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This study aims to minimize the pressure drop across wavy microchannels using secondary branches without compromising its capacity to transfer the heat. The impact of secondary flows on the pressure drop and heat transfer capabilities at different Reynolds numbers are investigated numerically for different wavy microchannels. Finally, different channels are evaluated using performance evaluation criteria to determine their effectiveness.

To investigate the flow and heat transfer capabilities in wavy microchannels having secondary branches, a 3D conjugate heat transfer model based on finite volume method is used. In conventional wavy microchannel, secondary branches are introduced at crest and trough locations. For the numerical simulation, a single symmetrical channel is used to minimize computational time and resources and the flow within the channels remains single-phase and laminar.

The findings indicate that the suggested secondary channels notably improve heat transfer and decrease pressure drop within the channels. At lower flow rates, the secondary channels demonstrate superior performance in terms of heat transfer. However, the performance declines as the flow rate increased. With the same amplitude and wavelength, the introduction of secondary channels reduces the pressure drop compared with conventional wavy channels. Due to the presence of secondary channels, the flow splits from the main channel, and part of the core flow gets diverted into the secondary channel as the flow takes the path of minimum resistance. Due to this flow split, the core velocity is reduced. An increase in flow area helps in reducing pressure drop.

Many complex and intricate microchannels are proposed by the researchers to augment heat dissipation. There are challenges in the fabrication of microchannels, such as surface finish and achieving the required dimensions. However, due to the recent developments in metal additive manufacturing and microfabrication techniques, the complex shapes proposed in this paper are feasible to fabricate.

Wavy channels are widely used in heat transfer and micro-fluidics applications. The proposed wavy microchannels with secondary channels are different when compared to conventional wavy channels and can be used practically to solve thermal challenges. They help achieve a lower pressure drop in wavy microchannels without compromising heat transfer performance.

The purpose of this paper is to study the flow and heat transfer characteristics of microchannel heatsinks with ribs, cavities and secondary channels. The influence of length and width of the ribs on heat transfer enhancement, secondary flows, flow distribution and temperature distribution are examined at different Reynolds numbers. The effectiveness of each heatsink is evaluated using the performance factor.

A three-dimensional solid-fluid conjugate heat transfer numerical model is used to study the flow and heat transfer characteristics in microchannels. One symmetrical channel is adopted for the simulation to reduce the computational cost and time. Flow inside the channels is assumed to be single-phase and laminar. The governing equations are solved using finite volume method.

The numerical results are analyzed in terms of average Nusselt number ratio, average base temperature, friction factor ratio, pressure variation inside the channel, temperature distribution, velocity distribution inside the channel, mass flow rate distribution inside the secondary channels and performance factor of each microchannels. Results indicate that impact of rib width is higher in enhancing the heat transfer when compared with its length but with a penalty on the pressure drop. The combined effects of secondary channels, ribs and cavities helps to lower the temperature of the microchannel heat sink and enhances the heat transfer rate.

The fabrication of microchannels are complex, but recent advancements in the additive manufacturing techniques makes the fabrication of the design considered in this numerical study feasible.

The proposed microchannel heatsink can be used in practical applications to reduce the thermal resistance, and it augments the heat transfer rate when compared with the baseline design.