the useful findings of the tin-silver-copper series comprehensively. This information will assist in future work for the design and development of novel lead-free solder alloys.

Details

Soldering & Surface Mount Technology, vol. 32 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Available. Open Access. Open Access
Article
Publication date: 28 February 2024

Luke Mizzi, Arrigo Simonetti and Andrea Spaggiari

The “chiralisation” of Euclidean polygonal tessellations is a novel, recent method which has been used to design new auxetic metamaterials with complex topologies and improved…

1073

Abstract

Purpose

The “chiralisation” of Euclidean polygonal tessellations is a novel, recent method which has been used to design new auxetic metamaterials with complex topologies and improved geometric versatility over traditional chiral honeycombs. This paper aims to design and manufacture chiral honeycombs representative of four distinct classes of 2D Euclidean tessellations with hexagonal rotational symmetry using fused-deposition additive manufacturing and experimentally analysed the mechanical properties and failure modes of these metamaterials.

Design/methodology/approach

Finite Element simulations were also used to study the high-strain compressive performance of these systems under both periodic boundary conditions and realistic, finite conditions. Experimental uniaxial compressive loading tests were applied to additively manufactured prototypes and digital image correlation was used to measure the Poisson’s ratio and analyse the deformation behaviour of these systems.

Findings

The results obtained demonstrate that these systems have the ability to exhibit a wide range of Poisson’s ratios (positive, quasi-zero and negative values) and stiffnesses as well as unusual failure modes characterised by a sequential layer-by-layer collapse of specific, non-adjacent ligaments. These findings provide useful insights on the mechanical properties and deformation behaviours of this new class of metamaterials and indicate that these chiral honeycombs could potentially possess anomalous characteristics which are not commonly found in traditional chiral metamaterials based on regular monohedral tilings.

Originality/value

To the best of the authors’ knowledge, the authors have analysed for the first time the high strain behaviour and failure modes of chiral metamaterials based on Euclidean multi-polygonal tessellations.

Details

Rapid Prototyping Journal, vol. 30 no. 11
Type: Research Article
ISSN: 1355-2546

Keywords

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Article
Publication date: 2 January 2023

Mustafa S. Al-Khazraji, S.H. Bakhy and M.J. Jweeg

The purpose of this review paper is to provide a review of the most recent advances in the field of manufacturing composite sandwich panels along with their advantages and…

654

Abstract

Purpose

The purpose of this review paper is to provide a review of the most recent advances in the field of manufacturing composite sandwich panels along with their advantages and limitations. The other purpose of this paper is to familiarize the researchers with the available developments in manufacturing sandwich structures.

Design/methodology/approach

The most recent research articles in the field of manufacturing various composite sandwich structures were reviewed. The review process started by categorizing the available sandwich manufacturing techniques into nine main categories according to the method of production and the equipment used. The review is followed by outlining some automatic production concepts toward composite sandwich automated manufacturing. A brief summary of the sandwich manufacturing techniques is given at the end of this article, with recommendations for future work.

Findings

It has been found that several composite sandwich manufacturing techniques were proposed in the literature. The diversity of the manufacturing techniques arises from the variety of the materials as well as the configurations of the final product. Additive manufacturing techniques represent the most recent trend in composite sandwich manufacturing.

Originality/value

This work is valuable for all researchers in the field of composite sandwich structures to keep up with the most recent advancements in this field. Furthermore, this review paper can be considered as a guideline for researchers who are intended to perform further research on composite sandwich structures.

Details

Journal of Engineering, Design and Technology , vol. 22 no. 5
Type: Research Article
ISSN: 1726-0531

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Article
Publication date: 4 November 2020

Sousana K. Papadopoulou, Maria Mantzorou, Desspina Koutridou, Elias Tassoulas, Styliani Sakellaropoulou, Fani Biskanaki, Efthymis Xatziapostolou and Dimitrios Papandreou

The purpose of this paper is to critically summarize the current data concerning the impact of obesity and micronutrient adequacy and supplementation on the risk and severity of…

341

Abstract

Purpose

The purpose of this paper is to critically summarize the current data concerning the impact of obesity and micronutrient adequacy and supplementation on the risk and severity of COVID-19 disease, and their potential impact on treatment and rehabilitation.

Design/methodology/approach

PubMed, Scopus and Google Scholar databases were thoroughly searched to identify studies concerning obesity and nutritional status, vitamin and other micronutrients adequacy with COVID-19 severity.

Findings

Individuals with higher body mass index are in greater risk of severe disease and need for mechanical ventilation. Concerning micronutrient adequacy, no published studies at the present time have evaluated the effect of supplementation on the risk and the treatment of the novel disease.

Originality/value

Recently, COVID-19 has monopolized the interest of the medical community regarding diet and nutritional status and it possibly plays an important role in disease severity.

Details

Nutrition & Food Science , vol. 51 no. 5
Type: Research Article
ISSN: 0034-6659

Keywords

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